JPS61293869A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS61293869A JPS61293869A JP13420985A JP13420985A JPS61293869A JP S61293869 A JPS61293869 A JP S61293869A JP 13420985 A JP13420985 A JP 13420985A JP 13420985 A JP13420985 A JP 13420985A JP S61293869 A JPS61293869 A JP S61293869A
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- conductive layer
- layer
- heat generating
- heating part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ワードプロセッサやファクシミリ等の記録出
力装置に用いられるサーマルヘッドに関し、特に熱転写
インクリボンを介して記録紙に記録するのに好適に用い
られるサーマルヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head used in a recording/output device such as a word processor or a facsimile, and is particularly suitable for use in recording on recording paper via a thermal transfer ink ribbon. Regarding the thermal head used.
第１図の平面図と第２図の断面図で示したようなサーマ
ルヘッドは知られている。A thermal head as shown in the plan view of FIG. 1 and the sectional view of FIG. 2 is known.
図において、１はＡＩ板等から成る放熱基板、２は放熱
基板１に固定されたアルミナ等のセラミックス板から成
るサーマルヘッド基板、３はサーマルヘッド基板２上に
５ｉ０２を主成分とするガラス粉末のスクリーン印刷を
行って、７００〜８００℃、で焼成して形成したグレー
ズ層、４はマスキング−によるバターニングとＴａ２Ｎ
等のスパッタもしくは電子ビーム蒸着とによってグレー
ズ層３上に例えば２４個を配列して形成した発熱体層、
５および６は対向している間が発熱体層４によって接続
されるようにパターニングとＡ１等のスパッタまたは蒸
着によって形成した信号電極および共通電極、７はＴａ
２０５ ＋ Ａｌ２Ｏ５あるいはＳｉＮ等のスパッタに
よって少くとも電極５，６が対向して両電極間を発熱体
Ｊ１４が接続している発熱部Ｈの表面を被覆するように
設けた絶縁性の保護層、８は両電極５，６間に信号電圧
を選択的に印加する図示してない制御部と接続するため
に所謂ビームリード方式等でそれぞれ信号電極５と共通
電極６に接続して設けたポンディングパッドである。な
お、通常、グレーズ層３は盛り上り部分の厚さ４０μｍ
程度、発熱体層４は厚さ５００Ｘ程度、信号電極５およ
び共通電極６は厚さ１〜２μｍ程度、保゛護層７は例え
ばＳｉＯ２とＴａ２０５の層から成るものでは５ｉ０２
の厚さ５０００ Ｘ程度とＴａ２０５の厚さ５ ｐｍ
程度に形成される。In the figure, 1 is a heat dissipation board made of an AI board etc., 2 is a thermal head board made of a ceramic plate such as alumina fixed to the heat dissipation board 1, and 3 is a glass powder mainly composed of 5i02 on the thermal head board 2. Glaze layer formed by screen printing and baking at 700-800℃, 4 is buttering by masking and Ta2N
A heating element layer formed by arranging, for example, 24 pieces on the glaze layer 3 by sputtering or electron beam evaporation,
5 and 6 are signal electrodes and common electrodes formed by patterning and sputtering or evaporation of A1 or the like so that the opposing sides are connected by the heating element layer 4; 7 is Ta.
205 + An insulating protective layer formed by sputtering of Al2O5 or SiN or the like to cover the surface of the heat generating part H, where at least the electrodes 5 and 6 face each other and the heat generating element J14 is connected between the two electrodes, 8 are bonding pads connected to the signal electrode 5 and the common electrode 6 by a so-called beam lead method or the like in order to connect to a control unit (not shown) that selectively applies a signal voltage between the electrodes 5 and 6. It is. Note that the glaze layer 3 usually has a thickness of 40 μm at the raised portion.
The heating element layer 4 has a thickness of about 500X, the signal electrode 5 and the common electrode 6 have a thickness of about 1 to 2 μm, and the protective layer 7 is, for example, 5i02 when made of layers of SiO2 and Ta205.
The thickness of Ta205 is about 5000X and the thickness of Ta205 is 5 pm.
Formed to a certain degree.
