JPS6141793A - Method and device for plating inside surface of cylindrical material - Google Patents
Method and device for plating inside surface of cylindrical materialInfo
- Publication number
- JPS6141793A JPS6141793A JP16234284A JP16234284A JPS6141793A JP S6141793 A JPS6141793 A JP S6141793A JP 16234284 A JP16234284 A JP 16234284A JP 16234284 A JP16234284 A JP 16234284A JP S6141793 A JPS6141793 A JP S6141793A
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- Prior art keywords
- plating
- plated
- plating solution
- port
- anode rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、円筒形状に形成された被めっき物の内側に強
制的にめっき液を送り込み、内側面のみにめっき被膜を
形成するめっき方法とそのめっき装置に関するものであ
る。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a plating method in which a plating solution is forcibly fed into the inside of a cylindrical object to be plated to form a plating film only on the inner surface. This article relates to the plating equipment.
従来、円筒形状に形成された被めっき物の内側面のみに
めっき被膜を形成する際には、第３図の概略断面図に示
すようなめっき装置が利用されている。Conventionally, when forming a plating film only on the inner surface of a cylindrical object to be plated, a plating apparatus as shown in the schematic cross-sectional view of FIG. 3 has been used.
第３図において、５１は上部のみが開放する箱形のめっ
き槽であって、このめっき槽５１は耐食性材料によって
作られており、その内部にはめっき液Ｗが収容されてい
る。そして、めっき槽５１の内部にはヒータ５２が配設
されており、めっき液Ｗの温度が所定の温度より低い場
合に作動して上昇させるようになっている。In FIG. 3, reference numeral 51 denotes a box-shaped plating tank that is open only at the top. The plating tank 51 is made of a corrosion-resistant material, and a plating solution W is stored therein. A heater 52 is disposed inside the plating tank 51 and is activated to raise the temperature of the plating solution W when it is lower than a predetermined temperature.
また、めっき槽５１の外側には循環パイプ５３が配設さ
れており、その一端はめっき槽５１の底部近傍に開口さ
れ、他端はめっき槽５１の上部に開口されている。そし
て、循環バイブ５３の途中にはめっき槽５１の底部側か
らポンプ５４および冷却機５５が順次設けられており、
めっき液Ｗの温度が所定の温度より高い場合にポンプ５
４および冷却機５５が作動して下降させるようになって
いる。Further, a circulation pipe 53 is disposed outside the plating tank 51, one end of which is opened near the bottom of the plating tank 51, and the other end opened at the top of the plating tank 51. A pump 54 and a cooler 55 are sequentially provided in the middle of the circulation vibrator 53 from the bottom side of the plating tank 51.
When the temperature of the plating solution W is higher than a predetermined temperature, the pump 5
4 and a cooler 55 are operated to lower it.
また、めっき槽５１のめっき液Ｗ中には温度センサ５６
が設けられており、ヒータ５２、ポンプ５４および冷却
機５５は温度センサ５６の検知信号によって制御される
ようになっている。In addition, a temperature sensor 56 is installed in the plating solution W in the plating tank 51.
A heater 52, a pump 54, and a cooler 55 are controlled by a detection signal from a temperature sensor 56.
そして、円筒状に形成された被めっき物Ｍの内側面のみ
にめっき被膜を形成する際には、めっき液Ｗを所定の温
度に維持しつつ、電圧供給源５７の陰極側に接続されて
いる物品支持具５８に被めっき物Ｍを支持してめっき液
Ｗ中に浸漬するとともに、被めっき物Ｍの内側に電圧供
給源５７の陽極側に接続されている陽極棒５９を接触し
ないように挿通せしめ、その後、両電極間に直流電流を
通電して被めっき物Ｍの内側面のみにめっき被膜を形成
している。When forming a plating film only on the inner surface of the cylindrical object to be plated M, the plating solution W is maintained at a predetermined temperature while being connected to the cathode side of the voltage supply source 57. The object M to be plated is supported on the article support 58 and immersed in the plating solution W, and the anode rod 59 connected to the anode side of the voltage supply source 57 is inserted into the inside of the object M without contact. After that, a direct current is passed between both electrodes to form a plating film only on the inner surface of the object M to be plated.
