JPS61288486A - Manufacture of ferrite imbedded type substrate - Google Patents
Manufacture of ferrite imbedded type substrateInfo
- Publication number
- JPS61288486A JPS61288486A JP13049685A JP13049685A JPS61288486A JP S61288486 A JPS61288486 A JP S61288486A JP 13049685 A JP13049685 A JP 13049685A JP 13049685 A JP13049685 A JP 13049685A JP S61288486 A JPS61288486 A JP S61288486A
- Authority
- JP
- Japan
- Prior art keywords
- ferrite
- alumina
- sintered
- substrate
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Reversible Transmitting Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[産業上の利用分野コ
本発明は、アルミナセラミック基板中にフェライトを埋
込み、その表面に所望の導電パターンを形成して回路を
構成する基板の製造方法に関し、特に限定されるもので
はないが、例えばフェライト埋込み形サーキュレータ等
を構成するに好適な基板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a circuit board in which a circuit is constructed by embedding ferrite in an alumina ceramic substrate and forming a desired conductive pattern on the surface thereof. The present invention relates to a method of manufacturing a substrate suitable for configuring, for example, a ferrite-embedded circulator, etc., although the present invention is not limited thereto.
[従来の技術]
アルミナセラ、ミックス基板にフェライト円板た所謂「
フェライト埋込み形サーキュレータ」は従来公知である
。この種のサーキユレータは、基板をフェライトのみで
構成したモノリシンクタイプのサーキユレータに比べて
アルミナセラミックスの誘電損失(tanδ)がフェラ
イト材料より小さいので低損失であるし、ミキサやアイ
ソレータ等を一体的に構成して集積回路化することも可
能である利点を有するため注目されている技術である。[Conventional technology] Alumina ceramic, mixed substrate with ferrite disk, so-called "
"Ferrite embedded circulators" are conventionally known. This type of circulator has a lower loss than a monolithic type circulator whose substrate is made of ferrite only because the dielectric loss (tan δ) of alumina ceramics is smaller than that of ferrite material, and mixers, isolators, etc. are integrated. This technology is attracting attention because it has the advantage of being able to be integrated into integrated circuits.
フェライト円板をアルミナ基板に埋込むのに、゛従来、
次の二通りの方法が開発されている。その一つは第3図
Aに示すように、焼結済のアルミナ基板lOに円形の穴
12を形成し、テーパー加工した焼結済フェライト円板
14を前記穴12に圧入嵌着させる方法である。他の一
つは第3図Bに示すように、焼結済フェライト円板14
を焼結済アルミナ基板10に形成した穴12内に嵌入し
、両者をガラス等の接着剤で固定する方法である。In order to embed a ferrite disk in an alumina substrate, conventionally,
Two methods have been developed: One method is to form a circular hole 12 in a sintered alumina substrate lO and press-fit a tapered sintered ferrite disk 14 into the hole 12, as shown in FIG. 3A. be. The other one is a sintered ferrite disk 14 as shown in FIG. 3B.
In this method, the sintered alumina substrate 10 is fitted into a hole 12 formed in the sintered alumina substrate 10, and both are fixed with an adhesive such as glass.
[発明が解決しようとする問題点]
この種のサーキュレータにおいては、損失はフェライト
円板とアルミナ基板に形成した穴との嵌合度合の良否に
よって大きく左右される。[Problems to be Solved by the Invention] In this type of circulator, the loss largely depends on the degree of fit between the ferrite disk and the hole formed in the alumina substrate.
そこで前者、即ちテーパー加工による圧入嵌着の場合、
良好な特性を発現させ信頼性を高めるためにはフェライ
ト円板およびアルミナ基板の穴は1〜3μm程度の精度
で仕上げなければならない。このためレーザービームに
よるアルミナ基板の穴あけ加工、およびダイヤモンド砥
石による精密研削加工を行わなければならないし、フェ
ライト円板も同様にダイヤモンド砥石等により所定の精
度でテーパー加工を行わねばならない。そのためコスト
がかかるし生産性が悪い欠点がある。Therefore, in the case of the former, that is, press-fitting by taper processing,
In order to exhibit good characteristics and increase reliability, the holes in the ferrite disk and alumina substrate must be finished with an accuracy of about 1 to 3 μm. For this reason, the alumina substrate must be drilled with a laser beam and precision ground with a diamond grindstone, and the ferrite disk must also be tapered to a predetermined precision using a diamond grindstone or the like. Therefore, it has disadvantages of high cost and poor productivity.
また後者、即ち接着剤による固定方法の場合も同様にか
なりの加工精度を必要とするし、接着剤を用いるためど
うしても熱に弱く信頼性に欠けるという問題がある。Furthermore, the latter method of fixing using adhesive similarly requires considerable processing precision, and since adhesive is used, it is inevitably susceptible to heat and lacks reliability.
