JPS6199863A - Ultrasonic inspecting device - Google Patents
Ultrasonic inspecting deviceInfo
- Publication number
- JPS6199863A JPS6199863A JP59202379A JP20237984A JPS6199863A JP S6199863 A JPS6199863 A JP S6199863A JP 59202379 A JP59202379 A JP 59202379A JP 20237984 A JP20237984 A JP 20237984A JP S6199863 A JPS6199863 A JP S6199863A
- Authority
- JP
- Japan
- Prior art keywords
- reflected
- sensor
- defect
- scanning
- positions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
- G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
- G01N29/4427—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with stored values, e.g. threshold values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0609—Display arrangements, e.g. colour displays
- G01N29/0618—Display arrangements, e.g. colour displays synchronised with scanning, e.g. in real-time
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/265—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
Landscapes
- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、製品の欠陥検査を行なうだめの超音波検査装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an ultrasonic inspection apparatus for inspecting products for defects.
（従来の技術）
非破壊検査の一つの方法として、超音波を利用するもの
がある。これは、被検材（上記した製品をいう。以下同
じ）に超音波を送信し、その反射エコーの状態を判別す
ることにより、被検材の良否判定を行なうのである。(Prior Art) One method of non-destructive testing uses ultrasonic waves. This is to determine the quality of the test material by transmitting ultrasonic waves to the test material (referring to the above-mentioned products; the same applies hereinafter) and determining the state of the reflected echo.
従来における超音波検査装置は、被検材の検査部位に、
超音波を送信し反射波を受信するセンサを走査し、その
反射波が被検材の正常な部分と欠陥部分とで異なること
を把え１反射波のレベルがちらふじめ設定されたしきい
値を越えるか否かで被検材の良否判断を行ない、あるい
は全走査範囲に対するしきい値を越えた範囲の割合で良
否判定を行なっていた。Conventional ultrasonic inspection equipment uses a
A sensor that transmits ultrasonic waves and receives reflected waves is scanned, and by understanding that the reflected waves differ between normal parts and defective parts of the material to be inspected, the level of the reflected waves is set at a threshold. The quality of the test material is determined based on whether it exceeds a threshold value or the ratio of the range that exceeds a threshold value to the entire scanning range.
（発明が解決しようとする間譲点）
上記したような従来の良否判定方法では、欠陥の有無は
正確に判定し得ても、その程度（有害度）、すなわち、
欠陥の位置と大きさがｉＥ確に捕捉できないために、完
全な検査を望む場合には、いま一つ改良の余地があった
。本発明はこの点を改良するものである。(Considerations to be solved by the invention) In the conventional pass/fail determination method as described above, even if the presence or absence of a defect can be accurately determined, the extent of the defect (degree of harmfulness),
Since the location and size of defects cannot be accurately captured by iE, there is still room for improvement if complete inspection is desired. The present invention improves this point.
（問題点を解決するための手段）
本発明は上記問題点を解決するための手段として、超音
波検査装置の構成を、被検材に対して超音波を送信し、
被検材からの反射波を受信するセンサと、該センサを被
検材上の一次元または二次元平面上に一定間隔で移動さ
せる走査装置と、前記センサに超音波信号を与えると共
に反射波を受信する超音波探傷器と、該超音波探傷器の
出力信号をデジタル信号化するアナログ・デジタル変換
装置と、該アナログ・デジタル変換装置から受けた信号
を一時記憶すると共にこれを演算、処理して前記被検材
の良否およびその程度を判断するコンピュータと、を具
備するものとしたことである。(Means for Solving the Problems) As a means for solving the above-mentioned problems, the present invention has a configuration of an ultrasonic inspection apparatus that transmits ultrasonic waves to a material to be inspected.
A sensor that receives reflected waves from a material to be inspected; a scanning device that moves the sensor at regular intervals on a one-dimensional or two-dimensional plane on the material to be inspected; A receiving ultrasonic flaw detector, an analog-to-digital converter for converting the output signal of the ultrasonic flaw detector into a digital signal, and temporarily storing the signal received from the analog-to-digital converter and calculating and processing it. The present invention further includes a computer that determines the quality and quality of the test material.
