JPS6193682A - Manufacture of photo-interrupter - Google Patents
Manufacture of photo-interrupterInfo
- Publication number
- JPS6193682A JPS6193682A JP59215584A JP21558484A JPS6193682A JP S6193682 A JPS6193682 A JP S6193682A JP 59215584 A JP59215584 A JP 59215584A JP 21558484 A JP21558484 A JP 21558484A JP S6193682 A JPS6193682 A JP S6193682A
- Authority
- JP
- Japan
- Prior art keywords
- light
- sections
- emitting
- lead frame
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 abstract description 6
- 238000007493 shaping process Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 11
- 238000001721 transfer moulding Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）発明の目的
〔産業上の利用分野〕
この考案は、ホトインタラプタの製造法に関し、特にそ
のホトインタラプタを一体に成形するホトインタラプタ
の製造法に関する。Detailed Description of the Invention (a) Object of the Invention [Field of Industrial Application] This invention relates to a method for manufacturing a photointerrupter, and particularly to a method for manufacturing a photointerrupter in which the photointerrupter is integrally molded.
現在、ホトインタラプタは、機器の計測部や制御部への
導入とその普及に伴い、用途が急速に拡大しつつある。Currently, the use of photointerrupters is rapidly expanding as they are introduced into measurement and control sections of equipment and become widespread.
ところで、従来、ホトインタラプタ（Ｐａ）は、第７〜
８図に示すように、発光ダイオード（１ａ）にリード部
Ｉ （２ａ） 、ＩＩ （３ａ）を付け、発光面（４ａ
）を露出させるようにしてモールド成形することで発光
部（５ａ）を形成し、同じく受光ダイオード（６ａ）に
リード部ＩＩＩ （７ａ）ＩＶ（８ａ）を付け、受光面
（９ａ）を露出させるようにしてモールド成形すること
で受光部（１０ａ ’）を形成し、これら発光部（５ａ
）と受光部（１０ａ ）を、各々発光面（４ａ）と受光
面（９ａ）を対向させて、予め用意していた遮光性材料
でつくられたホルダー（１１ａ ）に嵌入し、固定する
ことによって作られていた。尚、ホルダー（１ｂ）には
、発光面（４ａ）と受光面（９ａ）に対応する窓部Ｉ
（１２ａ） 、Ｉ［（１３ａ）が設けられていて、発
光部（５ａ）と受光部（１０ａ）とは先約に結合可能と
なっていた。By the way, conventionally, the photointerrupter (Pa) has the seventh to
As shown in Figure 8, lead parts I (2a) and II (3a) are attached to the light emitting diode (1a), and the light emitting surface (4a
) is molded to expose the light-emitting part (5a), and the light-receiving diode (6a) is similarly attached with lead parts III (7a) and IV (8a) so as to expose the light-receiving surface (9a). A light-receiving part (10a') is formed by mold-forming, and these light-emitting parts (5a')
) and the light-receiving part (10a), with the light-emitting surface (4a) and the light-receiving surface (9a) facing each other, are fitted into a holder (11a) made of a light-shielding material prepared in advance and fixed. It was made. The holder (1b) has a window I corresponding to the light emitting surface (4a) and the light receiving surface (9a).
(12a), I[(13a) were provided, and the light emitting part (5a) and the light receiving part (10a) could be coupled in advance.
しかし、この製造法では、ホルダー（ｌｌａ ）、発光
部（５ａ）及び受光部（１０ａ ）をそれぞれ個別に製
造しなければならず、しかも各々極めて高い精度を必要
としており、又、ホルダー（Ｉｌａ ）に発光部（５ａ
）と受光部（１０ａ ）とを嵌入し組立てる作業も多く
の手間と時間を要していた。However, in this manufacturing method, the holder (Ila), the light emitting part (5a), and the light receiving part (10a) must be manufactured individually, and each requires extremely high precision. The light emitting part (5a
) and the light receiving part (10a) and assembling them requires a lot of effort and time.
