JPS6179628A - Manufacture of lead laminated tape - Google Patents
Manufacture of lead laminated tapeInfo
- Publication number
- JPS6179628A JPS6179628A JP59203627A JP20362784A JPS6179628A JP S6179628 A JPS6179628 A JP S6179628A JP 59203627 A JP59203627 A JP 59203627A JP 20362784 A JP20362784 A JP 20362784A JP S6179628 A JPS6179628 A JP S6179628A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- plastic film
- lead
- film
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/14—Lead
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2398/00—Unspecified macromolecular compounds
- B32B2398/20—Thermoplastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
- B32B37/206—Laminating a continuous layer between two continuous plastic layers
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は遮水型ゴム、プラスチック絶縁電カケープルに
使用する鉛ラミネートテープの製造方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a lead laminate tape used for waterproof rubber and plastic insulated electrical cables.
本発明者は先に遮水層付ゴム、プラスチック絶縁電カケ
ープルとして導体上あるいはケーブルコア上に鉛箔と導
電のゴム、またはプラスチックテープとのラミネートテ
ープからなる遮水層を設けた構造のものを提案した。The present inventor previously developed a rubber and plastic insulated cable with a water-blocking layer having a water-blocking layer made of a laminate of lead foil and conductive rubber or plastic tape on a conductor or cable core. Proposed.
この鉛ラミネートテープは厚さ２０〜１００μｍの鉛箔
の少くとも片面に、厚さ２０〜２００ｔａｒｎの導電性
のゴムまたはプラスチックテープを積層せしめたもので
あシ、該導電性のゴムまたはプラスチックテープはペー
スレノン１００重量部に対して導電性カーピンブラック
５０〜１２０重量部を配合し、体積固有抵抗を１０６Ω
−口取下にしたものを使用している。This lead laminated tape is made by laminating a conductive rubber or plastic tape with a thickness of 20 to 200 tar on at least one side of a lead foil with a thickness of 20 to 100 μm. 50 to 120 parts by weight of conductive carpin black is blended with 100 parts by weight of pacelenone, and the volume resistivity is 106Ω.
- You are using a product that has been withdrawn.
又ペースレジンとしてはアイオノマー、エチレンアクリ
ル酸共重合体、エチレン−アクリルアクリレート共重合
体、エチレン−酢ビ共重合体、イソプレンゴム等が用い
られる。As the paste resin, ionomer, ethylene acrylic acid copolymer, ethylene-acrylic acrylate copolymer, ethylene-vinyl acetate copolymer, isoprene rubber, etc. are used.
この鉛ラミネートテープを製造するには、上記の鉛箔の
片面又は両面に上記の導電性のゴムまたはプラスチック
テープを、その融点よシやや高めの温度にて加熱加圧し
て得ているものである。To manufacture this lead laminated tape, the above-mentioned conductive rubber or plastic tape is heated and pressed on one or both sides of the above-mentioned lead foil at a temperature slightly higher than its melting point. .
然しながらこの製造方法において次の如き問題を生ずる
ものであった。However, this manufacturing method has the following problems.
（１）導電性のゴムまたはプラスチックフィルムの融点
以上の温度で鉛と導電性のゴムまたはプラスチックフィ
ルムとを加熱加圧する際、加熱加圧ロール（以下熱圧ロ
ールとよぶ）にゴム、プラスチックフィルムが一部溶融
して接着するため、ロール表面を離型処理、例えばテフ
ロン被覆をしなければならない。(1) When heating and pressing lead and conductive rubber or plastic film at a temperature above the melting point of the conductive rubber or plastic film, the rubber or plastic film is Because the roll is partially melted and bonded, the roll surface must be subjected to release treatment, for example, coated with Teflon.
（２）導電性のゴムまたはプラスチックフィルムにはカ
ーゲンの凝集体によるブツがときたま存在しておυ、こ
のプツは鉛箔との加熱加圧時にも溶けずに残存するため
鉛箔に圧痕を生じ甚しい場合には鉛箔に貫通孔を生ずる
。(2) On conductive rubber or plastic films, lumps of cargen aggregates sometimes exist, and these lumps remain without melting even when heated and pressurized with lead foil, causing indentations on the lead foil. In severe cases, holes may be formed in the lead foil.
本発明は鉛箔と導電性のゴムまたはプラスチックフィル
ムとを熱圧ロールにて熱圧する際に、該ロールに接着せ
ず、鉛箔に貫通孔等を生じない鉛ラミネートテープの製
造方法を見出したものである。即ち本発明方法は鉛箔の
片面又は両面に、融点の異なる２種以上のプラスチック
フィルムを共押出ししてなるラミネートプラスチックフ
ィルムをその低融点プラスチックフィルム側をもって重
ね合せた後、この重ね合せ物を該低融点フィルムの融点
以上で他のプラスチックフィルムの融点以下の温度で加
熱圧着するものである。The present invention has discovered a method for producing lead laminated tape that does not adhere to the roll and does not create through holes in the lead foil when the lead foil and conductive rubber or plastic film are hot-pressed using a hot pressure roll. It is something. That is, in the method of the present invention, a laminated plastic film made by coextruding two or more types of plastic films with different melting points is superimposed on one or both sides of lead foil with the low melting point plastic film side, and then this superimposed product is The thermocompression bonding is carried out at a temperature above the melting point of the low melting point film and below the melting point of other plastic films.