（作用）
このように構成すれば、一定間隔で得られる探傷データ
をあらかじめ設定したしきい値を越え、かつ、データの
取込み位置が隣接するか否かによシ同一の欠陥に起因す
る探傷データ群を分類することができ、また探傷データ
中のピーク値のデータ取込み位置を演算し、ピーク値の
距離により同一の欠陥に起因する探傷データ群に分類し
、欠陥毎に有害度を評価することが可能となる。(Function) With this configuration, the flaw detection data obtained at regular intervals can exceed a preset threshold, and the flaw detection data caused by the same defect can be detected regardless of whether the data acquisition positions are adjacent to each other. It is possible to classify groups, and also calculate the data acquisition position of the peak value in the flaw detection data, classify it into flaw detection data groups caused by the same defect according to the distance of the peak value, and evaluate the degree of toxicity for each defect. becomes possible.
さらに上記欠陥有害度の評価値としては、■同一欠陥に
起因する探傷データ群中の最大値を用いる。■同一欠陥
に起因する探傷データ群をセンサの走査順序、たとえば
−次元、二次元平面上の走査において、まず−次元平面
の始点から終点までを走査し１次に二次元平面を一定間
隔走査した後、再び一次元平面の走査を繰返す。Furthermore, as the evaluation value of the degree of harmfulness of the defect, (1) the maximum value in a group of flaw detection data caused by the same defect is used. ■The scanning order of the sensor for a group of flaw detection data caused by the same defect, for example, when scanning on a -dimensional or two-dimensional plane, first the -dimensional plane was scanned from the start point to the end point, and then the two-dimensional plane was scanned at regular intervals. After that, the one-dimensional plane is scanned again.
そして探傷データを取込む場合は、−次元平面の走査線
ごとにピーク値りを演算し、各走査線ごとのピーク値（
ｈｌ＋ｈ２１ｈ３）の総和を用いる（第２図参照）。以
上■、■のいずれかの方法によシ、欠陥ごとの評価値を
演算し、その結果によシ、被検材の良否判定を行なうこ
とができる。When importing flaw detection data, calculate the peak value for each scanning line on the -dimensional plane, and calculate the peak value for each scanning line (
hl+h21h3) (see Figure 2). The evaluation value for each defect is calculated by either method (1) or (2) above, and the quality of the test material can be determined based on the results.
（実施例）
次に１本発明の一実施例を第１図について説明すると、
１は被検材であシ％２は被検材１の上方に位置するセン
サである。センサ２は走査装置３により被検材ｌの上方
一定高さを保持しつつ１図中にａ、ｂで示すように一次
元および二次元の平面のいずれか一方を、あるいは両方
を、走査するよりになっている。そして走査中に被検材
１に向けて超音波を送信し、反射波を受信するようにな
っている。超音波の送信と反射波の受信は超音波探傷器
４によって行なわれ、走査装置の制御は制御装置５によ
って行なわれるように接続される。そして超音波探傷器
４と制御装置５の出力側はアナログ［相］′デジタル変
換装置６１ｒ介してコンピュータ７に接続されている。(Example) Next, an example of the present invention will be explained with reference to FIG.
1 is the material to be tested, and %2 is a sensor located above the material 1 to be tested. The sensor 2 uses a scanning device 3 to scan one or both of the one-dimensional and two-dimensional planes as shown by a and b in Fig. 1 while maintaining a constant height above the specimen l. It's getting better. During scanning, ultrasonic waves are transmitted toward the material 1 to be inspected, and reflected waves are received. Transmission of ultrasonic waves and reception of reflected waves are performed by an ultrasonic flaw detector 4, and the scanning device is controlled by a control device 5. The output sides of the ultrasonic flaw detector 4 and the control device 5 are connected to the computer 7 via an analog [phase]' digital converter 61r.
