JPS6196654U - - Google Patents

Info

Publication number
JPS6196654U
JPS6196654U JP17971484U JP17971484U JPS6196654U JP S6196654 U JPS6196654 U JP S6196654U JP 17971484 U JP17971484 U JP 17971484U JP 17971484 U JP17971484 U JP 17971484U JP S6196654 U JPS6196654 U JP S6196654U
Authority
JP
Japan
Prior art keywords
wafer
grindstone
grinding device
holder
rotates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17971484U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17971484U priority Critical patent/JPS6196654U/ja
Publication of JPS6196654U publication Critical patent/JPS6196654U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面はこの考案の一実施例を示し、第1図はウ
エハ研削時を示し、第1図aは第1の砥石による
研削時における研削装置の要部の断面図、第1図
bは、第2の砥石による研削時における同要部の
断面図、第1図cは第3の砥石による研削時にお
ける同要部の断面図、第2図は研削途中を示す同
要部の斜視図、第3図は研削途中を示すウエハの
斜視図である。 1:研削装置、2:ウエハ、3:テーブル、4
a・4b・4c:ホルダ、5a・5b・5c:枢
軸、6a・6b・6c:砥石。
The drawings show one embodiment of this invention, FIG. 1 shows the wafer during grinding, FIG. Fig. 1c is a sectional view of the same essential part during grinding with the second grindstone, Fig. 1c is a sectional view of the same essential part during grinding with the third grindstone, Fig. 2 is a perspective view of the same essential part during grinding, Fig. FIG. 3 is a perspective view of the wafer during grinding. 1: Grinding device, 2: Wafer, 3: Table, 4
a, 4b, 4c: holder, 5a, 5b, 5c: pivot, 6a, 6b, 6c: whetstone.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固定支持されたウエハに対峙して回転駆動する
砥石ホルダを備えたウエハ用研削装置において、
前記砥石ホルダにダイヤモンド粉末をレジンボン
ドで結合保持した砥石を固着したことを特徴とす
るウエハ用研削装置。
In a wafer grinding device equipped with a grinding wheel holder that rotates while facing a fixedly supported wafer,
A wafer grinding device characterized in that a grindstone having diamond powder bonded and held by resin bond is fixed to the grindstone holder.
JP17971484U 1984-11-26 1984-11-26 Pending JPS6196654U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17971484U JPS6196654U (en) 1984-11-26 1984-11-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17971484U JPS6196654U (en) 1984-11-26 1984-11-26

Publications (1)

Publication Number Publication Date
JPS6196654U true JPS6196654U (en) 1986-06-21

Family

ID=30737283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17971484U Pending JPS6196654U (en) 1984-11-26 1984-11-26

Country Status (1)

Country Link
JP (1) JPS6196654U (en)

Similar Documents

Publication Publication Date Title
JPS6196654U (en)
JPH0171060U (en)
JPS6192549U (en)
JPS6416266U (en)
JPH0365665U (en)
JPS60194423U (en) Spherical worm whetstone
JPS6222062U (en)
JPS6357061U (en)
JPS61102464U (en)
JPH0160865U (en)
JPH0266942U (en)
JPH01143351U (en)
JPS63107556U (en)
JPH03100068U (en)
JPH0266941U (en)
JPS6450053U (en)
JPS63161662U (en)
JPS63136823U (en)
JPS6364466U (en)
JPS61151860U (en)
JPH0263962U (en)
JPH037463U (en)
JPS63131354U (en)
JPH01101770U (en)
JPS61124368U (en)