以上のような従来のサーマルヘッドを熱転写用接触によ
って両者に静電気が発生し、そのためにリボンＲやサー
マルヘッドの走行が円滑に行われなくなったシ、故障が
生じたりすることがある。When the conventional thermal head as described above comes into contact for thermal transfer, static electricity is generated between the two, which may prevent the ribbon R and the thermal head from running smoothly or cause a malfunction.
この静電気による問題を解消するためＫ、第３図に示し
たようにサーマルヘッド基板２のリボンＲが走行する方
向の両端側に導電性樹脂の除電部９を設けるようにした
ものが特開昭６０−３８１７６号公報によシ知られてい
る。なお、第２図、第３図に一点鎖線で示したＰはリボ
ンＲから熱転写印字される記録紙である。In order to solve this problem caused by static electricity, as shown in FIG. 3, a static eliminator 9 made of conductive resin is provided at both ends of the thermal head board 2 in the direction in which the ribbon R runs. It is known from the publication No. 60-38176. Note that P indicated by a dashed line in FIGS. 2 and 3 is a recording paper on which thermal transfer printing is performed from the ribbon R.
第３図に示したような導電性樹脂の除電部９を設けたサ
ーマルヘッドは、除電部９にリボンＲが接触することに
よシリポン只の帯電を除去するものであるが、リボンＲ
とサーマルヘッドの走行性に導電性樹脂の表面状態が大
きく関係して、リボンＲが蛇行したシ、記録紙Ｐとリボ
ンＲが走行する際にリボンＲがヘッドに引掛って、記録
紙Ｐとリボン只の間にスリップしたシし易い。また、第
２図あるいは第３図でサーマルヘッド基板２の位置を左
端が共通基板１の左端と殆んど一致するようにずらした
、そして発熱部ＨのリボンＲや記録紙Ｐに対する密着性
を上げると共にリボンＲの記録紙Ｐからの分離角を大き
くできるようにした、それＫよって荒紙に対しても鮮明
な記録を行い得る、最近のエツジタイプのサーマルヘッ
ドにあっては、第３図の左側の除電部９を設けることが
できず、右側の除電部９だけでは、発熱部Ｈの密着性が
高められて帯電し易くなることもあり、発熱部表面保護
層等の帯電によってリボンＲが記録紙Ｐから浮き上シ搦
まることかある。A thermal head equipped with a static eliminator 9 made of conductive resin as shown in FIG. 3 removes static electricity from the ribbon R by contacting the static eliminator 9 with the ribbon R.
The surface condition of the conductive resin has a large influence on the running performance of the thermal head, and the ribbon R may meander, and when the recording paper P and ribbon R run, the ribbon R may get caught on the head, causing the recording paper P and Easy to slip between ribbons. In addition, in FIG. 2 or 3, the position of the thermal head substrate 2 is shifted so that the left end almost coincides with the left end of the common substrate 1, and the adhesion of the heat generating part H to the ribbon R and the recording paper P is improved. In recent edge-type thermal heads, the angle of separation of the ribbon R from the recording paper P can be increased as well as the separation angle of the ribbon R from the recording paper P, and thus it is possible to record clearly even on rough paper. If the static eliminator 9 on the left side cannot be provided and only the static eliminator 9 on the right side is used, the adhesion of the heat generating part H may be increased and the ribbon R may be easily charged due to charging of the heat generating part surface protective layer, etc. Sometimes the paper may float up from the recording paper P.
導電性樹脂で除電部９を設ける代りに、放熱基板１の形
状を一体に除電部を有する形状とすることも行われるが
、静電気によるトラブルを十分には解消できないことに
ついては導電性樹脂で除電部９を設けたものと変らない
。Instead of providing the static eliminator 9 with conductive resin, the shape of the heat dissipation board 1 may be made to have a static eliminator integrally, but if the trouble caused by static electricity cannot be fully resolved, static eliminator 9 with conductive resin may be used. It is no different from the one with section 9 provided.
