JPS62109393A - Manufacture of electric circuit substrate - Google Patents
Manufacture of electric circuit substrateInfo
- Publication number
- JPS62109393A JPS62109393A JP24797285A JP24797285A JPS62109393A JP S62109393 A JPS62109393 A JP S62109393A JP 24797285 A JP24797285 A JP 24797285A JP 24797285 A JP24797285 A JP 24797285A JP S62109393 A JPS62109393 A JP S62109393A
- Authority
- JP
- Japan
- Prior art keywords
- electric circuit
- circuit pattern
- substrate
- photocatalyst
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、光触媒を利用して絶縁性基板上に電気回路
のパターンを形成する電気回路基板製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of manufacturing an electric circuit board in which an electric circuit pattern is formed on an insulating substrate using a photocatalyst.
従来の電気回路基板製造方法は、絶縁性のポリエステル
基板（又は箔）Ｋ金属箔を接着剤を用いて接着し、その
金属箔上に電気回路パターンのマスクを施こすために印
刷技術を用いて印刷し、印刷したマスク部分以外の不要
な金属箔を酸化第２鉄溶液を用いてエツチングすること
により取り除き、この後上述のマスクを取り除いて電気
回路基板を製造していた。The conventional method for manufacturing electric circuit boards involves bonding an insulating polyester substrate (or foil) with a metal foil using an adhesive, and using printing technology to mask an electric circuit pattern on the metal foil. An electric circuit board was manufactured by printing, removing unnecessary metal foil other than the printed mask portion by etching using a ferric oxide solution, and then removing the above-mentioned mask.
しかしながら、このような従来の電気回路基板製造方法
にあっては、エツチング等の化学処理の工程がらるため
生産性が悪く、シかも排液処理に手間金要するものとな
っていたため、化学処理の管理に工数を要しているとい
う問題点があった。However, such conventional electric circuit board manufacturing methods have poor productivity because they involve chemical treatment steps such as etching, and require time and effort to treat wastewater. There was a problem that management required man-hours.
この発明は、このような従来の問題点に着目してなされ
たもので、絶縁性基板の上に半導体材料からなる光触媒
を用いて電気回路パターンを形成した後、金属イオン溶
液例えば白金イオン溶液に浸し、紫外線光を照射するだ
けの作業をすることにより、上記問題点を解決すること
を目的としている。This invention was made by focusing on such conventional problems, and after forming an electric circuit pattern on an insulating substrate using a photocatalyst made of a semiconductor material, it is coated with a metal ion solution such as a platinum ion solution. The aim is to solve the above problems by simply soaking the material and irradiating it with ultraviolet light.
この発明はかかる目的を達成するために、絶縁性基板の
表面に半導体微粉末等からなる光触媒を回路パターン状
に印刷又は蒸着形成し、そののちその基板を金属イオン
浴液中に浸しながらその光触媒に光エネルギーを付与す
ることにより、その回路パターン状に形成された光触媒
表面に＠紀金属イオン溶液に溶け込んでいる金属を析出
せしめて電気回路パターンを形成するものである。In order to achieve such an object, the present invention prints or evaporates a photocatalyst made of semiconductor fine powder on the surface of an insulating substrate in a circuit pattern, and then immerses the substrate in a metal ion bath solution while applying the photocatalyst. By applying light energy to the photocatalyst, the metal dissolved in the metal ion solution is deposited on the surface of the photocatalyst formed in the form of a circuit pattern, thereby forming an electric circuit pattern.
以下この発明の一実施例を図面に基づいて説明する。 An embodiment of the present invention will be described below based on the drawings.
第１図ないし第３図はこの発明の一実施例を示す図であ
る。図において、１は絶縁性、化学的耐食性のある基板
（例えばセラミック基板）、２は光触媒としての半導体
微粉末２Ａ（但し第１図および第２図には不図示）にバ
インダを加えて製造したインクを基板１上にスクリーン
印刷によって塗布した電気回路パターン、３は上述の基
板１と電気回路パターン２からなるパターン形成基板で
ある。４は金属例えば白金（ｐｉ ）等をイオン化した
イオン溶液５を収容した容器、６はベルトコンベアでア
リ、イオン溶液５中でパターン形成基板３を図示矢印の
方向に搬送する。７はベルトコンベア６の搬送経路上に
設けられた紫外線光源としてのキセノンランプである。1 to 3 are diagrams showing one embodiment of the present invention. In the figure, 1 is an insulating and chemically resistant substrate (e.g., a ceramic substrate), and 2 is a substrate manufactured by adding a binder to semiconductor fine powder 2A (not shown in Figures 1 and 2) as a photocatalyst. An electric circuit pattern is formed by applying ink onto the substrate 1 by screen printing, and 3 is a pattern-formed substrate consisting of the above-described substrate 1 and electric circuit pattern 2. 4 is a container containing an ionic solution 5 in which a metal such as platinum (pi) is ionized, and 6 is a belt conveyor which conveys the patterned substrate 3 in the ionic solution 5 in the direction of the arrow in the figure. 7 is a xenon lamp provided on the conveyance path of the belt conveyor 6 as an ultraviolet light source.
