JPS6183013A - Manufacture of conductive resin molded product - Google Patents
Manufacture of conductive resin molded productInfo
- Publication number
- JPS6183013A JPS6183013A JP59177869A JP17786984A JPS6183013A JP S6183013 A JPS6183013 A JP S6183013A JP 59177869 A JP59177869 A JP 59177869A JP 17786984 A JP17786984 A JP 17786984A JP S6183013 A JPS6183013 A JP S6183013A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- melting point
- cavity
- metal
- injected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1642—Making multilayered or multicoloured articles having a "sandwich" structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C2045/1696—Making multilayered or multicoloured articles injecting metallic layers and plastic material layers
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は導電性を有する樹脂金属成形物の製造方法に関
するものであり、特に中心層が低融点金属または低融点
合金（以下単に低融点金属と称する）から構成されるサ
ンドインチ構造を有する樹脂成形物の射出成形方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a resin-metal molded product having electrical conductivity, and in particular, the present invention relates to a method for manufacturing a resin-metal molded article having conductivity, and in particular, the center layer is made of a low-melting point metal or a low-melting point alloy (hereinafter simply referred to as a low-melting point metal). The present invention relates to an injection molding method for a resin molded article having a sandwich-inch structure.
〔従来の技術］
近年のディジタル電子機器の急速な普及に伴う電磁波的
環境の悪化により、いわゆる電磁波障害が社会問題とな
りつつあり、この電磁波障害を防止する電磁波シールド
材料の一つとして導電性樹脂が注目されている。[Prior Art] Due to the deterioration of the electromagnetic environment due to the rapid spread of digital electronic devices in recent years, so-called electromagnetic interference is becoming a social problem, and conductive resin is one of the electromagnetic shielding materials to prevent this electromagnetic interference. Attention has been paid.
従来から、金属フィラーや繊維あるいはカーボンブラッ
ク等の導電性材料を樹脂中に練り込む方法等が多く提案
されている。Conventionally, many methods have been proposed in which conductive materials such as metal fillers, fibers, or carbon black are kneaded into resin.
Ｃ発明が解決しようとする問題点）
電磁波シールドＭ料には高度の導電性が要求され、この
ような導電性を樹脂組成物に付与するためには、かなり
の量の導電性フィラーを充填する必要がある。また金属
４１雑の場合、その充１！３ｔｍは金属フィラーより若
干少なくてもすむが、金属を微細な繊維にすることは非
常に効率が悪（、金属繊維の価格も汎用に耐えない程高
価になってしまう。Problems to be solved by the invention C) Electromagnetic shielding M materials are required to have high electrical conductivity, and in order to impart such electrical conductivity to the resin composition, a considerable amount of electrically conductive filler must be filled. There is a need. In addition, in the case of metal 41 miscellaneous, the amount of 1.3 tm can be slightly less than that of metal filler, but it is very inefficient to make metal into fine fibers (and the price of metal fiber is too high to be used for general purpose). Become.
またいづれにしても、このような導電性フィラーや繊維
を可塑化された樹脂に混入させることおよびその充填量
が増加するに従って樹脂の見掛は上の粘度は急激に高く
なるため、電子機器のハウジング材のように複雑な形状
をもち、かつ高度の導電性が要求される成形品を効率よ
く製造することは容易ではない。In any case, as such conductive fillers and fibers are mixed into plasticized resin and the amount of the filler increases, the apparent viscosity of the resin increases rapidly. It is not easy to efficiently manufacture molded products such as housing materials that have complex shapes and require a high degree of conductivity.
本発明においては通常の射出成形で用いられる熱可塑性
樹脂をショートショットの状態でキャビティ中へ射出し
た後、加圧した溶融低融点金属または低融点合金を該樹
脂のコアに射出して樹脂と共にキャビティの隅々まで押
し進めることによって得られる中心層が低融点金属また
は低融点合金の連続層で外層が熱可塑性樹脂層から構成
される高度の導電性を有する成形品を効率よく製造しよ
うとするものでおる。In the present invention, a thermoplastic resin used in ordinary injection molding is injected into a cavity in the form of a short shot, and then a pressurized molten low-melting point metal or low-melting point alloy is injected into the core of the resin and molded together with the resin into the cavity. The objective is to efficiently produce molded products with a high degree of conductivity, where the center layer is a continuous layer of a low-melting point metal or low-melting point alloy and the outer layer is a thermoplastic resin layer. is.