しかしながら、このようなめっき装置においては、円筒
形状の被めっき物Ｍをめっき液Ｗ中に浸漬し、陽極棒を
被めっき物Ｍの内側に挿通して直流電流を通電している
ため、析出するめっき被膜が被めっき物Ｍの両端部から
外側面に廻り込み、多量のめっき被膜が形成されること
はもとより、被めっき物Ｍをめっき液Ｗ中に浸漬してめ
っき処理が行われているため、多量のめっき液Ｗを必要
とする不具合がある。However, in such a plating apparatus, the cylindrical object M to be plated is immersed in the plating solution W, and the anode rod is inserted inside the object M to be plated and DC current is applied, so that the plating object M is deposited. Not only does the plating film wrap around from both ends of the object M to the outer surface, forming a large amount of plating film, but also because the plating process is performed by immersing the object M in the plating solution W. , there is a problem that a large amount of plating solution W is required.
従って、この発明は、上記の不具合を解消するためにな
されたもので、被めっき物の両端部をシールし、被めっ
き物の内側に陽極棒を挿通ずるとともに、強制的にめっ
き液を供給しつつめっき処理することにより、被めっき
物の外側面へのめっき被膜の析出を防止するとともに、
めっき液を必要最小限の保存量としたものである。Therefore, this invention was made to solve the above-mentioned problems, and it seals both ends of the object to be plated, inserts an anode rod inside the object, and forcibly supplies the plating solution. The plating process prevents the plating film from depositing on the outer surface of the object to be plated, and
The plating solution is stored in the minimum necessary amount.
すなわち、この発明に係る円筒形状物の内側面めっき方
法においては、円筒形状に形成された被めっき物の内側
面にめっき被膜を形成するに際し、被めっき物の内側に
陽極棒を接触しないように挿通するとともに、被めっき
物の両端面をシールせしめ、その後、被めっき物の内側
にめっき液を強制的に供給しつつ、電圧供給源の陽極側
に接続されている陽極棒と電圧供給源の陰極側に接続さ
れている被めっき物との間に直流電流を通電して、被め
っき物の内側面のみにめっき被膜を形成するようにした
ものである。That is, in the method for plating the inner surface of a cylindrical object according to the present invention, when forming a plating film on the inner surface of the cylindrical object to be plated, it is necessary to avoid contacting the anode rod with the inside of the object to be plated. The anode rod connected to the anode side of the voltage supply source and the voltage supply source are A direct current is passed between the cathode and the object to be plated, so that a plating film is formed only on the inner surface of the object.
また、この発明に係る円筒形状物の内側面めっき装置に
おいては、電圧供給源の陰極側に接続される円筒形状の
被めっき物を中間に支持する一対の保持具に、被めっき
物の内径より小さく、しかも電圧供給源の陽極側に接続
される陽極棒とめっき液の供給口および排出口を兼備す
る貫通口を設け、この貫通口の一方にめっき液を供給す
る供給管を接続するとともに、他方の貫通口にめっき液
を排出する排気管を接続せしめ、さらに、一対の保持具
に被めっき物を支持する部位にシール材を設けるととも
に、被めっき物の支持後において一対の保持具を締め付
けるための締付は手段を設けたものである。Furthermore, in the apparatus for plating the inner surface of a cylindrical object according to the present invention, a pair of holders that support the cylindrical object to be plated in the middle are connected to the cathode side of the voltage supply source. A small through-hole is provided that is connected to the anode side of the voltage supply source and serves as an anode rod and a plating solution supply and discharge port, and a supply pipe for supplying the plating solution is connected to one of the through-holes. An exhaust pipe for discharging the plating solution is connected to the other through-hole, and a sealing material is provided on the part of the pair of holders that supports the object to be plated, and the pair of holders are tightened after supporting the object to be plated. A means is provided for tightening.
かかる、円筒形状物の内側面めっき装置において、円筒
形状に形成された被めっき物の内側面のみにめっき被膜
を形成する際には、一対の保持具の中間に電圧供給源の
陰極側に接続されている被めっき物を支持し、締付は手
段によって一対の保持具を締め付けて被めっき物を固定
する０次に、電圧供給源の陽極側に接続されている陽極
棒を一対の保持具に形成されている一方の貫通口から挿
通し、被めっき物の内側面に接触しないよう陽極棒の先
端部を他方の貫通口に挿通して固定する。In such an apparatus for plating the inside surface of a cylindrical object, when forming a plating film only on the inside surface of the cylindrical object to be plated, a device is connected to the cathode side of the voltage supply source between the pair of holders. The object to be plated is supported, and the object to be plated is fixed by tightening the pair of holders using means. Next, the anode rod connected to the anode side of the voltage supply source is connected to the pair of holders. The anode rod is inserted through one of the through holes formed in the anode rod, and the tip of the anode rod is inserted through the other through hole and fixed so as not to contact the inner surface of the object to be plated.