白金を電極として担持し、かつ直径が１万分の１富鳳位
の極めて微細な粉末状の酸化チタン等の光触媒としての
半導体材料２Ａ’ｔステアリ、ン酸等のバインダによっ
てインク状にして、基板１上にスクリーン印刷によって
血布して電気回路ノくターン２を作成して後、適当な温
度で焼成する。すると第１図に示したようなパターン形
成基板３が形成される。このパターン形成基板３は、キ
セノンランプ７下でその電気回路ノくターン２がキセノ
ンランプ７により光照射されるように電気回路・くター
フ２を上側に向けてベルトコンベア６上に次々と載置す
れる。ベルトコンベア６の図示矢印方向の搬送によりパ
ターン形成基板３は、次々とキセノンランプ７下に搬送
される。キセノンラング７の光照射により、白金イオン
（Ｐｔ）を含むイオン浴液５中で電気回路パターン２の
紫外線照射が行なわれる。すると第３図に示したように
電気回路パターン２中の半導体材料２人へのキセノンラ
ンプ７からの紫外線照射によって、半導体材料２人の価
電子帯の電子が励起されて伝導帯に移り、さらにその電
子が白金イオン（Ｐｔ）’に含むイオン溶液５中に飛び
出し、白金イオン（ｐｔ ）と結合し、白金（Ｐｔ）
を半導体材料２人の表面上に析出させる。これによって
、電気回路パターン２の表面が白金（ｐＨの薄膜によっ
て覆われる。従ってこの電気回路パターン２に従った金
属薄膜が基板１上に形成され、電気回路基板として使用
することが可能となる。Semiconductor material as a photocatalyst, such as extremely fine powdered titanium oxide with a diameter of about 1/10,000, supporting platinum as an electrode, is made into an ink with a binder such as stearic acid, After forming the electrical circuit turn 2 by screen printing blood on the 1, it is fired at an appropriate temperature. Then, a patterned substrate 3 as shown in FIG. 1 is formed. The pattern-formed substrates 3 are placed one after another on the belt conveyor 6 with the electric circuit turns 2 facing upward so that the electric circuit turns 2 are irradiated with light by the xenon lamp 7. I can pass. The pattern-formed substrates 3 are conveyed one after another under the xenon lamp 7 by the conveyance of the belt conveyor 6 in the direction of the arrow shown in the figure. By the light irradiation of the xenon rung 7, the electric circuit pattern 2 is irradiated with ultraviolet rays in the ion bath liquid 5 containing platinum ions (Pt). Then, as shown in FIG. 3, the two semiconductor materials in the electric circuit pattern 2 are irradiated with ultraviolet light from the xenon lamp 7, and the electrons in the valence band of the two semiconductor materials are excited and transferred to the conduction band. The electrons jump out into the ionic solution 5 containing platinum ions (Pt)', combine with platinum ions (pt), and form platinum (Pt).
is deposited on the surfaces of two semiconductor materials. As a result, the surface of the electric circuit pattern 2 is covered with a thin film of platinum (pH). Therefore, a metal thin film conforming to the electric circuit pattern 2 is formed on the substrate 1, and it becomes possible to use it as an electric circuit board.
なお、上記実施例においてイオン溶液５としては、白金
イオン溶液の場合について述べたが、その代りに銅、金
、スズ、ニッケル等いずれかの金属のイオン溶液を用い
てもよい。In the above embodiment, a platinum ion solution was used as the ionic solution 5, but an ion solution of any metal such as copper, gold, tin, or nickel may be used instead.
また電気回路パターン２を半導体材料の蒸着に′ よ
って形成してもよいことは勿論である。Of course, the electric circuit pattern 2 may also be formed by vapor deposition of a semiconductor material.
以上説明してきたように、この発明によれば、その製造
方法を絶縁性基板の上に半導体材料等の電気回路パター
ンを形成し、金属イオン溶液中で紫外線照射するだけで
金属イオン浴液中の金属イオンを上記パターン上に析出
させるだけとしたため、金属イオン溶液の濃度管理だけ
ですみ、化学処理の管理がいらなくなり、作業も単［に
なって工数がかからなくなり電気回路基板を廉価とし、
作業現場も清潔でしかもスペースを余りとらなくするこ
とができるという効果が得られる。As explained above, according to the present invention, the manufacturing method involves forming an electric circuit pattern of semiconductor material or the like on an insulating substrate, and simply irradiating it with ultraviolet rays in a metal ion solution. Since the metal ions are simply deposited on the pattern, it is only necessary to control the concentration of the metal ion solution, eliminating the need for chemical treatment management, making the work simple, reducing the number of man-hours, and making the electric circuit board cheaper.