本発明の目的は上記のような従来技術の欠点を解消し、
アルミナ・シートとフェライト材料の嵌め合いにさほど
厳密な精度が要求されず、アルミナ材料の穴あけ加工も
容易であり、アルミナ材料とフェライト材料との結合強
度が高くまた電磁気的特性のばらつきが少ないようなフ
ェライト埋込み形基板の製造方法を提供すみことにある
。The purpose of the present invention is to eliminate the drawbacks of the prior art as described above,
The fit between the alumina sheet and the ferrite material does not require very strict precision, the alumina material is easy to drill, the bonding strength between the alumina material and the ferrite material is high, and there is little variation in electromagnetic properties. An object of the present invention is to provide a method for manufacturing a ferrite-embedded substrate.
[問題点を解決するための手段]
上記のような目的を達成できる本発明は、低温焼結アル
ミナ材料からなる非焼結シートに穴を形成し、該穴に焼
結済フェライトを嵌め込み、低温で焼結することにより
一体化するようにしたフェライト埋込み形基板の製造方
法である。[Means for Solving the Problems] The present invention, which can achieve the above objects, forms holes in a non-sintered sheet made of low-temperature sintered alumina material, fits sintered ferrite into the holes, and This is a method of manufacturing a ferrite-embedded substrate that is integrated by sintering.
アルミナ粉体にホウケイ酸ガラス粉末を混合すると80
0〜900℃程度の比較的低温で焼結させることが°で
きること、また原料粉体の粒度を2〜3μm以下に調整
することにより通常′のアルミナ焼結体と同等の強度が
得られることが分かっている。When borosilicate glass powder is mixed with alumina powder, 80
It is possible to sinter at a relatively low temperature of about 0 to 900°C, and by adjusting the particle size of the raw material powder to 2 to 3 μm or less, it is possible to obtain the same strength as a normal alumina sintered body. I know it.
第1図Aに示すように、本発明ではこのガラス混合アル
ミナ材料のグリーン(未焼結)シート2oにフェライト
材料を埋込むための所定寸法の穴22を形成する。これ
は例えば所定形状の金型を用いプレスで打ち抜くことに
よって穴と基板外縁を同時に所定形状に成形できる。そ
して予め焼結した前記穴20よりもやや大きい形状のフ
ェライト板24を前記アルミナ未焼結シートに形成した
穴に嵌め込む(同図B参照)。As shown in FIG. 1A, in the present invention, a hole 22 of a predetermined size is formed in the green (unsintered) sheet 2o of the glass-mixed alumina material for embedding the ferrite material. For example, the hole and the outer edge of the substrate can be simultaneously formed into a predetermined shape by punching with a press using a mold having a predetermined shape. Then, a ferrite plate 24, which has been sintered in advance and has a shape slightly larger than the hole 20, is fitted into the hole formed in the unsintered alumina sheet (see Figure B).
次いで800〜900℃程度の低い温度でガラス−アル
ミナ材を焼結し、フェライト板と結合一体化するのであ
る。Next, the glass-alumina material is sintered at a low temperature of about 800 to 900°C, and is bonded and integrated with the ferrite plate.
その後、焼結して得たフェライト埋込み形基板26の表
面を同図Cに示すように、砥石車28等を用いて平面研
削し、金メッキ等を施すことによって所定形状の導電パ
ターン30を形成する(同図り参照)。Thereafter, the surface of the ferrite-embedded substrate 26 obtained by sintering is ground using a grinding wheel 28 or the like, as shown in FIG. (See the same diagram).
使用するフェライトとしては必要な電磁気的特性に見合
ったものを用いればよく、例えばYIG等の円板のフェ
ライト材料を用いることがアルミナ・シートに複数の穴
を形成し、それらにフェライト材料を埋込めば、複数の
回路素子を同時に形成でき、ミキサやアイソレータ・サ
ーキュレータ等を一体的に構成した集積回路も実現でき
る。The ferrite to be used should be one that matches the required electromagnetic properties. For example, using a disc-shaped ferrite material such as YIG is a method in which multiple holes are formed in an alumina sheet and the ferrite material is embedded in them. For example, a plurality of circuit elements can be formed at the same time, and an integrated circuit in which mixers, isolators, circulators, etc. are integrated can also be realized.
