JPS61280697A - Hybrid integrated circuit board - Google Patents
Hybrid integrated circuit boardInfo
- Publication number
- JPS61280697A JPS61280697A JP10639585A JP10639585A JPS61280697A JP S61280697 A JPS61280697 A JP S61280697A JP 10639585 A JP10639585 A JP 10639585A JP 10639585 A JP10639585 A JP 10639585A JP S61280697 A JPS61280697 A JP S61280697A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- hybrid integrated
- magnetic substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(イ)産業上の利用分野
本発明は混成集積回路基板、特にモータ用混成集積回路
基板に関する。DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a hybrid integrated circuit board, particularly a hybrid integrated circuit board for motors.
(ロ)従来の技術
従来の集積回路基板は第4図に示す如く、アルミニウム
基板(財)の少なくとも一つの表面を全面に亘って陽極
酸化処理を行ない基板上に酸化アルミニウム薄層翰を形
成する工程と、この酸化アルミニウム薄層器上に抵抗体
物質および良導電性物質を選択的に付着形成して導電路
、導線固着部翰および抵抗体(財)、(財)などの回路
素子を形成する工程と、良導電体を選択的に付着して形
成したリード部(ホ)上にトランジスタ・ペレット(ハ
)背接着する工程と、図示しないが外部導線を導線固着
部翰に接続し次いで、少なくとも回路素子−、(財)、
(イ)などをエポキシ樹脂等の絶縁性樹脂で封止する工
程を行なっていた。(B) Prior Art As shown in Figure 4, a conventional integrated circuit board is manufactured by anodizing the entire surface of at least one of the aluminum substrates to form a thin layer of aluminum oxide on the substrate. process, and selectively deposit and form a resistor material and a highly conductive material on this aluminum oxide thin layer to form circuit elements such as conductive paths, conductor fixing parts, and resistors. a step of bonding the back of the transistor pellet (c) on the lead portion (e) formed by selectively attaching a good conductor; and a step of connecting an external conductor (not shown) to the conductor fixing portion ridge; At least a circuit element (goods),
(a) etc. were sealed with insulating resin such as epoxy resin.
上述した技術は特公昭46−13234号公報に記載さ
れている。The above-mentioned technique is described in Japanese Patent Publication No. 46-13234.
しかし上述したアルミニウム基板をモータ用等に使用す
る場合は、アルミニウムが磁力線を通さないのでアルミ
ニウム基板を用いて十分なモータ用混成集積回路ができ
なかった。そこで磁力線を通す鉄を用い第5図に示す如
く鉄基板員の表面にあらかじめ接着層01)と銅箔(イ
)を一体化したものを貼着し、銅箔(2)をエツチング
し電子部品等を固着しモータ用混成集積回路を形成して
いた。However, when the above-mentioned aluminum substrate is used for a motor, etc., a sufficient hybrid integrated circuit for the motor cannot be made using the aluminum substrate because aluminum does not allow lines of magnetic force to pass through. Therefore, using iron through which magnetic lines of force pass, a combination of adhesive layer 01) and copper foil (a) is affixed to the surface of the iron board member in advance as shown in Figure 5, and the copper foil (2) is etched to form an electronic component. etc., to form a hybrid integrated circuit for motors.
(ハ)発明が解決しようとする問題点
上述した従来の混成集積回路基板は銅箔をエツチングす
るときに鉄基板に腐食が生じるので鉄基板裏面に保護コ
ートを行なう必要があった。また接着層と鉄基板との接
着にも問題があった。(c) Problems to be Solved by the Invention In the above-mentioned conventional hybrid integrated circuit board, since corrosion occurs on the iron substrate when etching the copper foil, it is necessary to apply a protective coating to the back surface of the iron substrate. There was also a problem in adhesion between the adhesive layer and the iron substrate.