本発明に用いる熱可塑性樹脂は射出成形可能な熱可塑性
樹脂であれば特に制約するものではないが、アイオノマ
ー樹脂をブレンドするとより好ましい。The thermoplastic resin used in the present invention is not particularly limited as long as it is an injection moldable thermoplastic resin, but it is more preferable to blend it with an ionomer resin.
射出成形可能な熱可塑性樹脂としては、ポリオレフィン
系、ポリスチレン系、ポリ塩化ビニル系、ポリアクリル
酸エステル系、ポリメタアクリル酸エステル系、ポリア
クリロニトリル系、ポリブタジェン系、ポリアミド類、
ポリエステル類もしくはこれらの変性物、共重合物、混
合物などが挙げられる。これらは射出成形性や射出成形
後の成形物の物性要求により選択できる。Injection moldable thermoplastic resins include polyolefins, polystyrenes, polyvinyl chloride, polyacrylates, polymethacrylates, polyacrylonitrile, polybutadiene, polyamides,
Examples include polyesters, modified products, copolymers, and mixtures thereof. These can be selected depending on injection moldability and physical property requirements of the molded product after injection molding.
またアイオノマー樹脂は、低融点金属と熱可塑性樹脂と
の親和性、密着性を向上させるためにブレンドすること
ができるが、５重ｆｆ１ａＩ１以上ブレンドさせると効
果が大きい。また必要な場合には、これらの樹脂組成物
に対して酸化防止剤、安定剤、可塑剤、滑剤等の添加助
剤を添加することができる。Further, the ionomer resin can be blended to improve the affinity and adhesion between the low melting point metal and the thermoplastic resin, but a blend of 5 or more ff1aI1 or more is more effective. Further, if necessary, additive aids such as antioxidants, stabilizers, plasticizers, and lubricants can be added to these resin compositions.
本発明に用いる低融点金属としては、熱可塑性樹脂の射
出成形に可能な温度以下、即ち４００℃以下の融点を有
するもので、錫、鉛、亜鉛、ビスマス、カドミウム、ア
ンチモン等の単体あるいは合金が挙げられる。The low melting point metal used in the present invention is one having a melting point below the temperature that is possible for injection molding of thermoplastic resin, that is, below 400°C, and includes tin, lead, zinc, bismuth, cadmium, antimony, etc. alone or in alloys. Can be mentioned.
本尺、明の成形方法を説明する。 The method of forming the main shaku and light will be explained.
金型のキャビティ（第１図のハ）中へ、低融点金属のｍ
点より充分高い温度で可塑化した熱可塑性ｍ詣を射出口
（第１図のイ）よりショートショットの状態で射出する
（第２図）。この場合、一方の射出口（第１図００）の
径を充分に小さくすることで、キャビティ内からの樹脂
の逆流は防止できる。次に樹脂射出後、少なくとも射出
された樹脂の一部が溶融状態にあるうちに、射出口（第
１図の口）から低融点金属の融点より充分高い温度で溶
融させた金属を射出し、樹脂と共にキャビティの隅へ押
し進める（第３図）。この時溶融低融点金属よりも粘度
が高い樹脂はキャピテイと接触して、成形物の外層部を
形成しながら、低圧部分即ちキャピテイの隅へ向って押
し出される。また樹脂の温度伝導度が低いので、樹脂の
中心部の温度は低融点金属の温度以上に保持されており
、低粘度の溶融低融点金属はその流動性を保ちながら、
キャビティの表面と接触することなく、キャビティの隅
の方向へ樹脂を押し出しながら進んで、金属の連続層が
成形物の中心層に形成される（第４図）。The low melting point metal m is poured into the mold cavity (C in Figure 1).
Thermoplastic material plasticized at a temperature sufficiently higher than the point is injected in a short shot from the injection port (A in FIG. 1) (FIG. 2). In this case, by making the diameter of one of the injection ports (00 in FIG. 1) sufficiently small, backflow of the resin from inside the cavity can be prevented. Next, after resin injection, while at least a part of the injected resin is in a molten state, inject metal molten at a temperature sufficiently higher than the melting point of the low melting point metal from the injection port (port in Figure 1), Push it together with the resin to the corner of the cavity (Figure 3). At this time, the resin, which has a higher viscosity than the molten low-melting metal, comes into contact with the cavity and is pushed out toward the low-pressure area, that is, the corner of the cavity, while forming the outer layer of the molded article. In addition, since the thermal conductivity of the resin is low, the temperature at the center of the resin is maintained above the temperature of the low melting point metal, and the low viscosity molten low melting point metal maintains its fluidity.