つづいて、一方の貫通口に接続されている供給管から所
定の温度に調節されためっき液を供給し、被めっき物の
内部にめっき液を充満しつつ、他方の貫通口に接続され
ている排出管から排出させ、めっき液を順次循環させる
。その後、陽極棒と被めっき物との間に直流電流を所定
時間゛通電して、被めっき物の内側面のみにめっき被膜
が形成される。Next, a plating solution adjusted to a predetermined temperature is supplied from the supply pipe connected to one of the through-holes, and while the inside of the object to be plated is filled with the plating solution, the pipe is connected to the other through-hole. Discharge from the discharge pipe and circulate the plating solution sequentially. Thereafter, a direct current is passed between the anode rod and the object to be plated for a predetermined period of time, so that a plating film is formed only on the inner surface of the object to be plated.
以下、本発明の一実施例を図面に基づいて詳細に説明す
る。Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.
第１図は本発明に係る円筒形状物の内側面めっき装置の
概略系統図、第２図は本発明に係るめっき装置のめっき
処理部を拡大した断面図を示すものである。FIG. 1 is a schematic system diagram of an apparatus for plating the inner surface of a cylindrical object according to the present invention, and FIG. 2 is an enlarged sectional view of a plating processing section of the plating apparatus according to the present invention.
第１図および第２図において、１は上部のみが開放する
箱形のめっき槽であって、このめっき槽１は合成樹脂等
の耐食性材料によって作られており、その内部にはめっ
き液Ｗが収容されている。In FIGS. 1 and 2, 1 is a box-shaped plating tank with only the top open, and this plating tank 1 is made of a corrosion-resistant material such as synthetic resin, and the plating solution W is inside. It is accommodated.
また、このめっき槽１の内部にはヒータ２が配設されて
おり、めっき槽ｌ内のめっき液Ｗの温度が所定の温度よ
り低い場合に作動し、その温度を上昇させるようになっ
ている。Furthermore, a heater 2 is disposed inside the plating tank 1, and is activated when the temperature of the plating solution W in the plating tank 1 is lower than a predetermined temperature to raise the temperature. .
また、めっき槽１の外側には循環バイブ３が配設されて
おり、その一端はめっき槽１の底部近傍に接続され、他
端はめっき槽１の上部に開口されている。そして、Ｗｉ
環パイプ３の途中にはめっき槽ｌの底部側からポンプ４
および冷却機５が順次設けられており、めっき液Ｗの温
度が所定の温度より高くなった場合にポンプ４および冷
却機５が作動して下降させるようになっている。Further, a circulation vibrator 3 is disposed outside the plating tank 1, one end of which is connected near the bottom of the plating tank 1, and the other end opened at the top of the plating tank 1. And Wi
A pump 4 is inserted from the bottom side of the plating tank l in the middle of the ring pipe 3.
and a cooler 5 are sequentially provided, and when the temperature of the plating solution W becomes higher than a predetermined temperature, the pump 4 and the cooler 5 are activated to lower the plating solution W.
また、めっき槽１のめっき液Ｗ中には温度センサ６が設
けられており、ヒータ２、ポンプ４および冷却［５は温
度センサ６の検知信号によって制御されるようになって
いる。Further, a temperature sensor 6 is provided in the plating solution W of the plating tank 1, and the heater 2, pump 4, and cooling [5] are controlled by the detection signal of the temperature sensor 6.