この発明は、これらの事情を考慮してなされたもので、
ホトインタラプタの製造がより簡便で時間がかからず、
又、寸法精度がより高いホトインタラプタを製造する製
造法を提供することを目的とする。This invention was made in consideration of these circumstances,
Manufacturing photointerrupters is easier and less time-consuming.
Another object of the present invention is to provide a manufacturing method for manufacturing a photointerrupter with higher dimensional accuracy.
（ロ）発明の構成
この発明は、互いに平行な二本のリード部とこれらと同
一平面で交わるタイバー部とからなる金属製リードフレ
ームを水平に位置させて、リード部の両先端部を鉛直上
方に折曲し、該両端部に素子チップを搭載し、次にリー
ドフレームの水平部分を含む面を金型のパーティング面
として上記両先端部及び素子チップを透明性樹脂を用い
てモールドすることで、それぞれ発光部と受光部とを形
成し、更に、この発光部と受光部とをその発光面と受光
面とを所定の間隔をおいて対向させ、発光部と受光部と
の露出するリードフレームを含む面を同一平面上に配し
、金型のパーティング面としてかつ発光面と受光面とが
露出状態となるように遮光性樹脂を用いて発光部と受光
部とを一体モールドし、この後、リードフレームからタ
イバー部を除去することによってホトインタラプタを得
ることよりなるホトインタラプタの製造法である。(B) Structure of the Invention This invention has a metal lead frame consisting of two lead parts parallel to each other and a tie bar part that intersects with these on the same plane, which is positioned horizontally, and both ends of the lead parts are directed vertically upward. The lead frame is bent, the element chip is mounted on both ends, and the surface including the horizontal part of the lead frame is used as the parting surface of the mold, and the both ends and the element chip are molded using transparent resin. A light-emitting part and a light-receiving part are respectively formed, and the light-emitting part and the light-receiving part are arranged so that the light-emitting surface and the light-receiving surface face each other with a predetermined interval, and exposed leads between the light-emitting part and the light-receiving part are formed. The light-emitting part and the light-receiving part are integrally molded using a light-shielding resin so that the surface including the frame is on the same plane, and the light-emitting part and the light-receiving part are exposed as a parting surface of the mold, Thereafter, the photointerrupter is manufactured by removing the tie bar portion from the lead frame to obtain the photointerrupter.
すなわち、この発明の主要な特徴の一つは、発光部と受
光部との露出するリード部分と同一平面上に配し金型の
パーティング面として用いることにある。That is, one of the main features of the present invention is that it is arranged on the same plane as the exposed lead parts of the light emitting part and the light receiving part and used as the parting surface of the mold.
以下、第１〜６図に示す実施例によってこの発明を詳述
するが、これによってこの発明が限定されるものではな
い。This invention will be described in detail below with reference to embodiments shown in FIGS. 1 to 6, but the invention is not limited thereby.
リード部ｒ （２） ｎ （３）と、タイバー部
（１４）と、発光素子チップ゛（１５）がグイボンドさ
れ結合されるように形状加工されたリード部Ｉ （，
２） ｎ、 （３）の各々先端部Ｉ （１６）
ＩＩ （１７）とからなり、先端部１ （１６） Ｉ
Ｉ （１７）とタイバー部（１４）とのほぼ中央で直角
に折曲げられたリードフレームＩ（１８）を用意する。Lead portion I (,
2) Tip part I of each of n and (3) (16)
II (17), and the tip part 1 (16) I
A lead frame I (18) is prepared which is bent at a right angle approximately at the center of I (17) and the tie bar portion (14).
ローダ（省略）を用いてリード部１ （２） ｎ（３
）方向が鉛直下方となるようにリードフレームＩ （
１８）を支持し、ヘッダ一部１ （１９）つまり折曲
した先端部Ｉ （１６）、ｎ （１７）を水平に保た
せ、アッセンブリ装置（省略）を用いて先端部Ｉ （
１６）に発光素子チップ（１５）を、一方の電極だけが
先端部Ｉ （１６）と接続するようにグイボンドし、
もう一方の電極と先端部ＩＩ （１７）を金線（２０）
で接続する。Lead part 1 (2) n(3
) direction is vertically downward.