A continuous layer of metal is formed in the center layer of the mold, pushing the resin toward the corners of the cavity without contacting the surfaces of the cavity (Figure 4).
（実施例〕
ＡＢＳ樹脂 Ｊ Ｓ ＲＡ Ｂ Ｓ ３８ ９５重
量部フイオノマー樹脂 サーリンＡ５重量部ステアリン
酸鉛 ０，１重量部の樹脂組成物を２
２０℃で可塑化した後、１ＢＯ℃に保持した金型の射出
口（第１図のイ）より１・５に９ ／ ｃｊの圧力で射
出してショートショットとした後、直ちに２５０℃で溶
融させた鉛−錫合金（融点１８５℃）をもう一方の射出
口（第１図の口）より３０に５／ｃｉの圧力で射出して
、キャビティ内の樹脂および低融点金属をキャビティの
隅々へ押し進めた後、−冷却用空気を金型へ通じ、キャ
ビティ表面の温度を７５℃まで下げて金型を開き、カッ
プ状の成形物を取り出した。得られた成形物の肉厚は３
．ａｍで、中心層は厚さ０．６〜２．０ｍの鉛−錫合金
の連続層から構成されるいた。(Example) ABS resin J S RA B S 38 95 parts by weight Pionomer resin Surlyn A 5 parts by weight Lead stearate 0.1 parts by weight of the resin composition
After plasticizing at 20°C, it was injected into a short shot at a pressure of 9/cj from the injection port of a mold held at 1BO°C (A in Figure 1) at a pressure of 9/cj, and then immediately melted at 250°C. The lead-tin alloy (melting point: 185°C) is injected from the other injection port (the port in Figure 1) at a pressure of 30 to 5/ci to remove the resin and low melting point metal from every corner of the cavity. Then, - cooling air was passed through the mold to lower the temperature of the cavity surface to 75° C., the mold was opened, and the cup-shaped molded product was taken out. The wall thickness of the obtained molded product is 3
．． am, the central layer was composed of a continuous layer of lead-tin alloy with a thickness of 0.6 to 2.0 m.
成形物の電気抵抗は測定した部分によって若干異なるが
、いずれも１０−３Ω・α以下の比抵抗値を示した。Although the electrical resistance of the molded product differed slightly depending on the part where it was measured, all of the molded products showed a specific resistance value of 10 −3 Ω·α or less.
本発明では第一に通常の射出成形で用いられる熱可塑性
樹脂をショートショットの状態でキャピテイ中へ射出し
た後、加圧した溶融低融点金属を樹脂のコアへ射出する
ので、溶融低融点金属の粘度は可塑化された樹脂の粘度
よりもはるかに低く、キャビティ内の流体の粘度は樹脂
だけの場合よりも低くなるため、成形の際のキャビティ
の面を写しとることが容易となること、第二に成形物の
中心層には低融点金属の連続層が存在するため、成形物
自体が金属と同等の導電性を示すこと、更に成形物の製
造工程に金属の微細化工程が含まれていないので、生産
性が大きく向上し、製品の価格も従来法と比較してかな
り低廉になるなどの利点が見出された。In the present invention, firstly, the thermoplastic resin used in ordinary injection molding is injected into the cavity in the form of a short shot, and then the pressurized molten low melting point metal is injected into the resin core. The viscosity is much lower than that of plasticized resin, and the viscosity of the fluid inside the cavity is lower than that of resin alone, making it easier to copy the surface of the cavity during molding. Second, since there is a continuous layer of low-melting point metal in the center layer of the molded product, the molded product itself exhibits conductivity equivalent to that of metal, and furthermore, the manufacturing process of the molded product includes a metal miniaturization process. Since there is no conventional method, productivity has been greatly improved, and the product price has been found to be considerably lower than that of conventional methods.
以上説明した如く本発明に係る導電性樹脂成形物は多く
の利点を有しているものであり、工業上多大な価値を有
するものである。As explained above, the conductive resin molded article according to the present invention has many advantages and is of great industrial value.