し作用]
アルミナ・シートへの穴の形成は未焼結の状態で行うた
めプレス等によって高精度で極めて容易に行なえる。ま
たフェライト板は、予め所定の高い温度で焼結したもの
であるから充分な電磁気的特性を発揮し得る。また再度
の焼結は、低温度で行われるからフェライトに悪影響を
与えることはない。Effect] Since holes are formed in the alumina sheet in an unsintered state, it can be done extremely easily with high precision using a press or the like. Further, since the ferrite plate is sintered in advance at a predetermined high temperature, it can exhibit sufficient electromagnetic properties. Further, since the re-sintering is performed at a low temperature, it does not have any adverse effect on the ferrite.
低温度でアルミナ・シートを焼結すると、内部に含まれ
ているガラスの接着力と、焼結時におけるシートの収縮
作用によってフェライトとアルミナ基板とは充分な強度
で隙間なく接合できる。アルミナ・シートは収縮するか
らフェライト材料さえ所定の充分な精度に成形しておけ
精度がなくても良好な結果がもたらされる。When the alumina sheet is sintered at a low temperature, the ferrite and alumina substrate can be bonded with sufficient strength and without gaps due to the adhesive strength of the glass contained inside and the shrinkage of the sheet during sintering. Since the alumina sheet shrinks, even the ferrite material can be formed to a certain sufficient degree of precision that good results can be obtained even without precision.
[実施例]
粒径1〜3μm以下のアルミナ粉体と粒径1〜3μm以
下のホウケイ酸ガラス(S i O*70重量%、Bz
Oa26重量%、 Nag 02重量%、AIto3を
重量%、K101重量%)をほぼ等重量比で配合した。[Example] Alumina powder with a particle size of 1 to 3 μm or less and borosilicate glass (S i O * 70% by weight, Bz
26% by weight of Oa, 2% by weight of Nag, 2% by weight of AIto3, and 1% by weight of K) were blended in approximately equal weight ratios.
このアルミナ粉体とホウケイ酸ガラスとの混合物59.
5重量%に対して、バインダとしてエチルアルコール3
3重量%、ポリビニルアルコール5.5重量%、フタル
酸ジプチル2重量%を加え、アルミナボールを入れたポ
リエチレン製ポット中で20時間混合した。混合したス
ラリーをドクターブレード法により所定の厚さく1〜2
mm)のアルミナ・シートを作成した。次に室温から1
00℃まで徐々に昇温し、バインダを除去した後、金型
を用いてプレスにより所定形状に打ち抜いた。この場合
アルミナ・シートの穴はフェライト円板より約0.01
”0.02mm程度径を小さくした。A mixture of this alumina powder and borosilicate glass59.
5% by weight, 3% ethyl alcohol as binder
3% by weight, 5.5% by weight of polyvinyl alcohol, and 2% by weight of diptylphthalate were added and mixed for 20 hours in a polyethylene pot containing alumina balls. Pour the mixed slurry into a predetermined thickness of 1 to 2 using the doctor blade method.
An alumina sheet of mm) was prepared. Next, from room temperature to 1
After gradually raising the temperature to 00° C. and removing the binder, it was punched into a predetermined shape by pressing using a mold. In this case, the hole in the alumina sheet is approximately 0.01 smaller than the ferrite disk.
``The diameter was reduced by about 0.02 mm.
他方、予め所定寸法に加工したYIG (イツトリウム
−鉄−ガーネット)系の焼結済のフェライト円板を前記
アルミナ未焼結シートに形成した穴に嵌め込み、800
〜900℃で1〜2時間焼結を行った。On the other hand, a sintered YIG (yttrium-iron-garnet)-based ferrite disk, which had been pre-processed to a predetermined size, was fitted into the hole formed in the alumina unsintered sheet.
Sintering was carried out at ~900°C for 1-2 hours.
焼結後、基板表面を平滑に研削加工した後、金メッキお
よびエツチング等の手法によりストリップ線路の形成を
行った。After sintering, the substrate surface was ground to make it smooth, and then strip lines were formed by gold plating, etching, and other methods.
アルミナ基板とYIGフェライトの特性を第1表に示す
。Table 1 shows the characteristics of the alumina substrate and YIG ferrite.
第1表
第2図はこのようにして得られた埋込み形マイクロスト
リップサーキエレータの特性の一例を示す線図である。Table 1 and FIG. 2 are diagrams showing an example of the characteristics of the embedded microstrip circulator thus obtained.
