JPS6163855U - - Google Patents
Info
- Publication number
- JPS6163855U JPS6163855U JP14734384U JP14734384U JPS6163855U JP S6163855 U JPS6163855 U JP S6163855U JP 14734384 U JP14734384 U JP 14734384U JP 14734384 U JP14734384 U JP 14734384U JP S6163855 U JPS6163855 U JP S6163855U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting surface
- protective coating
- optical fiber
- covers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 claims description 3
- 239000011253 protective coating Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第1図及び第2図は本考案の一実施例の斜視図
及び断面図、第3図及び第4図は本考案の他の実
施例の斜視図及び断面図を示す。
1…LEDチツプ、21,22…リード端子、
3…接続線、41…保護被覆、42…光フアイバ
。
1 and 2 show a perspective view and a sectional view of one embodiment of the present invention, and FIGS. 3 and 4 show a perspective view and a sectional view of another embodiment of the invention. 1...LED chip, 2 1 , 2 2 ...Lead terminal,
3... Connection wire, 4 1 ... Protective coating, 4 2 ... Optical fiber.
Claims (1)
脂からなる保護被覆に一本若しくに多数本の光フ
アイバの一端を前記発光面に略垂直方向に連結し
たことを特徴とする光フアイバ付LEDランプ。 An LED lamp with an optical fiber, characterized in that one end of one or a plurality of optical fibers is connected to a protective coating made of a transparent synthetic resin that covers the light emitting surface of an LED chip in a direction substantially perpendicular to the light emitting surface. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14734384U JPS6163855U (en) | 1984-10-01 | 1984-10-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14734384U JPS6163855U (en) | 1984-10-01 | 1984-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6163855U true JPS6163855U (en) | 1986-04-30 |
Family
ID=30705572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14734384U Pending JPS6163855U (en) | 1984-10-01 | 1984-10-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6163855U (en) |
-
1984
- 1984-10-01 JP JP14734384U patent/JPS6163855U/ja active Pending
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