(ロ)問題点を解決するための手段
本発明は上述した点に鑑みてなされたものであり、第1
図に示す如く、磁性基板(1)すなわち鉄基板の両主面
にニッケルメッキ膜(2)を無電解メブキまたは電気メ
ッキ等の手段で付着させ、ニッケルメッキ膜(2)が付
着した少なくとも一生面に接着層(3)および銅箔(4
)を貼着しモータ用混成集積回路基板(5)として用い
るものである。(b) Means for solving the problems The present invention has been made in view of the above-mentioned points.
As shown in the figure, a nickel plating film (2) is attached to both main surfaces of a magnetic substrate (1), that is, an iron substrate, by means such as electroless plating or electroplating, and at least the entire surface with the nickel plating film (2) attached is attached. Adhesive layer (3) and copper foil (4)
) is used as a motor hybrid integrated circuit board (5).
(ホ)作用
本発明に依れば磁性基板の両主面にニッケルメッキ膜を
付着することに依り磁性基板を腐食から保護する。(E) Function According to the present invention, the magnetic substrate is protected from corrosion by depositing nickel plating films on both main surfaces of the magnetic substrate.
(へ)実施例
本発明に依る混成集積回路基板は第1に示す如く、磁性
基板(1)の両主面にニッケルメッキ膜(2)を付着形
成し、前記ニッケルメッキ膜(2)を付着した磁性基板
(1)の少なくとも一生面に接着層(3)および銅箔(
4)を貼着するものである。(f) Example As shown in the first example, a hybrid integrated circuit board according to the present invention has a nickel plating film (2) deposited on both main surfaces of a magnetic substrate (1), and the nickel plating film (2) is deposited on both main surfaces of a magnetic substrate (1). An adhesive layer (3) and a copper foil (
4) is attached.
磁性基板(1)には強力な磁力線を通す強磁性体である
鉄を用いる。The magnetic substrate (1) is made of iron, which is a ferromagnetic material that allows strong lines of magnetic force to pass through.
ニッケルメッキ膜(2)は無電解メッキまたは電解メッ
キ等で付着形成し、ニッケルメッキ膜(2)の厚さは1
μ以上であり本実施例では1.5μ〜5μである。更に
そのメッキ膜(2)中にはリンがlO%以上含まれてい
る。The nickel plating film (2) is deposited by electroless plating or electrolytic plating, and the thickness of the nickel plating film (2) is 1.
μ or more, and in this example, it is 1.5 μ to 5 μ. Furthermore, the plating film (2) contains 10% or more of phosphorus.
接着層(3)および銅箔(4)を磁性基板(1)に貼着
する場合、接着層(3)と銅箔(4)を磁性基板(1)
の少なくとも一生面にホット・プレスまたはホット・ロ
ーラ等で貼着する。When attaching the adhesive layer (3) and copper foil (4) to the magnetic substrate (1), attach the adhesive layer (3) and copper foil (4) to the magnetic substrate (1).
Attach it to at least the permanent surface using a hot press or a hot roller.
斯る混成集積回路基板は大型の磁性基板(1)かも形成
した後、製造工程で流すことができる所定の巾にたんざ
く状にシャーリング等で切断して用いる。Such a hybrid integrated circuit board is used by forming a large-sized magnetic substrate (1) and then cutting it into pieces of a predetermined width by shearing or the like to a predetermined width that can be flowed in the manufacturing process.
斯る磁性基板(1)上に設けた銅箔(4)を所定のパタ
ーンのレジストを塗布した後、基板(1)をエツチング
溶液に浸し銅箔(4)をエツチングし所定の導電路を形
成する。この間磁性基板(1)は両主面がニッケルメッ
キ膜(2)で覆われている為腐食せず銅箔(4)をエツ
チングすることができる。After coating the copper foil (4) provided on the magnetic substrate (1) with a resist in a predetermined pattern, the substrate (1) is immersed in an etching solution and the copper foil (4) is etched to form a predetermined conductive path. do. During this time, since both main surfaces of the magnetic substrate (1) are covered with the nickel plating film (2), the copper foil (4) can be etched without corrosion.
以下にモータ用混成集積回路基板(5)について説明す
る。The motor hybrid integrated circuit board (5) will be explained below.
