JPS62101659U - - Google Patents
Info
- Publication number
- JPS62101659U JPS62101659U JP19399585U JP19399585U JPS62101659U JP S62101659 U JPS62101659 U JP S62101659U JP 19399585 U JP19399585 U JP 19399585U JP 19399585 U JP19399585 U JP 19399585U JP S62101659 U JPS62101659 U JP S62101659U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- solder
- parts
- printed circuit
- adhere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000005192 partition Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 4
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図および第2図は本考案の第一の実施例を
示し、第1図は一部省略した斜視図、第2図は一
部省略した断面図、第3図および第4図は本考案
の他の実施例を示す一部省略した断面図、第5図
および第6図は従来例を示し、第5図は一部省略
した斜視図、第6図は一部省略した断面図である
。
6…プリント基板、6a…半田を必要とする部
分、6b…半田が付着してはならない部分、7…
プリント基板保持具、8…半田槽、9…半田、9
a…半田表面、10…仕切板、10a…半田仕切
部分、10b…仕切対向部分、12…ガイド棒。
1 and 2 show a first embodiment of the present invention, FIG. 1 is a partially omitted perspective view, FIG. 2 is a partially omitted sectional view, and FIGS. 3 and 4 are the main parts. FIGS. 5 and 6 are partially omitted sectional views showing other embodiments of the invention; FIGS. 5 and 6 are partially omitted sectional views; FIG. 5 is a partially omitted perspective view; and FIG. 6 is a partially omitted sectional view. be. 6... Printed circuit board, 6a... Parts requiring solder, 6b... Parts to which solder should not be attached, 7...
Printed circuit board holder, 8...Solder tank, 9...Solder, 9
a... Solder surface, 10... Partition plate, 10a... Solder partition part, 10b... Partition opposing part, 12... Guide rod.
Claims (1)
ネクター等の半田が付着してはならない部分を有
するプリント基板等に使用する半田付装置におい
て、半田付を必要とする電子部品装着部分と半田
が付着してはならない部分とを仕切るための仕切
板をプリント基板の所望形状に合せて可動可能に
設けたことを特徴とする半田付装置。 In soldering equipment used for printed circuit boards, etc., which have electronic component mounting parts that require soldering and parts such as end-face connectors where solder should not adhere, solder may adhere to the electronic component mounting parts that require soldering. A soldering device characterized in that a partition plate is movably provided to separate parts that should not be soldered, according to a desired shape of a printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19399585U JPS62101659U (en) | 1985-12-17 | 1985-12-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19399585U JPS62101659U (en) | 1985-12-17 | 1985-12-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62101659U true JPS62101659U (en) | 1987-06-29 |
Family
ID=31150545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19399585U Pending JPS62101659U (en) | 1985-12-17 | 1985-12-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62101659U (en) |
-
1985
- 1985-12-17 JP JP19399585U patent/JPS62101659U/ja active Pending
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