JPS6169838U - - Google Patents
Info
- Publication number
- JPS6169838U JPS6169838U JP15342284U JP15342284U JPS6169838U JP S6169838 U JPS6169838 U JP S6169838U JP 15342284 U JP15342284 U JP 15342284U JP 15342284 U JP15342284 U JP 15342284U JP S6169838 U JPS6169838 U JP S6169838U
- Authority
- JP
- Japan
- Prior art keywords
- package
- utility
- model registration
- chip
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はプリント基板に実装された従来のＩＣ
の冷却方法の一実施例を示す図、第２図はこの考
案によるＩＣをプリント基板に実装し冷却してい
る状態を示す図。
１はＩＣ、２はチツプ、３はリード線、４はパ
ツケージ、５は放熱板、６はプリント基板、７は
放熱体、８は通風孔である。尚、図中同一、ある
いは相当部分には同一符号を付して示してある。
Figure 1 shows a conventional IC mounted on a printed circuit board.
FIG. 2 is a diagram illustrating an embodiment of the cooling method according to the present invention, and FIG. 2 is a diagram illustrating a state in which an IC according to the invention is mounted on a printed circuit board and is being cooled. 1 is an IC, 2 is a chip, 3 is a lead wire, 4 is a package, 5 is a heat sink, 6 is a printed circuit board, 7 is a heat sink, and 8 is a ventilation hole. In the drawings, the same or corresponding parts are denoted by the same reference numerals.
Claims (1)
るためのリード線と、前記パツケージの内部にチ
ツプを有する集積回路において、上記プリント基
板と接する面と、この面と互いに対向する面との
両面に上記パツケージと一体に断面が凸状の複数
個の放熱体を設けたことを特徴とする集積回路。 (2) 上記パツケージの互いに対向する２つの面
に設けられた凸状の放熱体と上記チツプとの間に
位置する２ケ所にそれぞれ通風孔を設けたことを
特徴とする実用新案登録請求の範囲第(1)項記載
の集積回路。 (3) 上記凸状の放熱体と上記チツプとの間に位
置する２個所の、どちらか一方に通風孔を設けた
ことを特徴とする実用新案登録請求の範囲第(1)
項記載の集積回路。[Claims for Utility Model Registration] (1) In an integrated circuit having lead wires for mounting on a printed circuit board on the outer surface of a package and a chip inside the package, a surface in contact with the printed circuit board, and a mutual contact between this surface and An integrated circuit characterized in that a plurality of heat radiators each having a convex cross section are provided integrally with the package on both opposing surfaces. (2) The scope of the utility model registration claim, characterized in that ventilation holes are provided at two locations located between the chip and the convex heat sink provided on the two opposing surfaces of the package. The integrated circuit described in paragraph (1). (3) Utility model registration claim No. (1) characterized in that a ventilation hole is provided in one of the two locations located between the convex heat sink and the chip.
Integrated circuits as described in Section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15342284U JPS6169838U (en) | 1984-10-11 | 1984-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15342284U JPS6169838U (en) | 1984-10-11 | 1984-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6169838U true JPS6169838U (en) | 1986-05-13 |
Family
ID=30711444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15342284U Pending JPS6169838U (en) | 1984-10-11 | 1984-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169838U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014192284A (en) * | 2013-03-27 | 2014-10-06 | Nec Commun Syst Ltd | Electronic device |
-
1984
- 1984-10-11 JP JP15342284U patent/JPS6169838U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014192284A (en) * | 2013-03-27 | 2014-10-06 | Nec Commun Syst Ltd | Electronic device |
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