本発明は、上述のような従来のサーマルヘッドにおける
問題を解消するためになされたものであり、発熱部が端
にあるエツジタイプか中央部にあるタイプかに拘らず、
静電気によるトラブルや熱転写インクリボンの引掛り等
が発生することのないサーマルヘッドの提供を目的とし
てなされたものである。The present invention was made to solve the above-mentioned problems with conventional thermal heads, and regardless of whether the heat generating part is an edge type or a type in which the heat generating part is located in the center,
The purpose of this invention is to provide a thermal head that does not cause problems due to static electricity or the thermal transfer ink ribbon gets caught.
本発明は、１！極が対向し、対向電極間が発熱体層で接
続されて発熱部を形成したサーマルへラドにおいて、該
発熱部の表面が絶縁性保麺層で被覆されていて、該絶縁
性保護層上に導電層が設けられていることを特徴とする
サーマルヘッドにあり、この構成によって上記目的を達
成する。The present invention has 1! In a thermal heater in which the electrodes face each other and the opposing electrodes are connected by a heating element layer to form a heating part, the surface of the heating part is covered with an insulating noodle-retaining layer, and on the insulating protective layer. The thermal head is characterized by being provided with a conductive layer, and this structure achieves the above object.
以下１本発明を第４図の平面図と第５図の断面図で示し
た実施例によって説明する。The present invention will be explained below with reference to an embodiment shown in a plan view in FIG. 4 and a sectional view in FIG.
第４図と第５図における第１図乃至第３図と同一符号は
同一機能部材を示しておシ、保護層７の形成までは第１
図、第２図に示したサーマルヘッドにおけると変らない
。本発明のサーマルヘッドは、さらに保護層７の上に、
少くとも発熱部Ｈの表面の一部を被覆するように、導を
層ＩＯを設けたものである。導電層１０は、例えばメタ
ルマスクを用い、蒸着またはスパッタによｐ ｈｔやＯ
ｒのような金属、シリコンやＧｅのような半導体、酸化
インジウムのような金属酸化物を１００Ｘ〜１μｍ、好
ましくは２０００１程度の厚さに保護層７に付着させて
形成される。この導電層１０の好ましい厚さは、耐摩耗
性と発熱部Ｈの熱効率の点から求められたものである。The same reference numerals as in FIGS. 1 to 3 in FIGS. 4 and 5 indicate the same functional members.
This is the same as in the thermal head shown in FIGS. The thermal head of the present invention further includes, on the protective layer 7,
A conductive layer IO is provided so as to cover at least a part of the surface of the heat generating part H. The conductive layer 10 is formed by evaporation or sputtering using, for example, a metal mask.
The protective layer 7 is formed by depositing a metal such as R, a semiconductor such as silicon or Ge, or a metal oxide such as indium oxide to a thickness of 100× to 1 μm, preferably about 20,001 μm. The preferred thickness of the conductive layer 10 is determined from the viewpoints of wear resistance and thermal efficiency of the heat generating portion H.
そして、導電層１０を図示のように発熱部Ｈの表面より
も十分に広く設けると、それだけでも発熱部Ｈや熱転写
インクリボンＲ等の帯電電位が下って静電気によるトラ
ブルの発生が減少すると言う効果が得られる。しかし、
導電層１０を例えば釧ペーストを用いるなどして放電基
板ＩＶＣアースしたりすると、静電気によるトラブルの
発生防止効果は一層向上する。また、例えば、共通電極
６にリボンＲの帯電極性と同極性のＳＯＶ程度までの電
圧が印加され、信号電極５が選択的にオン、オフされて
発熱体層４の発熱が行゛われるようなサーマルヘッドに
あっては、保護層７に共通電極６に達するコンタクトホ
ールな形成して、コンタクトホールによって導電層１０
を共通電極６に接続し、導電層ｌＯに正または負の電圧
を印加するようにすると、別に電源を設けることなく効
果的に静電気によるトラブルの発生を防止できる。導電
層１０に正または負の電圧を印加する場合は、５０Ｖ程
度までの電圧、好ましくは１５Ｖまでの電圧とするのが
よい。If the conductive layer 10 is provided sufficiently wider than the surface of the heat generating part H as shown in the figure, the charging potential of the heat generating part H, the thermal transfer ink ribbon R, etc. will be lowered, and the occurrence of troubles due to static electricity will be reduced. is obtained. but,
If the conductive layer 10 is grounded to the discharge substrate IVC using, for example, a paste, the effect of preventing troubles caused by static electricity will be further improved. Further, for example, a voltage up to about SOV having the same polarity as the charging polarity of the ribbon R is applied to the common electrode 6, the signal electrode 5 is selectively turned on and off, and the heat generating layer 4 is heated. In the thermal head, a contact hole is formed in the protective layer 7 to reach the common electrode 6, and the conductive layer 10 is connected to the conductive layer 10 by the contact hole.