The effect is that the work site is clean and does not take up much space.
第１図はこの発明に用いるパターン形成基板の斜視図、
第２図はこの発明の一実施例を説明するための装置の断
面簡略図、第３図はこの発明の詳細な説明するための説
明図である。
図中、１は絶縁性基板、２は電気回路パターン、３ｉｌ
−ｔパターン形成基板、５はイオン溶液、６はベルトコ
ンベア、７はキセノンランプ。
なお、図中、同一符号は同一、−または相当部分を示す
。FIG. 1 is a perspective view of a patterned substrate used in this invention;
FIG. 2 is a simplified sectional view of an apparatus for explaining an embodiment of the present invention, and FIG. 3 is an explanatory diagram for explaining the invention in detail. In the figure, 1 is an insulating substrate, 2 is an electric circuit pattern, and 3il
-t pattern forming substrate, 5 is an ionic solution, 6 is a belt conveyor, and 7 is a xenon lamp. In addition, in the figures, the same reference numerals indicate the same, -, or corresponding parts.
Claims (1)
媒を回路パターン状に印刷又は蒸着形成し、そののちそ
の基板（１）を金属イオン溶液（５）中に浸しながらそ
の光触媒に光エネルギーを付与することにより、その回
路パターン状に形成された光触媒表面に前記金属イオン
溶液（５）に溶け込んでいる金属を析出せしめて電気回
路パターンを形成してなることを特徴とする電気回路基
板製造方法。A photocatalyst made of semiconductor fine powder or the like is printed or vapor-deposited in a circuit pattern on the surface of an insulating substrate (1), and then light energy is applied to the photocatalyst while immersing the substrate (1) in a metal ion solution (5). An electric circuit board manufacturing method characterized in that an electric circuit pattern is formed by depositing the metal dissolved in the metal ion solution (5) on the photocatalyst surface formed in the circuit pattern shape by applying Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24797285A JPS62109393A (en) | 1985-11-07 | 1985-11-07 | Manufacture of electric circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24797285A JPS62109393A (en) | 1985-11-07 | 1985-11-07 | Manufacture of electric circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62109393A true JPS62109393A (en) | 1987-05-20 |
Family
ID=17171289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24797285A Pending JPS62109393A (en) | 1985-11-07 | 1985-11-07 | Manufacture of electric circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62109393A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04135272U (en) * | 1991-06-03 | 1992-12-16 | ジユーキ株式会社 | Label feeding device for label sewing machine |
| US5260108A (en) * | 1992-03-10 | 1993-11-09 | International Business Machines Corporation | Selective seeding of Pd by excimer laser radiation through the liquid |
| JP2006515388A (en) * | 2003-01-03 | 2006-05-25 | セミカ エス アー | Viscosity-adjustable photosensitive dispersion for metal deposition on insulating substrates and use thereof |
| JP2008004586A (en) * | 2006-06-20 | 2008-01-10 | Mitsubishi Plastics Ind Ltd | Method of forming conductive circuit pattern |
| JP2009001897A (en) * | 2007-05-08 | 2009-01-08 | Interuniv Micro Electronica Centrum Vzw | Bipolar electroless processing method |
-
1985
- 1985-11-07 JP JP24797285A patent/JPS62109393A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04135272U (en) * | 1991-06-03 | 1992-12-16 | ジユーキ株式会社 | Label feeding device for label sewing machine |
| US5260108A (en) * | 1992-03-10 | 1993-11-09 | International Business Machines Corporation | Selective seeding of Pd by excimer laser radiation through the liquid |
| JP2006515388A (en) * | 2003-01-03 | 2006-05-25 | セミカ エス アー | Viscosity-adjustable photosensitive dispersion for metal deposition on insulating substrates and use thereof |
| US7731786B2 (en) | 2003-01-03 | 2010-06-08 | Semika | Photosensitive dispersion with adjustable viscosity for the deposition of metal on an insulating substrate and use thereof |
| JP2008004586A (en) * | 2006-06-20 | 2008-01-10 | Mitsubishi Plastics Ind Ltd | Method of forming conductive circuit pattern |
| JP2009001897A (en) * | 2007-05-08 | 2009-01-08 | Interuniv Micro Electronica Centrum Vzw | Bipolar electroless processing method |
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