JPS6133465U - insulated metal substrate - Google Patents

insulated metal substrate

Info

Publication number
JPS6133465U
JPS6133465U JP11819684U JP11819684U JPS6133465U JP S6133465 U JPS6133465 U JP S6133465U JP 11819684 U JP11819684 U JP 11819684U JP 11819684 U JP11819684 U JP 11819684U JP S6133465 U JPS6133465 U JP S6133465U
Authority
JP
Japan
Prior art keywords
metal substrate
insulated metal
insulated
metal
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11819684U
Other languages
Japanese (ja)
Inventor
光司 大川
秀明 白井
道彦 吉岡
昭弘 石井
Original Assignee
三菱電線工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電線工業株式会社 filed Critical 三菱電線工業株式会社
Priority to JP11819684U priority Critical patent/JPS6133465U/en
Priority to US06/759,210 priority patent/US4695515A/en
Priority to US06/759,209 priority patent/US4767674A/en
Priority to CA000487695A priority patent/CA1232971A/en
Priority to CA000487694A priority patent/CA1225462A/en
Priority to CA000487703A priority patent/CA1240072A/en
Publication of JPS6133465U publication Critical patent/JPS6133465U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第１図は、金属箔を用いた実施例の断面図、第２図、第
３図は金属板を用いた実施例の断面図である。 １：金属箔、２：熱伝導性充てん剤含有電着絶縁層、３
：金属板。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of an embodiment using metal foil, and FIGS. 2 and 3 are sectional views of an embodiment using a metal plate. 1: Metal foil, 2: Electrodeposited insulating layer containing thermally conductive filler, 3
: Metal plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 熱伝導性充そん剤を含有する電着絶縁層を金属箔ないし
金属板に設けてなる絶縁金属基板。An insulated metal substrate comprising a metal foil or metal plate provided with an electrodeposited insulating layer containing a thermally conductive filler.
JP11819684U 1984-01-27 1984-07-30 insulated metal substrate Pending JPS6133465U (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP11819684U JPS6133465U (en) 1984-07-30 1984-07-30 insulated metal substrate
US06/759,210 US4695515A (en) 1984-07-30 1985-07-26 Metal cored board and method for manufacturing same
US06/759,209 US4767674A (en) 1984-01-27 1985-07-26 Metal cored board and method for manufacturing same
CA000487695A CA1232971A (en) 1984-07-30 1985-07-29 Metal cored board and method for manufacturing same
CA000487694A CA1225462A (en) 1984-07-30 1985-07-29 Aluminium cored board and method for manufacturing same
CA000487703A CA1240072A (en) 1984-07-30 1985-07-29 Metal cored circuit board with baked-on polymer layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11819684U JPS6133465U (en) 1984-07-30 1984-07-30 insulated metal substrate

Publications (1)

Publication Number Publication Date
JPS6133465U true JPS6133465U (en) 1986-02-28

Family

ID=30677084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11819684U Pending JPS6133465U (en) 1984-01-27 1984-07-30 insulated metal substrate

Country Status (1)

Country Link
JP (1) JPS6133465U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815375B2 (en) * 1975-04-28 1983-03-25 カブシキガイシヤ サト−ケンキユウシヨ mobile phone label insatsuharitsukeki
JPS58222593A (en) * 1982-02-24 1983-12-24 日立化成工業株式会社 Method of producing substrate for metal core-filled printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815375B2 (en) * 1975-04-28 1983-03-25 カブシキガイシヤ サト−ケンキユウシヨ mobile phone label insatsuharitsukeki
JPS58222593A (en) * 1982-02-24 1983-12-24 日立化成工業株式会社 Method of producing substrate for metal core-filled printed circuit board

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