JPS6159378U - - Google Patents
Info
- Publication number
- JPS6159378U JPS6159378U JP14484284U JP14484284U JPS6159378U JP S6159378 U JPS6159378 U JP S6159378U JP 14484284 U JP14484284 U JP 14484284U JP 14484284 U JP14484284 U JP 14484284U JP S6159378 U JPS6159378 U JP S6159378U
- Authority
- JP
- Japan
- Prior art keywords
- electrical component
- circuit board
- printed circuit
- adhesive
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す分解斜視図、
第２図は本考案の一実施例を組み立てた断面図、
第３図は従来例を説明する断面図である。
１…プリント基板、２…半田デイツプ面、３…
部品実装面、４…接着剤注入口、６…スルーホー
ル、７…接続用ランド部、８…コンデンサ、１０
…凹部、１１…リードピン。
FIG. 1 is an exploded perspective view showing an embodiment of the present invention;
Figure 2 is a sectional view of an assembled embodiment of the present invention;
FIG. 3 is a sectional view illustrating a conventional example. 1...Printed circuit board, 2...solder dip surface, 3...
Component mounting surface, 4...Adhesive injection port, 6...Through hole, 7...Connection land portion, 8...Capacitor, 10
... recess, 11... lead pin.
Claims (1)
対向して穿設される接着剤注入用の穴より上記プ
リント基板と電気部品間に注入される接着剤によ
り上記電気部品を接着してなる電気部品の取付装
置。 Attachment of the electrical component by bonding the electrical component with adhesive injected between the printed circuit board and the electrical component through an adhesive injection hole formed opposite to the bottom surface of the electrical component to be mounted on the printed circuit board. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14484284U JPS6159378U (en) | 1984-09-25 | 1984-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14484284U JPS6159378U (en) | 1984-09-25 | 1984-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6159378U true JPS6159378U (en) | 1986-04-21 |
Family
ID=30703106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14484284U Pending JPS6159378U (en) | 1984-09-25 | 1984-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6159378U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014082325A (en) * | 2012-10-16 | 2014-05-08 | Toshiba Corp | Electronic apparatus, method for manufacturing electronic apparatus, and flexible printed circuit board |
-
1984
- 1984-09-25 JP JP14484284U patent/JPS6159378U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014082325A (en) * | 2012-10-16 | 2014-05-08 | Toshiba Corp | Electronic apparatus, method for manufacturing electronic apparatus, and flexible printed circuit board |