また、めっき槽１の近傍には円筒形状に形成された被め
っき物Ｍの内側面Ｍａにめっき被膜（図示せず）を形成
するめっき処理部７が配設されている。このめっき処理
部７は第２図に示すように、下側に下方に向けて開放す
る円盤状の第１保持只８ａが配設されており、上側に中
実状の第２保持具８ｂが配設されている。そして、この
第１保持具８ａと第２保持具８ｂとによって一対の保持
具８ａ、８ｂを形成しており、両保持具８ａ、８ｂの中
間に電圧供給源９の陰極側に導線９ａによって接続され
ている被めっき物Ｍの支持するようになっている。Further, in the vicinity of the plating tank 1, a plating processing section 7 is provided that forms a plating film (not shown) on the inner surface Ma of the object M to be plated, which is formed in a cylindrical shape. As shown in FIG. 2, this plating processing section 7 is provided with a disk-shaped first holder 8a that opens downward on the lower side, and a solid second holder 8b on the upper side. It is set up. A pair of holders 8a and 8b is formed by the first holder 8a and the second holder 8b, and is connected to the cathode side of the voltage supply source 9 by a conductive wire 9a between the two holders 8a and 8b. It is designed to support the object M being plated.
また、第１保持具８ａの略中央部には被めっき物Ｍの内
径より小さく、しかもめっき液Ｗを供給する供給口と電
圧供給源９の陽極側に導線９ａによって接続される陽極
棒１０を押通する挿通口を兼備する第１貫通口１１が形
成されており、第２保持具８ｂの略中央部には被めっき
物Ｍの内径より小さく、しかもめっき液Ｗを排出する排
出口と陽極棒ｌＯを押通する挿通口を兼備する第２Ｎ通
口１２が形成されている。そして、この第２貫通口１２
には横方向に延びる第３貫通口１３が形成されていると
ともに、第２貫通口１２の上方には二つのシール材１４
ａ、１４ｂが設けられている。Further, approximately in the center of the first holder 8a, there is an anode rod 10 which is smaller than the inner diameter of the object M to be plated and which is connected to the supply port for supplying the plating solution W and the anode side of the voltage supply source 9 by a conductive wire 9a. A first through hole 11 is formed which also serves as an insertion hole for pushing through, and the second holder 8b has a discharge port smaller than the inner diameter of the object M to be plated and an anode in the approximate center thereof. A second N port 12 is formed which also serves as an insertion port through which the rod IO is pushed. And this second through hole 12
A third through hole 13 extending laterally is formed in the , and two sealing materials 14 are provided above the second through hole 12 .
a and 14b are provided.
これにより、陽極棒１０が押通され、めっき液Ｗが供給
された際に漏洩しないようになっている。This prevents leakage when the anode rod 10 is pushed through and the plating solution W is supplied.
また、第１保持具８ａと第２保持具８ｂの対向面には板
状のシール材１５ａ、１５ｂが設けられており、被めっ
き物Ｗの両端部が当接してシールするようになっている
。また、第１保持具８ａと第２保持具８ｂの間には二本
のガイド棒１６ａ１１６ｂが架設されており、その途中
にはそれぞれ二つの絶縁部材１７が設けられ、両端部に
はガイド捧１６ａ、１６ｂに螺設されるナンド１８が設
けられている。In addition, plate-shaped sealing materials 15a and 15b are provided on the opposing surfaces of the first holder 8a and the second holder 8b, so that both ends of the object W to be plated come into contact and are sealed. . Furthermore, two guide rods 16a116b are installed between the first holder 8a and the second holder 8b, and two insulating members 17 are provided in the middle of each of the guide rods 16a and 116b. , 16b are provided with a NAND 18 screwed onto them.
また、めっき槽１とめっき処理部７との間には供給管１
９が配設されており、その一端はめっき槽１の底部近傍
に接続され、他端は第１保持具８ａの第１貫通口１１に
接続されている。そして、この供給管１９の途中にはめ
っき槽１側からポンプ２０およびバルブ２が順次設けら
れており、ポンプ２０の作動によってめっき液Ｗが第１
保持具８ａに供給れるようになっている。Additionally, a supply pipe 1 is provided between the plating tank 1 and the plating processing section 7.
9 is provided, one end of which is connected near the bottom of the plating tank 1, and the other end connected to the first through hole 11 of the first holder 8a. A pump 20 and a valve 2 are sequentially provided in the middle of this supply pipe 19 from the plating tank 1 side, and the operation of the pump 20 supplies the plating solution W to the first
It can be supplied to the holder 8a.