18), keep the header part 1 (19), that is, the bent tip portions I (16), n (17) horizontally, and use an assembly device (omitted) to remove the tip portion I (
16), the light emitting element chip (15) is bonded so that only one electrode is connected to the tip I (16),
Connect the other electrode and tip II (17) with the gold wire (20).
Connect with.
ヘッダ一部Ｉ （１９）を、透明性樹脂 を用いてモ
ールド成形する。このとき、リードフレームＩ（１８）
の折曲部Ｉ （２１） ｎ （２２）は透明性樹脂成
形部（２３）内に入るようにし、又、透明性樹脂成形部
（２３）の水平断面がＴ字型となるように発光素子チッ
プ（１５）の正面部分を突出させる。又、この成形はト
ランスファー成形法を用い、金型のパーティング面はリ
ードフレームＩ （１８）を含む平面である。The header part I (19) is molded using transparent resin. At this time, lead frame I (18)
The bent parts I (21) n (22) of the light emitting element are arranged so that they enter the transparent resin molded part (23), and the horizontal cross section of the transparent resin molded part (23) is T-shaped. The front part of the chip (15) is made to protrude. Further, this molding uses a transfer molding method, and the parting surface of the mold is a plane including the lead frame I (18).
尚、トランスファー成形法は、加熱室中で可塑化させた
材料を狭い通路から加熱したキャビティ内に圧入して成
形するもので、硬化時間が短く、均一硬化により成形ヒ
ズミが少なく、寸法精度が高い等の特長を有している。Transfer molding is a method in which the material is plasticized in a heating chamber and then press-fitted into a heated cavity through a narrow passage to form the material.The curing time is short, and the uniform curing results in less molding distortion and high dimensional accuracy. It has the following features.
モールド成形によって生じたパリを透明性樹脂成形部（
２３）から取り除く。The particles generated by molding are removed from the transparent resin molding section (
23).
リードフレームＩ （１８）と同じ形状、同じ大きさ
のリードフレームｎ （２４）を用意し、以上と同様に
してリードフレームＩＩ （２４）の先端部ビ透明性樹
脂でヘッダ一部Ｉｆ （２６）をモールド成形し、透明
性樹脂成形部（２７）を形成する。Prepare a lead frame n (24) with the same shape and size as lead frame I (18), and in the same manner as above, attach a header part If (26) to the tip of lead frame II (24) using transparent resin. is molded to form a transparent resin molded part (27).
リードフレームＩ （１Ｂ）とリードフレーム■（２
４）とを、発光素子チップ（１５）と受光素子チップ（
２５）とを対光させた状態で、これらがモールドによっ
て形成された透明性樹脂成形部１ （２３）、ＩＩ
（２７）で対向する対向面１ （２８） 、ＩＩ （
２９）が露出状態となるように遮光性樹脂で、外装モー
ルド成形して一体化する。この成形もトランスファー成
形法を用い、金型のパーティング面はリードフレームＩ
（１８） 、ｎ （２４）を含む平面である。Lead frame I (1B) and lead frame ■ (2
4) and the light emitting element chip (15) and the light receiving element chip (15).
25) and transparent resin molded parts 1 (23) and II formed by molding
(27) facing surfaces 1 (28), II (
29) is integrally molded with a light-shielding resin so that it is exposed. This molding also uses the transfer molding method, and the parting surface of the mold is the lead frame I.
(18) , is a plane containing n (24).
又、このモールド成形が対向面１ （２８） 、ｎ
（２９）が露出の状態であって遮光性樹脂によって被わ
れない状態に仕上がるた、めに、透明性樹脂成形部■（
２３） ｎ （２７）の対向面１ （２８） ＩＩ
（２９）の各々背となる背面１ （３０） ｎ （３
１）と当接しうるように金型に突起部（省略）を設け、
透明性樹脂成形部１ （２３） ＩＩ （２７）をこ
の突起部方向に押しつけるように遮光性樹脂でモールド
成形することで、発光素子チップ（１５）及び受光素子
チップ（２５）の窓が確保される。尚、（３２）、（３
３）は各々背面Ｉ （３０） ｎ （３１）に当接す
る金型突起物に対応して生じた凹部である。Moreover, this molding forms the opposing surface 1 (28), n
In order to finish (29) in an exposed state and not covered by the light-shielding resin, the transparent resin molded part ■(
23) Opposing surface 1 of n (27) (28) II
The back surface 1 (30) n (3
A protrusion (omitted) is provided on the mold so that it can come into contact with 1),
By molding the transparent resin molded part 1 (23) II (27) with a light-shielding resin so as to press it in the direction of this protrusion, windows for the light emitting element chip (15) and the light receiving element chip (25) are secured. Ru. Furthermore, (32), (3
3) are recesses formed corresponding to the mold protrusions that abut on the back surface I (30) n (31), respectively.