たんざく状に切断した混成集積回路基板(5)をモータ
用として使用できる形状にプレスで打抜き、第2図、第
3図に示す如くモータ用混成集積回路基板(5ン上にス
テータコイル(6)を配置し、あらかじめ形成した導電
路α4上に感磁素子(至)、IC、トランジスター等の
チップ部品および抵抗(至)とを固着し、前記ステータ
コイル(6)の端部と導電路α4を接続しモータを駆動
させるものである。The hybrid integrated circuit board (5) cut into strips was punched out using a press into a shape that can be used for a motor, and a stator coil (6 ), a magnetic sensing element (to), chip components such as an IC, a transistor, and a resistor (to) are fixed on the conductive path α4 formed in advance, and the ends of the stator coil (6) and the conductive path α4 are fixed. is connected to drive the motor.
以下にモータの構造を説明する。The structure of the motor will be explained below.
ステータコイル(6)はモータ用混成集積回路基板(5
)上に複数個略円環状に設ける。基板(5)中央には軸
受の保持筒が設けられ、その下端には発電機コイル等を
有し、外周面に凹凸歯(7)を設けた発電機固定子部(
8)が取付けられる。軸受にて支持されるロータ軸(9
)の下端にはロータケースoQが取付けられ、そのケー
ス内に各ステータコイル(6)と軸方向空隙を介して対
抗するロータ磁石(ロ)と、内周面に凹凸歯(2)を有
する発電機回転子部0とが設けられる。その回転子部の
凹凸歯(2)は発電機固定子部(8)の凹凸歯(7)と
半径方向に対抗し、ロータ磁石(9)、基板(5)、保
持筒、凹凸歯(7)Q2の磁路に於いて、凹凸歯(7)
と(6)の間の空隙長がロータの回転によって変化する
ことにより、発電機コイルに生ずる誘起起電力によって
ロータの回転数に対応した周波数を有する電圧を検出す
るものである。The stator coil (6) is connected to the motor hybrid integrated circuit board (5).
) are provided in a substantially annular shape. A bearing holding cylinder is provided in the center of the board (5), and a generator stator part (having a generator coil, etc. on the lower end thereof, and having uneven teeth (7) on the outer peripheral surface) is provided.
8) is installed. The rotor shaft (9
) A rotor case oQ is attached to the lower end of the rotor case oQ, and inside the case there are rotor magnets (b) that oppose each stator coil (6) through an axial gap, and a power generator having uneven teeth (2) on the inner circumferential surface. A machine rotor section 0 is provided. The concave and convex teeth (2) of the rotor part oppose the concave and convex teeth (7) of the generator stator part (8) in the radial direction. ) In the magnetic path of Q2, uneven teeth (7)
When the gap length between (6) and (6) changes with the rotation of the rotor, a voltage having a frequency corresponding to the rotational speed of the rotor is detected by the induced electromotive force generated in the generator coil.
(ト)発明の効果
以上に詳述した如く本発明に依れば磁性基板すなわち鉄
基板の両主面にニッケルメッキ膜を付着することにより
、鉄基板に直接接着層を介し銅箔を貼着するよりも接着
力が向上する。なぜなら鉄は表面が酸化しやすく不安定
なのに対し、ニッケルメッキ膜は鉄より酸化がしにくい
からである。(G) Effects of the Invention As detailed above, according to the present invention, a nickel plating film is attached to both main surfaces of a magnetic substrate, that is, an iron substrate, and a copper foil is directly attached to the iron substrate via an adhesive layer. Adhesive strength is improved. This is because the surface of iron is easily oxidized and unstable, whereas the nickel plating film is more difficult to oxidize than iron.
またエツチング工程において鉄基板が腐食されずにエツ
チングが行なえ且つ耐湿性が向上するものである。Furthermore, etching can be carried out without corroding the iron substrate during the etching process, and moisture resistance is improved.