このような構成の本発明に係る超音波検査装置は次のよ
うに使用はれる。被検材ｌに、走査によシ被検材１から
反射されるエコー信号を取込む位置を符号８で示すよう
に直線状に、かつ平行に多数設けておき、センサ２を、
この取込位置８に沿って走査するようにする。センサ２
がこのように走査すると、コンピュータ７は制御装置５
からの位置信号によシ取込位置８における反射エコー信
号を、アナログ・デジタル変換装置６を介して受け、こ
れをあらかじめ設定されたしきい値と比較することにな
る。The ultrasonic inspection apparatus according to the present invention having such a configuration is used as follows. A large number of positions for capturing echo signals reflected from the test material 1 during scanning are provided in a straight line and in parallel on the test material 1 as shown by reference numeral 8, and the sensor 2 is
Scanning is performed along this capture position 8. sensor 2
When the computer 7 scans in this way, the control device 5
A reflected echo signal at the capture position 8 is received via the analog-to-digital converter 6 and compared with a preset threshold value.
第２図はこのようにして取ったデータを示すものである
。この図に示すように、取込位置８を５本の巌に沿って
各複数個設定し、その強度Ｈを各−で示すと％第１図に
符号９で示す位置に欠陥があったとした場合、これが中
央３個所のピークｈｌ＊ｈｌｌ！ｓｈ３として表われる
ことになる。FIG. 2 shows the data collected in this way. As shown in this figure, a plurality of intake positions 8 are set along each of the five rocks, and the strength H is indicated by a - mark.% It is assumed that there was a defect at the position indicated by the symbol 9 in Figure 1. In this case, this is the peak of the three central locations hl*hll! It will appear as sh3.
この位置と大きさｈｌ、ｈ２．ｈ３はコンピュータ７に
よって演算され、同一欠陥によるピークか否かの判断が
される。第２図の場合、３個のピークは同一欠陥による
反射エコーと判断され、ｊｌ大エコーの総和ｈｌ＋ｈ２
＋ｈ３が欠陥の反射エコーとして良否判定の基礎とされ
る。This position and size hl, h2. h3 is calculated by the computer 7, and it is determined whether the peak is due to the same defect or not. In the case of Fig. 2, the three peaks are judged to be echoes reflected by the same defect, and the sum of jl large echoes hl + h2
+h3 is used as the basis for determining pass/fail as a reflected echo of a defect.
以上説明した実施例は３個所のエコーの最大値ｋｌｅｈ
！！ｓｈ３のみを取込んで良否判定の基礎としたが、反
射エコーの積分値８１．＠２，１１３を反射エコー面積
として良否判定してもよい。さらには同一欠陥による反
射エコーの酸大値のみを取込み（第２図の場合ｈ２）こ
れに基いて良否判断を行なってもよい。いずれにしても
コンピュータ７が、あらかじめ設定されたしきい値との
比較により、被検材１の良否判断を行なうことになる。In the embodiment described above, the maximum value of echoes at three locations is kleh.
! ! Although only sh3 was taken in as the basis for pass/fail judgment, the integral value of the reflected echo was 81. Pass/fail determination may be made using @2,113 as the reflected echo area. Furthermore, only the acid maximum value of the reflected echo due to the same defect may be taken (h2 in the case of FIG. 2), and the pass/fail judgment may be made based on this. In any case, the computer 7 will determine the quality of the test material 1 by comparing it with a preset threshold value.
（発明の効果）
本発明は以上説明したように構成したものであるから、
しきい値の設定如何によシ、小さな欠陥から大きな欠陥
まで、直線性高く測定できることになる。第３図は本発
明による探傷結果■を従来装耀による結果■と比較した
ところを示している。この図に示すように、従来のもの
では反射エコー高さが飽和してしまうのに対し、本発明
のものでは１反射エコーの同一欠陥に起因するすべての
反射エコーをもとにエコー高さを求めるので、このよう
なことはない。そして単に欠陥の有無のみでなく、その
有害度が判定できる特徴がある。(Effect of the invention) Since the present invention is configured as explained above,
Regardless of the threshold setting, it is possible to measure defects from small to large defects with high linearity. FIG. 3 shows a comparison between the flaw detection results (2) according to the present invention and the results (2) using the conventional equipment. As shown in this figure, in the conventional method, the reflected echo height is saturated, whereas in the present invention, the echo height is calculated based on all the reflected echoes caused by the same defect in one reflected echo. Because I ask, this will never happen. Moreover, it has the feature that it is possible to judge not only the presence or absence of a defect, but also its degree of harmfulness.
