JPS62103266U - - Google Patents
Info
- Publication number
- JPS62103266U JPS62103266U JP1985195330U JP19533085U JPS62103266U JP S62103266 U JPS62103266 U JP S62103266U JP 1985195330 U JP1985195330 U JP 1985195330U JP 19533085 U JP19533085 U JP 19533085U JP S62103266 U JPS62103266 U JP S62103266U
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- ceramic support
- area
- semiconductor
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Structure Of Printed Boards (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例の半導体装置に用い
るセラミツク支持板を示し、ａは平面図、ｂは側
面図、第２図は組立後の半導体装置の要部の側面
図、第３図は別の実施例に用いるセラミツク支持
板を示し、ａは平面図、ｂは側面図である。 １：セラミツク支持板、２：金属層パターン、
３：Ｖ形溝、４：金属基板、６：はんだ、７：半
導体チツプ、８：穴。
るセラミツク支持板を示し、ａは平面図、ｂは側
面図、第２図は組立後の半導体装置の要部の側面
図、第３図は別の実施例に用いるセラミツク支持
板を示し、ａは平面図、ｂは側面図である。 １：セラミツク支持板、２：金属層パターン、
３：Ｖ形溝、４：金属基板、６：はんだ、７：半
導体チツプ、８：穴。
Claims (1)
- 金属基板の一面に固着されたセラミツク支持板
上に複数の半導体チツプが搭載されたものにおい
て、セラミツク支持板が各半導体チツプが搭載さ
れる領域以外の部分に機械的に弱い部分を有する
ことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985195330U JPS62103266U (ja) | 1985-12-19 | 1985-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985195330U JPS62103266U (ja) | 1985-12-19 | 1985-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62103266U true JPS62103266U (ja) | 1987-07-01 |
Family
ID=31153122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985195330U Pending JPS62103266U (ja) | 1985-12-19 | 1985-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62103266U (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268158A (ja) * | 1988-04-20 | 1989-10-25 | Mitsubishi Electric Corp | 半導体装置用セラミックス基板とこのセラミックス基板を備えた半導体装置 |
| JPH03145748A (ja) * | 1989-10-31 | 1991-06-20 | Narumi China Corp | セラミックス回路基板 |
| JPH0566999U (ja) * | 1992-02-21 | 1993-09-03 | 昭和電工株式会社 | 回路用基板 |
| JP2015015275A (ja) * | 2013-07-03 | 2015-01-22 | 三菱電機株式会社 | セラミック回路基板、放熱器付セラミック回路基板、及びセラミック回路基板の製造方法 |
-
1985
- 1985-12-19 JP JP1985195330U patent/JPS62103266U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268158A (ja) * | 1988-04-20 | 1989-10-25 | Mitsubishi Electric Corp | 半導体装置用セラミックス基板とこのセラミックス基板を備えた半導体装置 |
| JPH03145748A (ja) * | 1989-10-31 | 1991-06-20 | Narumi China Corp | セラミックス回路基板 |
| JPH0566999U (ja) * | 1992-02-21 | 1993-09-03 | 昭和電工株式会社 | 回路用基板 |
| JP2015015275A (ja) * | 2013-07-03 | 2015-01-22 | 三菱電機株式会社 | セラミック回路基板、放熱器付セラミック回路基板、及びセラミック回路基板の製造方法 |