By connecting the conductive layer 10 to the common electrode 6 and applying a positive or negative voltage to the conductive layer 10, troubles caused by static electricity can be effectively prevented without providing a separate power source. When applying a positive or negative voltage to the conductive layer 10, the voltage is preferably up to about 50V, preferably up to 15V.
導電層１０は必ずしも発熱部Ｈの全面を被覆していカく
てもよい。すなわち、発熱部Ｈの全面を被覆する導電層
１０が長期間の使用によって最も熱転写インクリボンＲ
に接する部分が摩滅してしまっても、なお除電効果が余
り損われないことが確められている。The conductive layer 10 does not necessarily have to cover the entire surface of the heat generating part H. That is, the conductive layer 10 covering the entire surface of the heat generating part H becomes the most thermal transfer ink ribbon R after long-term use.
It has been confirmed that even if the parts in contact with the ion are worn away, the static elimination effect is not significantly impaired.
本発明によれば１発熱部や熱転写インクリボン等の帯電
が効果的に抑制されて、静電気等によるリボンやヘッド
の走行異常あるいは放電ノイズによる記録の誤作動等が
生ずることが無くなる。そして本発明は、発熱部を中央
部に設けたサーマルヘッドにも、発熱部を端に設けたサ
ーマルヘッドにも適用でき、そして、図示例のような縦
一列印字方式のシリアル方式サーマルヘッドに限らず、
発熱体層がマトリックス状に配置された桁逐次印字方式
のサーマルヘッドにも、あるいはヘッドを固定した状態
で記録するライン方式のサーマルヘッドにも適用できる
。According to the present invention, charging of the heat generating portion, the thermal transfer ink ribbon, etc. is effectively suppressed, and there is no possibility of abnormal running of the ribbon or head due to static electricity or the like, or malfunction of recording due to discharge noise. The present invention can be applied to a thermal head in which the heat generating part is provided in the center or a thermal head in which the heat generating part is provided at the end, and is limited to a serial type thermal head with a vertical single line printing method as shown in the example. figure,
It can be applied to a digit sequential printing type thermal head in which the heating layer is arranged in a matrix, or to a line type thermal head in which recording is performed with the head fixed.
さらに本発明のサーマルヘッドは、熱転写用に限らず、
感熱紙への記録用としても安定した記録や感熱紙の送り
等がなされることで相当の効果を奏する。Furthermore, the thermal head of the present invention is not limited to use for thermal transfer.
Even when used for recording on thermal paper, considerable effects can be achieved by stable recording and feeding of thermal paper.
第１図は従来のサーマルヘッドの例を示す平面図、第２
図は第１図のＸ−Ｘ矢視断面図、第３図は従来のサーマ
ルヘッドの他の例を示す側面図、第４図および第５図は
本発明サーマルヘッドの例を示す平面図およびＸ−Ｘ矢
視断面図である。
１・・・共通基板、 ２・・・絶縁基板、３・
・・グレーズ層、 ４・・・発熱体層、５・・・
信号電極、 ６・・・共通電極、？・・・保護
層、 １０・・・導を層。
特許出願人 小西六写真工業株式会社第ｆ図Figure 1 is a plan view showing an example of a conventional thermal head, Figure 2 is a plan view showing an example of a conventional thermal head.
The figure is a sectional view taken along the line X-X in FIG. 1, FIG. 3 is a side view showing another example of the conventional thermal head, and FIGS. It is a sectional view taken along the line X-X. 1... Common board, 2... Insulating board, 3...
...Glaze layer, 4...Heating element layer, 5...
