JPS6138972U - Mounting structure of electronic components - Google Patents
Mounting structure of electronic componentsInfo
- Publication number
- JPS6138972U JPS6138972U JP12098784U JP12098784U JPS6138972U JP S6138972 U JPS6138972 U JP S6138972U JP 12098784 U JP12098784 U JP 12098784U JP 12098784 U JP12098784 U JP 12098784U JP S6138972 U JPS6138972 U JP S6138972U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- electronic components
- insulating sheet
- board
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面はこの考案の一実施例を示したもので、第１図は基
板Ｊ』Ｉチップおよび絶縁性シートの斜視図、第２図お
よび第３図は基板のＬＳＩチップを取付けた状態の平面
区および断面図である。
１・・・・・・基板、２・・・・・−ＬＳＩチップ、３
・・・・・・リード端子、４・・・・・・接続端子、６
・・・・・・絶縁性シート、７・・・・・・カーボン層
。The drawings show one embodiment of this invention. Figure 1 is a perspective view of the board J'I chip and the insulating sheet, and Figures 2 and 3 are plan views of the board with the LSI chip attached. and a cross-sectional view. 1... Board, 2...-LSI chip, 3
...Lead terminal, 4...Connection terminal, 6
...Insulating sheet, 7...Carbon layer.
Claims (1)
押付け固定する電子部品の取付構造において、前記基板
の接続端子上に電子部品のリード端子を重ね、このリー
ド端子とその周囲の基板面を、不織布の少なくとも基板
対向面側に高分子樹脂を含浸させた絶縁性シートで覆う
とともに、この絶縁性シートを、これに含浸させた洲分
子樹脂によって電子部品のリード端子およびその周囲の
基板面に接着したことを特徴とする電子部品の取付構造
。In an electronic component mounting structure in which a lead terminal of an electronic component is pressed and fixed to a connection terminal provided on a board, the lead terminal of the electronic component is stacked on the connection terminal of the board, and the lead terminal and the surrounding board surface are At least the side facing the substrate of the non-woven fabric is covered with an insulating sheet impregnated with a polymer resin, and this insulating sheet is covered with lead terminals of electronic components and the surrounding substrate surface using the polymer resin impregnated with the insulating sheet. A mounting structure for electronic components characterized by adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12098784U JPS6138972U (en) | 1984-08-07 | 1984-08-07 | Mounting structure of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12098784U JPS6138972U (en) | 1984-08-07 | 1984-08-07 | Mounting structure of electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6138972U true JPS6138972U (en) | 1986-03-11 |
Family
ID=30679782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12098784U Pending JPS6138972U (en) | 1984-08-07 | 1984-08-07 | Mounting structure of electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6138972U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249466A (en) * | 1975-10-20 | 1977-04-20 | Fujitsu Ltd | Method of forming solder mask |
| JPS5542518A (en) * | 1978-09-19 | 1980-03-25 | Nippon Tokkyo Kanri Kk | Preparation of cut rice cake |
| JPS5821391A (en) * | 1981-07-28 | 1983-02-08 | シャープ株式会社 | Device for mounting electronic part |
-
1984
- 1984-08-07 JP JP12098784U patent/JPS6138972U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249466A (en) * | 1975-10-20 | 1977-04-20 | Fujitsu Ltd | Method of forming solder mask |
| JPS5542518A (en) * | 1978-09-19 | 1980-03-25 | Nippon Tokkyo Kanri Kk | Preparation of cut rice cake |
| JPS5821391A (en) * | 1981-07-28 | 1983-02-08 | シャープ株式会社 | Device for mounting electronic part |
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