第1図は本発明による実施例を示す断面図、第2図は本
実施例を用いたモータの分解斜視図、第3図は第2図に
示したモータの基板を下から見た部分斜視図、第4図は
従来例を示す斜視図、第5図は従来例を示す断面図であ
る。
(1)・・・磁性基板、 (2)ニッケルメッキ膜、(
3)・・・接着層、 (4)・・・銅箔、 (5)・・
・モータ用混成集積回路基板、 (6)・・・ステータ
コイル、 (7)・・・凹凸歯、 (8)・・・発電機
固定子部、 (9)・・・ロータ軸、(ト)・・・ロー
タケース、 (6)・・・ロータ磁石、 @・・・凹凸
歯、 (至)・・・発電機回転子部、 (ロ)・・・導
電路、(至)・・・感磁素子、 (至)・・・抵抗。
出願人 三洋電機株式会社 外1名
代理人 弁理士 佐 野 静 火
弟1図 。
第2図
第3図
第4図
第5図Fig. 1 is a sectional view showing an embodiment according to the present invention, Fig. 2 is an exploded perspective view of a motor using this embodiment, and Fig. 3 is a partial perspective view of the board of the motor shown in Fig. 2, viewed from below. 4 are perspective views showing the conventional example, and FIG. 5 is a sectional view showing the conventional example. (1)...magnetic substrate, (2) nickel plating film, (
3)...adhesive layer, (4)...copper foil, (5)...
・Motor hybrid integrated circuit board, (6)... Stator coil, (7)... Uneven teeth, (8)... Generator stator section, (9)... Rotor shaft, (g) ... Rotor case, (6) ... Rotor magnet, @ ... Uneven teeth, (To) ... Generator rotor part, (B) ... Conductive path, (To) ... Feeling Magnetic element, (to)...resistance. Applicant: Sanyo Electric Co., Ltd. and 1 other agent: Shizuka Sano, patent attorney. Figure 2 Figure 3 Figure 4 Figure 5
Claims (1)
ッケルメッキ膜と、該ニッケルメッキ膜の少なくとも一
主面に設けた接着層と、該接着層を介し銅箔を貼着する
ことを特徴とする混成集積回路基板。 2、特許請求の範囲第1項に於いて、前記磁性基板とし
て鉄を用いることを特徴とした混成集積回路基板。[Claims] 1. A magnetic substrate, a nickel-plated film attached to both main surfaces of the magnetic substrate, an adhesive layer provided on at least one main surface of the nickel-plated film, and a copper plated film formed on at least one main surface of the magnetic substrate, A hybrid integrated circuit board characterized by pasting foil. 2. A hybrid integrated circuit board according to claim 1, characterized in that iron is used as the magnetic substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10639585A JPS61280697A (en) | 1985-05-17 | 1985-05-17 | Hybrid integrated circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10639585A JPS61280697A (en) | 1985-05-17 | 1985-05-17 | Hybrid integrated circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61280697A true JPS61280697A (en) | 1986-12-11 |
Family
ID=14432500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10639585A Pending JPS61280697A (en) | 1985-05-17 | 1985-05-17 | Hybrid integrated circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61280697A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5446304A (en) * | 1977-09-21 | 1979-04-12 | Sony Corp | Stator yoke |
JPS5526030A (en) * | 1978-08-14 | 1980-02-25 | Hitachi Ltd | Flat armature coil |
JPS59147481A (en) * | 1983-02-10 | 1984-08-23 | ソニー株式会社 | Circuit board for mounting stator for motor |
JPS61243119A (en) * | 1985-04-18 | 1986-10-29 | Kawasaki Steel Corp | Manufacture of silicon steel sheet suitable for use as base of printed board |
-
1985
- 1985-05-17 JP JP10639585A patent/JPS61280697A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5446304A (en) * | 1977-09-21 | 1979-04-12 | Sony Corp | Stator yoke |
JPS5526030A (en) * | 1978-08-14 | 1980-02-25 | Hitachi Ltd | Flat armature coil |
JPS59147481A (en) * | 1983-02-10 | 1984-08-23 | ソニー株式会社 | Circuit board for mounting stator for motor |
JPS61243119A (en) * | 1985-04-18 | 1986-10-29 | Kawasaki Steel Corp | Manufacture of silicon steel sheet suitable for use as base of printed board |
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