JPS6144904U - waveguide circuit - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第１図は従来の一般的な導波管回路の構造を示す斜視図
、第２図は従来のミリ波帯用の導波管回路め構造を示す
斜視図、第３図がその断面図、第４図はその熱膨張差を
生じた時の状態を示す断面図、第５図はこの考案による
導波管回路の一実施例を示す断面図、第６図はこの考案
の他の実施例を示す断面図であり、図中３は下側基板、
４は上側基板、５は角溝、６は接合面、８は空洞、９は
伝熱材である。 なお、図中同一、あるいは相当部分には同一符号を付し
て示してある。[Brief Description of the Drawings] Fig. 1 is a perspective view showing the structure of a conventional general waveguide circuit; Fig. 2 is a perspective view showing the structure of a conventional waveguide circuit for millimeter wave band; 3 is a sectional view of the waveguide circuit, FIG. 4 is a sectional view showing the state when the thermal expansion difference occurs, FIG. 5 is a sectional view of an embodiment of the waveguide circuit according to this invention, and FIG. It is a sectional view showing another embodiment of this invention, in which 3 is a lower substrate;
4 is an upper substrate, 5 is a square groove, 6 is a joint surface, 8 is a cavity, and 9 is a heat transfer material. It should be noted that the same or equivalent parts in the figures are indicated by the same reference numerals.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 分割可能な二つの部分から成る基板と、この基板の二つ
の部分同士の接合面のそれぞれ相対する位置に設けられ
、上記基板の二つの部分を接合した時に矩形断面の導波
管として作用する矩形断面の溝と、この溝に近接する部
分を除いて上記基板の二つの部分同士が直接接触しない
よう設けられた空間と、この空間内に置かれ、上記基板
の二つの部分同士にそれぞれ接し、かつ圧縮性ならびに
−伝熱性を有する材料で作られた伝熱材とから構成され
ることを特徴とする導波管回路。A substrate consisting of two parts that can be divided, and a rectangular shape that is provided at opposing positions on the joining surfaces of the two parts of this board and acts as a waveguide with a rectangular cross section when the two parts of the board are joined. a groove in the cross section, a space provided so that the two parts of the substrate do not come into direct contact with each other except for a part adjacent to the groove, and a space placed within this space and in contact with the two parts of the substrate, respectively, and a heat transfer material made of a material having compressibility and heat transfer properties.