Signal electrode, 6... common electrode, ? ...Protective layer, 10... Conductive layer. Patent applicant Konishiroku Photo Industry Co., Ltd. Figure f
Claims (3)
て発熱部を形成したサーマルヘッドにおいて、該発熱部
の表面が絶縁性保護層で被覆されていて、該絶縁性保護
層上に導電層が設けられていることを特徴とするサーマ
ルヘッド。(1) In a thermal head in which electrodes face each other and the opposing electrodes are connected by a heat generating layer to form a heat generating part, the surface of the heat generating part is covered with an insulating protective layer, and the surface of the heat generating part is covered with an insulating protective layer. A thermal head characterized in that a conductive layer is provided on the surface of the thermal head.
範囲第１項記載のサーマルヘッド。(2) The thermal head according to claim 1, wherein the conductive layer is used while being grounded.
れる特許請求の範囲第１項記載のサーマルヘッド。(3) The thermal head according to claim 1, which is used by applying a positive or negative voltage to the conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13420985A JPS61293869A (en) | 1985-06-21 | 1985-06-21 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13420985A JPS61293869A (en) | 1985-06-21 | 1985-06-21 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61293869A true JPS61293869A (en) | 1986-12-24 |
Family
ID=15122969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13420985A Pending JPS61293869A (en) | 1985-06-21 | 1985-06-21 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61293869A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62121945U (en) * | 1986-01-24 | 1987-08-03 | ||
| JPS63193853A (en) * | 1987-02-05 | 1988-08-11 | Mitsubishi Electric Corp | Thermal head |
| JPH02150365A (en) * | 1988-12-01 | 1990-06-08 | Mitsubishi Electric Corp | Thermal head and production thereof |
| JPH0479646U (en) * | 1990-11-21 | 1992-07-10 | ||
| US8063926B2 (en) * | 2008-08-29 | 2011-11-22 | Canon Kabushiki Kaisha | Thermal head and thermal printer |
-
1985
- 1985-06-21 JP JP13420985A patent/JPS61293869A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62121945U (en) * | 1986-01-24 | 1987-08-03 | ||
| JPH0644696Y2 (en) * | 1986-01-24 | 1994-11-16 | 日本電気株式会社 | Thermal head |
| JPS63193853A (en) * | 1987-02-05 | 1988-08-11 | Mitsubishi Electric Corp | Thermal head |
| JPH02150365A (en) * | 1988-12-01 | 1990-06-08 | Mitsubishi Electric Corp | Thermal head and production thereof |
| JPH0479646U (en) * | 1990-11-21 | 1992-07-10 | ||
| US8063926B2 (en) * | 2008-08-29 | 2011-11-22 | Canon Kabushiki Kaisha | Thermal head and thermal printer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59224372A (en) | Manufacture of printing head | |
| JP3603997B2 (en) | Thermal head and method for manufacturing thermal head | |
| JPS61293869A (en) | Thermal head | |
| JPS61154954A (en) | Thermal head | |
| US5917531A (en) | Thermal head and method of manufacturing the same | |
| JP4227799B2 (en) | Thermal head and manufacturing method thereof | |
| JP3169518B2 (en) | Thermal head | |
| JP2815338B2 (en) | Thick film type thermal head | |
| JPS62227763A (en) | Thermal head | |
| JP2002002005A (en) | Thick film type thermal printing head | |
| JP3472755B2 (en) | Thermal head and method of manufacturing the same | |
| JPH01113261A (en) | Thermal head | |
| JPH0557933A (en) | Structure of thermal print head | |
| JP2561133B2 (en) | Electrode structure of thermal head | |
| CA2031867A1 (en) | Method for manufacturing a thermal head | |
| JP2531696B2 (en) | Thermal head | |
| JPS63130367A (en) | Thermal head | |
| JP2582397B2 (en) | Thin-film thermal head | |
| JP2830837B2 (en) | Manufacturing method of thermal head | |
| JP2524302Y2 (en) | Thermal print head | |
| JP2580633Y2 (en) | Thermal head | |
| JPH079640Y2 (en) | Thermal head | |
| JPS6225068A (en) | Thermal printer head | |
| JP2533087B2 (en) | Thermal head | |
| JPH02266959A (en) | Thermal head |