JPS6127258U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS6127258U JPS6127258U JP10850784U JP10850784U JPS6127258U JP S6127258 U JPS6127258 U JP S6127258U JP 10850784 U JP10850784 U JP 10850784U JP 10850784 U JP10850784 U JP 10850784U JP S6127258 U JPS6127258 U JP S6127258U
- Authority
- JP
- Japan
- Prior art keywords
- package body
- semiconductor device
- semiconductor equipment
- abstract
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1076—Shape of the containers
- H01L2225/1082—Shape of the containers for improving alignment between containers, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図ａ， ｂ． ｃはそれそれ本考案の一実施例の断
面図、平面図、正面図である。 第２図ａ，反は従来の半導体装置の側面図、平面図、正
面図である。 １，１１・・・・・・パッケージ本体、２・・・・・・
リードピン、．３ａ，４ａ・・・胃凸起、３ｂ．４ｂ・
・・五凹み。
面図、平面図、正面図である。 第２図ａ，反は従来の半導体装置の側面図、平面図、正
面図である。 １，１１・・・・・・パッケージ本体、２・・・・・・
リードピン、．３ａ，４ａ・・・胃凸起、３ｂ．４ｂ・
・・五凹み。
Claims (1)
- 内部に半導体チップを内蔵したパッケージ本体と、この
パッケージ本体の両側部から外部へ引き出されかつ下方
へ曲げられた多数のリードピンとを備えた半導体装置に
おいて、前記パッケージ本体の上面および下面にそれぞ
れ、他のパッケージ本体と重ねるときに嵌合する凸起お
よび凹みが設けられていることを特徴とする半導体装置
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10850784U JPS6127258U (ja) | 1984-07-18 | 1984-07-18 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10850784U JPS6127258U (ja) | 1984-07-18 | 1984-07-18 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6127258U true JPS6127258U (ja) | 1986-02-18 |
Family
ID=30667692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10850784U Pending JPS6127258U (ja) | 1984-07-18 | 1984-07-18 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127258U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766364A (ja) * | 1993-08-25 | 1995-03-10 | Nec Corp | 半導体装置の実装構造 |
-
1984
- 1984-07-18 JP JP10850784U patent/JPS6127258U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766364A (ja) * | 1993-08-25 | 1995-03-10 | Nec Corp | 半導体装置の実装構造 |
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