本発明方法において鉛箔と共押出しラミネートフィルム
の低融点プラスチックフィルムとを該低融点プラスチッ
クフィルムの融点以上の温度で加熱加圧することによシ
鉛と低融点プラスチックフィルムが接着する。一方弁押
出したラミネートフィルムの高融点プラスチックフィル
ム側は熱圧ロール面に接するも、該ロールの温度が該フ
ィルムの融点以下の温度であるため、該フィルムとロー
ルとは接着するようなことがない。しかも共押しで融点
の異なるフィルムをインフレ成形しているためフィルム
は一体化している。In the method of the present invention, the lead foil and the low melting point plastic film of the coextruded laminate film are heated and pressed at a temperature higher than the melting point of the low melting point plastic film, thereby bonding the lead and the low melting point plastic film. On the other hand, the high melting point plastic film side of the extruded laminate film comes into contact with the hot pressure roll surface, but since the temperature of the roll is below the melting point of the film, the film and roll will not adhere to each other. . Moreover, because the films with different melting points are co-pressed and inflation-molded, the films are integrated.
このことは特にプラスチックフィルムが導電性を有する
場合には、その効果は大きいものである。その理由は前
記の如くカーボンブラックの凝集体によるブツは２種類
以上の導電性プラスチックフィルムを共押した場合、夫
々フィルム毎に異る位置に発生する。しかし鉛箔と該導
電性ラミネートプラスチックフィルムを加熱加圧すると
、鉛箔と接する低融点プラスチックフィルムは溶融する
が、他方の高融点プラスチックフィルムは溶融しないた
め、低融点プラスチックフィルム中に存在するブツはす
べて高融点プラスチックフィルム中へと移行して喰い込
むため必然的に鉛箔に圧痕等の被害を及ぼすことがない
。This effect is particularly significant when the plastic film has conductivity. The reason for this is, as mentioned above, that when two or more types of conductive plastic films are co-pressed, spots due to carbon black aggregates are generated in different positions for each film. However, when lead foil and the conductive laminated plastic film are heated and pressurized, the low melting point plastic film in contact with the lead foil melts, but the other high melting point plastic film does not, so the particles present in the low melting point plastic film are Since all of this transfers into the high melting point plastic film and bites into it, it inevitably causes no damage such as impressions on the lead foil.
なお共押出しする２種類以上のプラスチックフィルムの
融点の温度差は２°〜４０℃の範囲が望ましい。その、
温度差が２℃未満の場合にはラミネートテープ製造時の
温度をコントロールすることが困難であり、４０℃を越
した場合には共押しによるラミネートプラスチックフィ
ルムを製造することが困難となる。Note that the temperature difference in melting point of two or more types of plastic films to be coextruded is preferably in the range of 2° to 40°C. the,
If the temperature difference is less than 2°C, it will be difficult to control the temperature during production of the laminate tape, and if it exceeds 40°C, it will be difficult to produce a laminated plastic film by co-pressing.
次に本発明方法の実施例について説明する。Next, examples of the method of the present invention will be described.
図面に示す如く、２０μ厚の鉛箔１の両面に第１表に示
す導電性の低融点の導電プラスチックフィルム３，３′
と導電性の高融点の導電プラスチックフィルム４，４′
とを共押出してえた導電性プラスチックラミネートフィ
ルム２，２′を、その低融点プラスチックフィルム３．
３′側ヲモって重ね合せた後、この重ね合せ物を第１表
に示す温度に加熱された熱圧ロール５．５′にて加熱圧
着して本発明鉛ラミネートテープをえた。As shown in the drawing, conductive low melting point plastic films 3, 3' shown in Table 1 are coated on both sides of a 20μ thick lead foil 1.
and conductive high melting point conductive plastic film 4,4'
A conductive plastic laminate film 2, 2' obtained by co-extruding the low melting point plastic film 3.
After stacking on the 3' side, the stacked product was heat-pressed using a hot pressure roll 5.5' heated to the temperature shown in Table 1 to obtain a lead laminate tape of the present invention.
φ
なお熱圧ロール５は鉄の表面にクロームメッキを施した
ものを使用した。又６，６′は保持ロールである。φ Note that the hot press roll 5 was made of iron with chrome plating applied to its surface. Further, 6 and 6' are holding rolls.