また、めっき槽１とめっき処理部７との間には、排出管
２２が配設されており、その一端はめっき槽１の上方に
開口され、他端は第２保持具８ｂの第３貫通口１３に接
続されている。そして、この排出管２２の途中にはバル
ブ２３が設けられておリ、第３貫通口１３から排出され
るめっき液Ｗの排出量を調節するようになっている。Further, a discharge pipe 22 is arranged between the plating tank 1 and the plating processing section 7, one end of which is opened above the plating tank 1, and the other end is connected to the third through hole of the second holder 8b. It is connected to the port 13. A valve 23 is provided in the middle of this discharge pipe 22 to adjust the discharge amount of the plating solution W discharged from the third through hole 13.
また、めっき槽１の近傍にはバイパス管２４が配設され
ており、その一端はめっき槽１の上方に開口され、他端
は供給管１９のポンプ２０とバルブ２１の間に接続され
ている。そして、このバイパス管２４の途中にはバルブ
２５が設けられており、めっき処理後におけるめっき処
理部７へのめっき液Ｗの供給を必要としない場合にバル
ブ２１が閉ざされ、バルブ２５が開放されてめっき液Ｗ
がバイパス管２４を通過してめっきｉｆ １に戻るよう
になっている。Further, a bypass pipe 24 is arranged near the plating tank 1, one end of which is opened above the plating tank 1, and the other end is connected between the pump 20 and the valve 21 of the supply pipe 19. . A valve 25 is provided in the middle of this bypass pipe 24, and when the plating solution W does not need to be supplied to the plating processing section 7 after the plating processing, the valve 21 is closed and the valve 25 is opened. plating solution W
passes through the bypass pipe 24 and returns to the plating if1.
上記のように構成されためっき装置において、円筒形状
に形成された被めっき物Ｗの内側面）ｖｔａにめっき被
膜を形成する方法について説明する。In the plating apparatus configured as described above, a method for forming a plating film on the inner surface (vta) of the cylindrical object W to be plated will be described.
まず、第２図に示すように、一対の保持具８ａ、８ｂの
中間に電圧供給源９の陰極側に接続されている円筒形状
の被めっき物Ｍを支持して両端部をシールする。その際
、被めっき物Ｍの内径部に第１貫通口１１および第２貫
通口１２が位置するよう支持することが必要である。次
に、ガイド棒１６ａ、１６ｂを両者の保持具８ａ、８ｂ
の間に架設し、てナツト１８にて締め付けて被めっき物
Ｍを固定する。First, as shown in FIG. 2, a cylindrical object M to be plated connected to the cathode side of the voltage supply source 9 is supported between the pair of holders 8a and 8b, and both ends thereof are sealed. At that time, it is necessary to support the object M to be plated so that the first through hole 11 and the second through hole 12 are located at the inner diameter portion thereof. Next, the guide rods 16a and 16b are attached to both holders 8a and 8b.
The object M to be plated is fixed by installing it between the holes and tightening it with a nut 18.
つづいて、電圧供給源９の陽極側に接続されている陽極
棒１０を第２保持具８ｂの第２貫通口１２側から挿通し
、被めっき物Ｍの内側面Ｍａに接触しないよう陽極棒１
０の先端部を他方の第１貫通口１１に挿通して固定する
。Next, the anode rod 10 connected to the anode side of the voltage supply source 9 is inserted from the second through hole 12 side of the second holder 8b, and the anode rod 10 is inserted so as not to contact the inner surface Ma of the object M to be plated.
0 is inserted into the other first through hole 11 and fixed.
その後、ポンプ２０を作動させ、めっき槽１中の所定の
温度に調節されためっき液Ｗを供給管１９か゛ら被めっ
き物Ｍの内側に強制的に供給する。Thereafter, the pump 20 is operated to forcibly supply the plating solution W in the plating tank 1, which has been adjusted to a predetermined temperature, from the supply pipe 19 to the inside of the object M to be plated.
