JPS6142858U - 厚膜回路装置 - Google Patents

厚膜回路装置

Info

Publication number
JPS6142858U
JPS6142858U JP1984128395U JP12839584U JPS6142858U JP S6142858 U JPS6142858 U JP S6142858U JP 1984128395 U JP1984128395 U JP 1984128395U JP 12839584 U JP12839584 U JP 12839584U JP S6142858 U JPS6142858 U JP S6142858U
Authority
JP
Japan
Prior art keywords
circuit device
thick film
film circuit
alumina substrate
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984128395U
Other languages
English (en)
Inventor
真市 近田
崇 長坂
Original Assignee
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Priority to JP1984128395U priority Critical patent/JPS6142858U/ja
Publication of JPS6142858U publication Critical patent/JPS6142858U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】 第１・図は本考案の一実施例を示す部分平面図、第２図
及び第３図は本考案の説明に用いる部分断面図である。 １・・・アルミナ基板、２Ａ〜２Ｅ・・・導体、３Ａ〜
３Ｇ・・・電極、４・・・絶縁被膜、４Ａ〜４Ｃ・・・
延長被，膜、４ｄ：・・中間被膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. アルミナ基板上に複数の電極が形成され、これらの電極
    のうちで近接した異なる電極間のアルミナ基板上に所定
    形状のガラス膜が被着された厚膜回路装置。
JP1984128395U 1984-08-23 1984-08-23 厚膜回路装置 Pending JPS6142858U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984128395U JPS6142858U (ja) 1984-08-23 1984-08-23 厚膜回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984128395U JPS6142858U (ja) 1984-08-23 1984-08-23 厚膜回路装置

Publications (1)

Publication Number Publication Date
JPS6142858U true JPS6142858U (ja) 1986-03-19

Family

ID=30687023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984128395U Pending JPS6142858U (ja) 1984-08-23 1984-08-23 厚膜回路装置

Country Status (1)

Country Link
JP (1) JPS6142858U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425143A (ja) * 1990-05-21 1992-01-28 Matsushita Electric Ind Co Ltd 回路基板及び半導体装置
KR101143530B1 (ko) 2010-08-09 2012-05-09 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425143A (ja) * 1990-05-21 1992-01-28 Matsushita Electric Ind Co Ltd 回路基板及び半導体装置
KR101143530B1 (ko) 2010-08-09 2012-05-09 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 제조방법

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