本発明方法において、共押出した導電性のプラスチック
フィルムを使用するため熱圧ロールにプラスチックフィ
ルムが全く接着することがなかったが、比較例方法によ
る場合には、何れもプラスチックフィルムの一部が熱圧
ロールに接着した。In the method of the present invention, since a coextruded conductive plastic film was used, the plastic film did not adhere to the hot pressure roll at all, but in the case of the comparative example method, a part of the plastic film did not adhere to the hot pressure roll. Glued to pressure roll.
又導電性プラスチックフィルムには凝集カーＴＩ？ンブ
ラックによるブツがところどころに見られたが、本発明
方法によりえた鉛ラミネートテープにはその鉛面にブツ
による圧痕は全く見られなかった。しかし比較例方法に
よりえた鉛ラミネートテープにはその鉛面に圧痕が生じ
、貫通孔も見られた。Also, is there an aggregation car TI for conductive plastic film? Although some spots due to black were observed here and there, no indentation due to any spots was observed on the lead surface of the lead laminate tape obtained by the method of the present invention. However, the lead laminate tape obtained by the method of the comparative example had indentations on its lead surface and through holes were also observed.
以上詳述した如く本発明方法によればプラスチック面差
に鉛面に同等異状を呈することのない表面美麗な鉛プラ
スチックフィルムがエラれると共にその操作において熱
圧ロール等に特別な処理を施すことなく常時安定して製
造しうる等工業的に極めて有用である。As detailed above, according to the method of the present invention, a lead plastic film with a beautiful surface that does not exhibit the same abnormality as the lead surface due to the plastic surface difference can be produced without any special treatment on the hot pressure roll etc. during the operation. It is extremely useful industrially as it can be produced stably at all times.
図面は本発明方法による鉛ラミネートテープを示す概略
説明図である。
！・・・鉛テープ、２，２′・・・導電性プラスチック
ラミネートテープ、３，３′・・・低融点プラスチック
テープ、４．４７−・・高融点プラスチックチーブ、５
．５′・・・熱圧ロール。The drawing is a schematic illustration showing a lead laminated tape produced by the method of the present invention. ! ...Lead tape, 2,2'...Conductive plastic laminate tape, 3,3'...Low melting point plastic tape, 4.47-...High melting point plastic tube, 5
．． 5'...Hot pressure roll.
Claims (3)
のプラスチックフィルムを共押出してなるラミネートプ
ラスチックフィルムをその低融点プラスチックフィルム
側をもって重ねた後、この重ね合せ物を該低融点フィル
ムの融点以上で他のラミネートフィルムの融点以下の温
度で加熱圧着することを特徴とする鉛ラミネートテープ
の製造方法。(1) Laminate a laminated plastic film made by co-extruding two or more types of plastic films with different melting points on one or both sides of lead foil with the low melting point plastic film side, and then place this superimposed product on top of the low melting point film. A method for producing a lead laminate tape, which comprises heat-pressing at a temperature above the melting point and below the melting point of other laminate films.
の範囲内のものを用いることを特徴とする特許請求の範
囲第１項記載の鉛ラミネートフィルムの製造方法。(2) The melting point difference of the plastics to be coextruded is 2 to 40℃
A method for producing a lead laminate film according to claim 1, characterized in that a lead laminate film is used within the range of .
ｍ以下であることを特徴とする特許請求の範囲第１項記
載の鉛ラミネートテープの製造方法。(3) The volume resistivity of the laminate tape is 10^6Ωc
The method for manufacturing a lead laminate tape according to claim 1, wherein the lead laminate tape is less than or equal to m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59203627A JPS6179628A (en) | 1984-09-28 | 1984-09-28 | Manufacture of lead laminated tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59203627A JPS6179628A (en) | 1984-09-28 | 1984-09-28 | Manufacture of lead laminated tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6179628A true JPS6179628A (en) | 1986-04-23 |
| JPH0142820B2 JPH0142820B2 (en) | 1989-09-14 |
Family
ID=16477170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59203627A Granted JPS6179628A (en) | 1984-09-28 | 1984-09-28 | Manufacture of lead laminated tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6179628A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433473U (en) * | 1977-08-08 | 1979-03-05 | ||
| JPS5697048A (en) * | 1979-12-29 | 1981-08-05 | Matsushita Electric Works Ltd | Foundation material for roof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5176866A (en) * | 1974-12-27 | 1976-07-03 | Matsushita Electric Ind Co Ltd | DATSUSUISENTAKUKI |
-
1984
- 1984-09-28 JP JP59203627A patent/JPS6179628A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433473U (en) * | 1977-08-08 | 1979-03-05 | ||
| JPS5697048A (en) * | 1979-12-29 | 1981-08-05 | Matsushita Electric Works Ltd | Foundation material for roof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0142820B2 (en) | 1989-09-14 |
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