そして、被めっき物Ｍの内側に供給されためっき液Ｗは
、第２貫通口１２、第３貫通口１３および排出管２２通
過してめっき槽１に戻り、繰り返し循環させる。そして
、被めっき物Ｍの内側に供給されるめっき液Ｗの量は、
供給管１９に設けられているバルブ２１、排出管２２に
設けられているバルブ２３およびバイパス管２４に設け
られているバルブ２５の開閉度合によって調節される。Then, the plating solution W supplied to the inside of the object to be plated M passes through the second through hole 12, the third through hole 13, and the discharge pipe 22, returns to the plating tank 1, and is repeatedly circulated. The amount of plating solution W supplied to the inside of the object M to be plated is
It is adjusted by the opening/closing degree of the valve 21 provided in the supply pipe 19, the valve 23 provided in the discharge pipe 22, and the valve 25 provided in the bypass pipe 24.
そして、めっき液Ｗが循環されている状態で、陽極棒１
０と被めっき物Ｍとの間に所定に設定された直流電流が
通電され、被めっき物Ｍの内側面のみにめっき被膜が順
次形成される。その際、温度センサ６によってめっき液
Ｗの温度が検知されており、ジュール熱等によって所定
の温度より高くなった際にはポンプ４が作動してめっき
液Ｗが循環パイプ３から冷却機５に導入され、冷却され
た後、めっき槽１に戻される。また、めっき液Ｗの温度
が所定の温度より低くなった際にはヒータ２が作動して
めっき液Ｗが加熱され、所定の温度に設定される。そし
て、所定時間直流電流が通電され、被めっき物の内側面
のみにめっき被膜が形成された後、直流電流の通電およ
びめっき液の供給が停止されて一対の保持具８ａ、８ｂ
から取り出される。Then, while the plating solution W is being circulated, the anode rod 1
A predetermined direct current is passed between the object M and the object M to be plated, and a plating film is sequentially formed only on the inner surface of the object M to be plated. At this time, the temperature of the plating solution W is detected by the temperature sensor 6, and when the temperature rises above a predetermined temperature due to Joule heat, etc., the pump 4 is activated and the plating solution W is passed from the circulation pipe 3 to the cooler 5. After being introduced and cooled, it is returned to the plating tank 1. Further, when the temperature of the plating solution W becomes lower than a predetermined temperature, the heater 2 is activated to heat the plating solution W and set to a predetermined temperature. Then, after a DC current is applied for a predetermined period of time and a plating film is formed only on the inner surface of the object to be plated, the application of DC current and the supply of the plating solution are stopped, and the pair of holders 8a, 8b are stopped.
taken from.
以上に説明したように、本発明に係る円筒形状物の内側
面めっき方法およびそのめっき装置においては、被めっ
き物の両端部をシールし、被めっき物の上側に陽極棒を
押通するとともに、強制的にめっき液を供給しつつめっ
き処理するようにしたから、めっき処理中においてめっ
き液が被めっき物の外側面に廻り込むことがないので、
被めっき物の外側面へのめっき被膜の析出を防止するこ
とができる。As explained above, in the method for plating the inner surface of a cylindrical object and the plating apparatus thereof according to the present invention, both ends of the object to be plated are sealed, an anode rod is pushed through the upper side of the object to be plated, and Since the plating process is performed while the plating solution is forcibly supplied, the plating solution does not get around to the outer surface of the object to be plated during the plating process.
Precipitation of a plating film on the outer surface of the object to be plated can be prevented.
また、本発明においては、被めっき物をめっき液中に浸
漬してめっき処理する必要がないので、多量のめっき液
を必要とすることはな（、使用するめっき液量を大幅に
低減することができる効、果がある。In addition, in the present invention, since there is no need to immerse the object to be plated in the plating solution, a large amount of plating solution is not required (the amount of plating solution used can be significantly reduced). There are effects that can be achieved.
