JPS62101241U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す側面図、第２
図ａは第１図における固体撮像素子の斜視図、同
図ｂは同図ａにおける側面図、第３図は本考案に
おける他の実施例の固体撮像素子を示す斜視図、
第４図は従来例を示す側面図、第５図ａは第４図
における固体撮像素子の斜視図、同図ｂは同図ａ
の側面図である。 １，８は固体撮像素子、２はパツケージ、３は
受光部、４ａ，４ｂ，４ｃは端子、５は表面側の
基板、６は裏面側の基板、５ａは開口部、７は撮
像レンズである。 Figure 1 is a side view showing one embodiment of the present invention;
Figure a is a perspective view of the solid-state image sensor in Figure 1, Figure b is a side view in Figure A, and Figure 3 is a perspective view showing a solid-state image sensor according to another embodiment of the present invention.
FIG. 4 is a side view showing a conventional example, FIG. 5 a is a perspective view of the solid-state image sensor in FIG. 4, and FIG.
FIG. 1 and 8 are solid-state image sensors, 2 is a package, 3 is a light receiving section, 4a, 4b, and 4c are terminals, 5 is a front board, 6 is a back board, 5a is an opening, and 7 is an imaging lens. .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の面側に受光部を有し、この受光部を有す
る表面側及び裏面側に複数の端子を突設して成る
固体撮像素子を、上記裏面側端子の位置に対応さ
せて端子貫通孔が形成された裏面側基板と、表面
側端子及び受光部の位置に対応させて端子貫通孔
及び開口部が形成された表面側基板とにより、上
記各端子をこれと対応する端子貫通孔に挿通して
挾持したことを特徴とする固体撮像装置。 A solid-state image sensor has a light-receiving section on one side and a plurality of terminals protruding from the front side and the back side where the light-receiving section has the light-receiving section. The formed back side substrate and the front side substrate in which terminal through holes and openings are formed corresponding to the positions of the front side terminals and the light receiving section allow each of the above-mentioned terminals to be inserted into the corresponding terminal through holes. A solid-state imaging device characterized in that the device is held between the legs.