[発明の効果]
本発明は焼結したフェライト材料を未焼結の低温焼結ア
ルミナ材料のシートに形成した穴に嵌め込み低温焼結し
て一体化する方法であるから、アルミナ未焼結シートと
フェライト円板の嵌め合いの精度は比較的ゆるくでよく
、しかもアルミナ・シートの穴あけ加工は未焼結の状態
で行うため極めて容易であるし、焼結後のアルミナ材料
とフェライト材料との接合強度は充分高く、また両者に
隙間が生じないから特性のばらつきが減少するし、従来
のテーバ加工による嵌合方式や接着剤による固定方式等
に比べて量産性に富みコストの大幅な低減が可能である
等すぐれた効果を有するものである。[Effects of the Invention] The present invention is a method of fitting a sintered ferrite material into a hole formed in a sheet of an unsintered low-temperature sintered alumina material and sintering it at a low temperature to integrate it. The accuracy of the fit between the ferrite disks only needs to be relatively loose, and drilling in the alumina sheet is extremely easy since it is done in an unsintered state, and the bonding strength between the alumina material and the ferrite material after sintering is very low. is sufficiently high, and since there is no gap between the two, variations in characteristics are reduced, and compared to conventional mating methods using taber processing or fixing methods using adhesives, it is easier to mass produce and can significantly reduce costs. It has some excellent effects.
第1図は本発明方法を適用したフェライト埋込み形サー
キュレータの製造手順を示す説明図、第2図は本発明に
より得られたサーキュレータの特性の一例毫示す線図、
第3図A、Bはそれ20・・・低温焼結アルミナ未焼結
シート、22・・・穴、24・・・焼結済フェライト円
板、26・・・フェライト埋込み形基板、30・・・導
電パターン。
特許出願人 富士電気化学株式会社
代 理 人 茂 見 積第1図
A
第2図
A 第3図 BFIG. 1 is an explanatory diagram showing the manufacturing procedure of a ferrite-embedded circulator to which the method of the present invention is applied, and FIG. 2 is a diagram showing an example of the characteristics of the circulator obtained by the present invention.
3A and B are 20...low-temperature sintered alumina unsintered sheet, 22...hole, 24...sintered ferrite disk, 26...ferrite embedded type substrate, 30...・Conductive pattern. Patent applicant Fuji Electrochemical Co., Ltd. Agent Shigeru Estimate Figure 1A Figure 2A Figure 3B
Claims (1)
形成し、該穴に焼結済フェライトを嵌め込み、低温で焼
結することにより結合一体化することを特徴とするフェ
ライト埋込み形基板の製造方法。1. A ferrite-embedded substrate characterized in that a hole is formed in a non-sintered sheet made of a low-temperature sintered alumina material, a sintered ferrite is fitted into the hole, and the ferrite is integrated by sintering at a low temperature. Production method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13049685A JPS61288486A (en) | 1985-06-15 | 1985-06-15 | Manufacture of ferrite imbedded type substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13049685A JPS61288486A (en) | 1985-06-15 | 1985-06-15 | Manufacture of ferrite imbedded type substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61288486A true JPS61288486A (en) | 1986-12-18 |
Family
ID=15035655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13049685A Pending JPS61288486A (en) | 1985-06-15 | 1985-06-15 | Manufacture of ferrite imbedded type substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61288486A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6025759A (en) * | 1997-06-26 | 2000-02-15 | Nec Corporation | Microwave integrated circuit including surface mounting type isolator |
US6127907A (en) * | 1997-11-07 | 2000-10-03 | Nec Corporation | High frequency filter and frequency characteristics regulation method therefor |
US6437654B2 (en) | 1997-11-19 | 2002-08-20 | Nec Corporation | Substrate-type non-reciprocal circuit element and integrated circuit having multiple ground surface electrodes and co-planar electrical interface |
US6504444B1 (en) | 1997-11-07 | 2003-01-07 | Nec Corporation | High frequency integrated circuit including an isolator and dielectric filter |
CN110571503A (en) * | 2019-11-05 | 2019-12-13 | 成都八九九科技有限公司 | Microstrip circulator, isolator and T/R assembly |
-
1985
- 1985-06-15 JP JP13049685A patent/JPS61288486A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6025759A (en) * | 1997-06-26 | 2000-02-15 | Nec Corporation | Microwave integrated circuit including surface mounting type isolator |
US6127907A (en) * | 1997-11-07 | 2000-10-03 | Nec Corporation | High frequency filter and frequency characteristics regulation method therefor |
US6504444B1 (en) | 1997-11-07 | 2003-01-07 | Nec Corporation | High frequency integrated circuit including an isolator and dielectric filter |
US6437654B2 (en) | 1997-11-19 | 2002-08-20 | Nec Corporation | Substrate-type non-reciprocal circuit element and integrated circuit having multiple ground surface electrodes and co-planar electrical interface |
CN110571503A (en) * | 2019-11-05 | 2019-12-13 | 成都八九九科技有限公司 | Microstrip circulator, isolator and T/R assembly |
CN110571503B (en) * | 2019-11-05 | 2020-02-04 | 成都八九九科技有限公司 | Microstrip circulator, isolator and T/R assembly |
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