第１図は本発明に係る円筒形状物の内側面めっき装置の
概略系統図である。
第２図は本発明に係るめっき装置のめっき処理部の拡大
断面図である。
第３図は従来の円筒形状物の内側面めっき装置の概略断
面図である。
１−・・−めっき槽
７・・−・−めっき処理部
８ａ・・・・・・・第１保持具
８ｂ・・−・・・・第２保持具
９・−・・−・電圧供給源
１０−・・・−・−陽極棒
１１−・−・第１Ｎ通口
１２・・−・・・・第２貫通口
１３・・・・・・・・第３貫通口
１４ａ、１４ｂ・・−・−・・シール材１６ａ、１６
ｂ−−−−−ガイド棒
１８・・−・・・・・ナツト
１９・−・・・・・供給管
２０・−・・・・ポンプ
２２・・−・・・・・排出管
第２図FIG. 1 is a schematic system diagram of an apparatus for plating the inner surface of a cylindrical object according to the present invention. FIG. 2 is an enlarged sectional view of the plating processing section of the plating apparatus according to the present invention. FIG. 3 is a schematic cross-sectional view of a conventional plating apparatus for the inside surface of a cylindrical object. 1--Plating tank 7--Plating processing section 8a--First holder 8b--Second holder 9--Voltage supply source 10-...-Anode rod 11--First N port 12...Second through-hole 13...Third through-hole 14a, 14b...- ...Seal material 16a, 16
b--Guide rod 18... Nut 19... Supply pipe 20... Pump 22... Discharge pipe Fig. 2
Claims (2)
き被膜を形成するにあたり、前記被めっき物の内側に該
被めっき物に接触しないように陽極棒を挿通するととも
に、該被めっき物の両端面をシールせしめた後、被めっ
き物の内側のみにめっき液を強制的に供給しつつ、前記
陽極棒と陰極となる被めっき物との間に直流電流を通電
することを特徴とする円筒形状物の内側面めっき方法。(1) When forming a plating film on the inner surface of a cylindrical object to be plated, an anode rod is inserted into the inside of the object so as not to come into contact with the object, and After sealing both end faces of the anode rod, the plating solution is forcibly supplied only to the inside of the object to be plated, and a direct current is passed between the anode rod and the object to be plated, which becomes the cathode. A method for plating the inner surface of cylindrical objects.
に支持する一対の保持具に、被めっき物の内径より小さ
な陽極棒の挿通口とめっき液の給排出口を兼備する貫通
口を設け、この貫通口の一方にめっき液を供給する供給
管を接続するとともに、他方にめっき液を排出する排出
管を接続し、前記一対の保持具に被めっき物を支持する
部位にシール材を設けるとともに、一対の保持具に締付
け手段を設けたことを特徴とする円筒形状物の内側面め
っき装置。(2) A pair of holders that support a cylindrical object to be plated connected to the cathode side in the middle have a through hole that serves as an insertion port for an anode rod smaller than the inner diameter of the object to be plated and a plating solution supply/discharge port. A supply pipe for supplying the plating solution is connected to one of the through holes, and a discharge pipe for discharging the plating solution is connected to the other, and a sealing material is installed at the part where the object to be plated is supported by the pair of holders. An apparatus for plating the inner surface of a cylindrical object, characterized in that the pair of holders are provided with a tightening means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16234284A JPS6141793A (en) | 1984-07-31 | 1984-07-31 | Method and device for plating inside surface of cylindrical material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16234284A JPS6141793A (en) | 1984-07-31 | 1984-07-31 | Method and device for plating inside surface of cylindrical material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6141793A true JPS6141793A (en) | 1986-02-28 |
Family
ID=15752729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16234284A Pending JPS6141793A (en) | 1984-07-31 | 1984-07-31 | Method and device for plating inside surface of cylindrical material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6141793A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2685924A1 (en) * | 1992-01-07 | 1993-07-09 | Renault | Process and device for performing an electrolytic deposition and application to engine liners or cylinders |
| CN102828220A (en) * | 2012-09-18 | 2012-12-19 | 绍兴锋龙电机有限公司 | Perfusion type electronickelling and silicon carbide device for air cylinder |
| CN103614755A (en) * | 2013-12-09 | 2014-03-05 | 山西北方机械制造有限责任公司 | Liquid plating device for inner hole of slender pipe fitting |
-
1984
- 1984-07-31 JP JP16234284A patent/JPS6141793A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2685924A1 (en) * | 1992-01-07 | 1993-07-09 | Renault | Process and device for performing an electrolytic deposition and application to engine liners or cylinders |
| CN102828220A (en) * | 2012-09-18 | 2012-12-19 | 绍兴锋龙电机有限公司 | Perfusion type electronickelling and silicon carbide device for air cylinder |
| CN102828220B (en) * | 2012-09-18 | 2015-02-25 | 绍兴锋龙电机有限公司 | Perfusion type electronickelling and silicon carbide device for air cylinder |
| CN103614755A (en) * | 2013-12-09 | 2014-03-05 | 山西北方机械制造有限责任公司 | Liquid plating device for inner hole of slender pipe fitting |
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