第１図は本発明の実施例で使用した金型の断面模式図、
第２図ないし第４図は本発明の成形工程を順次示した断
面模式図である。
イ・・・射出口
口・・・射出口
バ・・・キャビティ
第１図 第２図
口
第３図 第４図
１ ↑
手続補正書輸発）
昭和６０年１０月２２日
昭和５９年 特許願 第１７７８６９号名 称
（２３４＞山陽国策パルプ株式会社明細書の発明の詳細
な説明の欄および添付図面（第４図）補正の内容
△、明細占の発明の詳細な説明の欄のうち、下記事項を
訂正する。
１、明細書筒２頁８行目に
「従来から、」とあるを
［従来から、樹脂組成物に導電性を付与する手段として
、」と訂正。
２、同第３頁１１行目にあける
「または低融点合金」の８文字を削除。
３、同頁１３〜１４行にあける
「または低融点合金」の８文字を削除。
４、同第５頁１５行目に
「キャビティ」とあるを
「金型の表面」と訂正。
５、同第５頁末行から第６頁１行目にかけて「キャビテ
ィ」とあるを
「金型」と訂正。
Ｂ、添付図面中、第４図を別添の如く訂正する、。FIG. 1 is a schematic cross-sectional view of a mold used in an example of the present invention.
FIGS. 2 to 4 are schematic cross-sectional views sequentially showing the molding process of the present invention. A...Ejection port...Ejection port bar...Cavity Figure 1 Figure 2 Port Figure 3 Figure 4 Figure 1 ↑ Procedural amendment export) October 22, 1985 Patent application filed in 1988 No. 177869 Title
(234> Contents of amendment to the Detailed Description of the Invention column of the Sanyo Kokusaku Pulp Co., Ltd. Specification and the attached drawing (Figure 4) △, The following matters are corrected in the Detailed Description of the Invention column of the Specification. 1. On page 2 of the specification, line 8, the phrase "conventionally," has been corrected to "conventionally, as a means of imparting conductivity to a resin composition." 2. On page 3, line 11 of the same specification. 3. Delete the 8 characters "or low melting point alloy" on lines 13-14 of the same page. 4. Delete the word "cavity" on page 5, line 15 of the same page. 5. From the last line of page 5 to the first line of page 6, the word ``cavity'' has been corrected to ``mold.'' B. Figure 4 of the attached drawings is attached. Correct it as follows.
Claims (1)
ショートショットの状態でキャビティ中へ射出した後、
加圧した溶融低融点金属または低融点合金を該樹脂のコ
アに射出して樹脂と共にキャビティの隅々まで押し進め
ることによって得られる中心層が低融点金属または低融
点合金の連続層、外層が熱可塑性樹脂層から構成される
樹脂金属成形物の製造方法。In thermoplastic resin injection molding, after the plasticized resin is injected into the cavity in a short shot,
A pressurized molten low melting point metal or low melting point alloy is injected into the core of the resin and pushed along with the resin to every corner of the cavity.The central layer is a continuous layer of a low melting point metal or low melting point alloy, and the outer layer is a thermoplastic layer. A method for producing a resin metal molded article composed of a resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59177869A JPS6183013A (en) | 1984-08-27 | 1984-08-27 | Manufacture of conductive resin molded product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59177869A JPS6183013A (en) | 1984-08-27 | 1984-08-27 | Manufacture of conductive resin molded product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6183013A true JPS6183013A (en) | 1986-04-26 |
Family
ID=16038484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59177869A Pending JPS6183013A (en) | 1984-08-27 | 1984-08-27 | Manufacture of conductive resin molded product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183013A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0485014A (en) * | 1990-07-27 | 1992-03-18 | Nissei Plastics Ind Co | Molding method for composite molded product |
| US5248468A (en) * | 1988-10-20 | 1993-09-28 | Toyo Boseki Kabushiki Kaisha | Method of making electrically conductive fibers |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59175668A (en) * | 1983-03-23 | 1984-10-04 | Fuji Heavy Ind Ltd | Stepless speed change gear |
-
1984
- 1984-08-27 JP JP59177869A patent/JPS6183013A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59175668A (en) * | 1983-03-23 | 1984-10-04 | Fuji Heavy Ind Ltd | Stepless speed change gear |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5248468A (en) * | 1988-10-20 | 1993-09-28 | Toyo Boseki Kabushiki Kaisha | Method of making electrically conductive fibers |
| JPH0485014A (en) * | 1990-07-27 | 1992-03-18 | Nissei Plastics Ind Co | Molding method for composite molded product |
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