第１図は本発明の一実施例の系統図、第２図は第１図の
ものによシ得た反射エコーの大きさを示したグラフ、第
３図は本発明のものと従来の装置によるものとの反射エ
コーの程度を示すグラフである。
１・・・被検材 ２・・・センサ３・・・走査
装置 ４・・・超音波探傷器５・・・制御装置
６・・・アナログ・デジタル変換装置７・
・・コンピュータ
（ほか１名）Fig. 1 is a system diagram of an embodiment of the present invention, Fig. 2 is a graph showing the magnitude of reflected echo obtained from the one in Fig. 1, and Fig. 3 is a graph showing the apparatus of the present invention and the conventional device. 2 is a graph showing the degree of reflected echoes compared to 1... Material to be inspected 2... Sensor 3... Scanning device 4... Ultrasonic flaw detector 5... Control device
6...Analog-to-digital conversion device 7.
...Computer (1 other person)
Claims (1)
射波を受信するセンサと、該センサを被検材上の一次元
または二次元平面上に一定間隔で移動させる走査装置と
、前記センサに超音波信号を与えると共に反射波を受信
する超音波探傷器と、該超音波探傷器の出力信号をデジ
タル信号化するアナログ・デジタル変換装置と、該アナ
ログ・デジタル変換装置から受けた信号を一時記憶する
と共にこれを演算、処理して前記被検材の良否およびそ
の程度を判断するコンピュータと、を具備することを特
徴とする超音波検査装置。(1) A sensor that transmits ultrasonic waves to the material to be inspected and receives reflected waves from the material, and scanning that moves the sensor at regular intervals on a one-dimensional or two-dimensional plane on the material to be inspected. an ultrasonic flaw detector that applies an ultrasonic signal to the sensor and receives reflected waves; an analog-to-digital converter that converts an output signal of the ultrasonic flaw detector into a digital signal; An ultrasonic inspection apparatus characterized by comprising a computer that temporarily stores received signals and calculates and processes the received signals to determine the quality and quality of the test material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59202379A JPS6199863A (en) | 1984-09-27 | 1984-09-27 | Ultrasonic inspecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59202379A JPS6199863A (en) | 1984-09-27 | 1984-09-27 | Ultrasonic inspecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6199863A true JPS6199863A (en) | 1986-05-17 |
Family
ID=16456518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59202379A Pending JPS6199863A (en) | 1984-09-27 | 1984-09-27 | Ultrasonic inspecting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6199863A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009198249A (en) * | 2008-02-20 | 2009-09-03 | Toshiba Corp | Ultrasonic inspection data evaluation device and ultrasonic inspection data evaluation method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57108752A (en) * | 1980-12-26 | 1982-07-06 | Toshiba Corp | Ultrasonic flaw detector |
| JPS58169054A (en) * | 1982-03-31 | 1983-10-05 | Iwatsu Electric Co Ltd | Ultrasonic flaw detection |
-
1984
- 1984-09-27 JP JP59202379A patent/JPS6199863A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57108752A (en) * | 1980-12-26 | 1982-07-06 | Toshiba Corp | Ultrasonic flaw detector |
| JPS58169054A (en) * | 1982-03-31 | 1983-10-05 | Iwatsu Electric Co Ltd | Ultrasonic flaw detection |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009198249A (en) * | 2008-02-20 | 2009-09-03 | Toshiba Corp | Ultrasonic inspection data evaluation device and ultrasonic inspection data evaluation method |
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