又、透光性樹脂によるモールド成形で対向面Ｉ（２８）
ＩＩ （２９）が突出させていることより、遮光
性樹脂がこれらの面を覆いにり＜シている。In addition, the facing surface I (28) is molded with translucent resin.
Since II (29) protrudes, the light-shielding resin covers these surfaces.
遮光性樹脂を用いたモールド成形を行った後、そのパリ
を除去し、タイバー部（１４）を切断し、リードＩ
（２） 、ｎ （３） 、Ｉｎ （７） 、ＩＶ （
８）を折曲げることによって、ホトインタラプタ（Ｐ）
はつくられる。After molding using a light-shielding resin, the paris is removed, the tie bar part (14) is cut, and the lead I
(2) , n (3) , In (7) , IV (
8) By bending the photointerrupter (P)
is created.
（ハ）発明の効果
この発明によれば、成形工程は全てトランスファーモー
ルドによって行い得るので製造上多くの手間や時間を必
要とせず、又、生産ラインを一貫して自動化が可能とな
る。又、得られる製品は寸法精度が高く、透明性樹脂成
形部の肉厚を薄くすることで超小型となり得る。(C) Effects of the Invention According to the present invention, all the molding steps can be performed by transfer molding, so much labor and time are not required for manufacturing, and the production line can be fully automated. Furthermore, the resulting product has high dimensional accuracy and can be made ultra-small by reducing the thickness of the transparent resin molded part.
第１図は本発明に係るホトインタラプタの製造法の一実
施例に用いるリードフレームを説明する斜視図、第２図
はこれに発光素子チップをダイボンドし、金線で接続し
た状態を説明する斜視図、第３図は更にこれに透明性樹
脂のモールド成形を行った状態を説明する斜視図、第４
図は発光素子側と受光素子側とを遮光性樹脂によってモ
ールド成形し一体化した状態を説明する斜視図、第５図
はこれの正面断面図、第６図はこれによって製造された
ホトインタラプタの全体斜視図、第７図は従来例のホト
インタラプタの組立てを説明する斜視図、第８図はこれ
の完成を示す斜視図である。
（Ｐ）・・・ホトインタラプタ、（２Ｊ・・・リードエ
、（３）・・・リードＩＩ、（刀・・・リード■、（８
）・・・リードＩＶ１闇・・・タイバー部、ａ９・・・
発光素″子チップ、（５）・・・先端部Ｉ、（ｒ７）・
・・先端部■、。
■・・・リードフレームエ、■・・・ヘッダ一部工、■
・・・金線、２＋＋・・・折曲部Ｉ、＜２２１・・・折
曲部■、（支）・・・透明性樹脂成形部、岡・・・リー
ドフレーム■、固・・・受光素子チップ、義・・・ヘッ
ダ一部■、弼・・・透明性樹脂成形部■、刈・・・対向
面■、囚・・・対向面■、印・・・背面Ｉ 、３１）・
・・背面■。
第１図
第２図
第３図
第４図
第５図
第６図
第７図Fig. 1 is a perspective view illustrating a lead frame used in an embodiment of the photointerrupter manufacturing method according to the present invention, and Fig. 2 is a perspective view illustrating a state in which a light emitting element chip is die-bonded to the lead frame and connected with gold wire. Figure 3 is a perspective view illustrating the state in which transparent resin is molded into this, and Figure 4 is
The figure is a perspective view illustrating a state in which the light-emitting element side and the light-receiving element side are molded and integrated with light-shielding resin, Figure 5 is a front sectional view of this, and Figure 6 is a photointerrupter manufactured using this. FIG. 7 is a perspective view illustrating the assembly of a conventional photointerrupter, and FIG. 8 is a perspective view showing the completed structure. (P)...Photo interrupter, (2J...Lead die, (3)...Lead II, (Sword...Lead ■, (8
)...Lead IV1 Darkness...Tie bar part, a9...
