JPS619857U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS619857U JPS619857U JP9414184U JP9414184U JPS619857U JP S619857 U JPS619857 U JP S619857U JP 9414184 U JP9414184 U JP 9414184U JP 9414184 U JP9414184 U JP 9414184U JP S619857 U JPS619857 U JP S619857U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor equipment
- external connection
- longitudinal direction
- connection terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のＤＩＰ型半導体装置を示す斜視図、第２
図は従来のＩＭＰ型半導体装置をプリント配線板に搭載
した状態を示す斜視図、第３図は本考案の半導体装置の
一実施例を示す斜視図、第４図は第３図のＡ−Ａ’線に
沿って切断し矢印の方向に見た断面図、第５図は本考案
に係る半導体装置の上面部外部端子へのラッピング及び
はんだ接続した状態を示す側面図、第６図は本考案の半
導体装置をプリント配線板へ搭載した例を示す斜視図で
ある。
１・・・半導体ケース、２・・・外部接続端子、３・・
・プリント配線基板、４・・・プリント配線、５・・・
配線、６・・・本考案の外部接続端子、７・・・半導体
チップ、８・・・ボンデイング（金属細線）、９・・・
ホンディングパッド、１０・・・リードフレーム、１１
・・・ラッピング接続、１２・・・はんだ接続。Figure 1 is a perspective view showing a conventional DIP type semiconductor device, Figure 2 is a perspective view showing a conventional DIP type semiconductor device;
The figure is a perspective view showing a conventional IMP type semiconductor device mounted on a printed wiring board, FIG. 3 is a perspective view showing an embodiment of the semiconductor device of the present invention, and FIG. 4 is A-A in FIG. 3. 5 is a side view showing the top surface of the semiconductor device according to the present invention wrapped and soldered to an external terminal; FIG. FIG. 2 is a perspective view showing an example in which the semiconductor device of FIG. 1 is mounted on a printed wiring board. 1...Semiconductor case, 2...External connection terminal, 3...
・Printed wiring board, 4...Printed wiring, 5...
Wiring, 6... External connection terminal of the present invention, 7... Semiconductor chip, 8... Bonding (metal thin wire), 9...
Honing pad, 10...Lead frame, 11
...Wrapping connection, 12...Solder connection.
Claims (1)
ドフレームと電気的に接続される外部接続用端子を、半
導体装置の長手力向側外側面に設けられた在来の外部接
続用端子と同配列で、半導体装置の長手方向側上面部に
配設したことを特徴とした半導体装置。In a dual in-line semiconductor device, the external connection terminals that are electrically connected to the internal lead frame are placed in the same arrangement as the conventional external connection terminals provided on the outside surface of the semiconductor device in the longitudinal direction. A semiconductor device characterized in that the semiconductor device is disposed on the upper surface of the device in the longitudinal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9414184U JPS619857U (en) | 1984-06-22 | 1984-06-22 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9414184U JPS619857U (en) | 1984-06-22 | 1984-06-22 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS619857U true JPS619857U (en) | 1986-01-21 |
Family
ID=30652439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9414184U Pending JPS619857U (en) | 1984-06-22 | 1984-06-22 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619857U (en) |
-
1984
- 1984-06-22 JP JP9414184U patent/JPS619857U/en active Pending
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