Light-emitting element chip, (5)... tip I, (r7).
・Tip ■. ■...Lead frame, ■...Header part work, ■
...Gold wire, 2++...Bending part I, <221...Bending part ■, (support)...Transparent resin molding part, Oka...Lead frame ■, Solid...Light receiving Element chip, right...header part ■, bottom...transparent resin molded part ■, clip...opposite surface ■, cap...opposite surface ■, mark...rear side I, 31)・
・・Back ■. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7
Claims (1)
交わるタイバー部とからなる金属製リードフレームを水
平に位置させて、リード部の両先端部を鉛直上方に折曲
し、該両端部に素子チップを搭載し、次にリードフレー
ムの水平部分を含む面を金型のパーティング面として上
記両先端部及び素子チップを透明性樹脂を用いてモール
ドすることで、それぞれ発光部と受光部とを形成し、更
に、この発光部と受光部とをその発光面と受光面とを所
定の間隔をおいて対向させ、発光部と受光部との露出す
るリードフレームを含む面を同一平面上に配し、金型の
パーティング面としてかつ発光面と受光面とが露出状態
となるように遮光性樹脂を用いて発光部と受光部とを一
体モールドし、この後、リードフレームからタイバー部
を除去することによつてホトインタラプタを得ることよ
りなるホトインタラプタの製造法。1. A metal lead frame consisting of two parallel lead parts and a tie bar part that intersects them on the same plane is positioned horizontally, and both ends of the lead parts are bent vertically upward. The element chip is mounted on the lead frame, and then the surface including the horizontal part of the lead frame is used as the parting surface of the mold, and both tips and the element chip are molded with transparent resin, thereby forming a light emitting part and a light receiving part, respectively. The light-emitting part and the light-receiving part are arranged so that the light-emitting surface and the light-receiving surface face each other with a predetermined interval, and the surfaces of the light-emitting part and the light-receiving part including the exposed lead frame are on the same plane. The light-emitting part and the light-receiving part are integrally molded using a light-shielding resin so that the light-emitting part and the light-receiving part are exposed as a parting surface of the mold, and then the tie bar part is removed from the lead frame. A method for producing a photointerrupter comprising obtaining a photointerrupter by removing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59215584A JPS6193682A (en) | 1984-10-15 | 1984-10-15 | Manufacture of photo-interrupter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59215584A JPS6193682A (en) | 1984-10-15 | 1984-10-15 | Manufacture of photo-interrupter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6193682A true JPS6193682A (en) | 1986-05-12 |
| JPH0224388B2 JPH0224388B2 (en) | 1990-05-29 |
Family
ID=16674853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59215584A Granted JPS6193682A (en) | 1984-10-15 | 1984-10-15 | Manufacture of photo-interrupter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6193682A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244358U (en) * | 1988-09-19 | 1990-03-27 | ||
| JPH0436262U (en) * | 1990-07-23 | 1992-03-26 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645163U (en) * | 1979-09-17 | 1981-04-23 | ||
| JPS5717187A (en) * | 1980-07-07 | 1982-01-28 | Toshiba Corp | Manufacture of semiconductor device for detecting light |
-
1984
- 1984-10-15 JP JP59215584A patent/JPS6193682A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645163U (en) * | 1979-09-17 | 1981-04-23 | ||
| JPS5717187A (en) * | 1980-07-07 | 1982-01-28 | Toshiba Corp | Manufacture of semiconductor device for detecting light |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244358U (en) * | 1988-09-19 | 1990-03-27 | ||
| JPH0436262U (en) * | 1990-07-23 | 1992-03-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0224388B2 (en) | 1990-05-29 |
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