JPS6127149B2 - - Google Patents

Info

Publication number
JPS6127149B2
JPS6127149B2 JP55116143A JP11614380A JPS6127149B2 JP S6127149 B2 JPS6127149 B2 JP S6127149B2 JP 55116143 A JP55116143 A JP 55116143A JP 11614380 A JP11614380 A JP 11614380A JP S6127149 B2 JPS6127149 B2 JP S6127149B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
chain
receiving device
transfer belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55116143A
Other languages
Japanese (ja)
Other versions
JPS5740993A (en
Inventor
Hachiji Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP11614380A priority Critical patent/JPS5740993A/en
Publication of JPS5740993A publication Critical patent/JPS5740993A/en
Publication of JPS6127149B2 publication Critical patent/JPS6127149B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Description

【発明の詳細な説明】 本発明は、プリント基板の回路連続半田付け自
動搬送装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic conveyance device for continuous circuit soldering of printed circuit boards.

従来のプリント基板の回路半田付け装置にあつ
ては、溶媒の附着、溶媒を乾燥加熱して半田付け
を行い、半田付け後、プリント基板を半田付け装
置より他に移すのみであつたため、プリント基板
の回路半田付けと、搬送とを一環作業を行うこと
ができず、非能率的で作業の合理化を期待するこ
とができなかつた。
With conventional circuit soldering equipment for printed circuit boards, all that was required was applying a solvent, drying and heating the solvent to perform soldering, and then transferring the printed circuit board from the soldering equipment to another device. It was not possible to carry out the circuit soldering and transportation as part of the work, which was inefficient and could not be expected to streamline the work.

本発明は従来の欠点を除去するために提案され
たプリント基板の回路連続半田付け自動搬送装置
の発明である。即ち本発明は機枠の上方に往行移
送ベルトを支架し、該機枠の下方に復行移送コン
ベアーを支架すると共に、上記機枠の中央部に溶
媒附着装置、乾燥兼加熱装置、溶媒半田槽の順に
設置し、かつ前記機枠の一側方に流体シリンダー
とこれに受装置とを設け、更に該機枠の他側方に
流体シリンダーと、これに受装置を設け、前記往
行移送ベルトにプリント基板を支架した受枠を係
止し、該往行移送ベルトの往行のとき、該プリン
ト基板のプリント端子とこれに接続した回路の半
田付け部に溶媒を附着し、次に乾燥と半田の付き
易いように加熱し、これを溶融半田槽にて半田付
けを行つたプリント基板と、その受枠とを前記機
枠の一側方の流体シリンダーの上方に設けた受装
置に移し、該流体シリンダーにて下降し、復行移
送コンベアーに移して復行し、該プリント基板と
これの受枠とを、機枠の他側方に設けた流体シリ
ンダーの受装置に移し、これを前記流体シリンダ
ーにて上昇し、該受枠を前記往行移送ベルトに係
止する一方、半田付けしたプリント基板を受枠よ
り外し、該受枠に新しいプリント基板を支架した
後前記往行移送ベルトの往行において前記のよう
に溶媒の附着、乾燥、加熱、半田付けを連続行
い、かつ搬送し、これを連続繰り返すことを特徴
とするプリント基板の回路連続半田付け搬送装置
の発明である。これを図面について説明すると次
のようである。
The present invention is an automatic transfer device for continuous soldering of circuits on printed circuit boards, which has been proposed in order to eliminate the drawbacks of the prior art. That is, in the present invention, an outbound transfer belt is supported above the machine frame, a return transfer conveyor is supported below the machine frame, and a solvent application device, a drying/heating device, and a solvent soldering device are installed in the center of the machine frame. A fluid cylinder and a receiving device are provided on one side of the machine frame, and a fluid cylinder and a receiving device are provided on the other side of the machine frame, and A receiving frame supporting a printed circuit board is fixed to the belt, and as the belt moves back and forth, a solvent is applied to the printed terminals of the printed circuit board and the soldered parts of the circuits connected thereto, and then dried. The printed circuit board is heated so that it can be easily soldered, and then the printed circuit board soldered in a molten solder bath and its receiving frame are transferred to a receiving device installed above the fluid cylinder on one side of the machine frame. The printed circuit board is lowered in the fluid cylinder, transferred to the return transfer conveyor, and returned to the back, and the printed circuit board and its receiving frame are transferred to the fluid cylinder receiving device provided on the other side of the machine frame. While the receiving frame is locked to the forward transfer belt, the soldered printed circuit board is removed from the receiving frame, and a new printed circuit board is supported on the receiving frame. This is an invention of a circuit continuous soldering and conveying device for a printed circuit board, which is characterized in that it continuously performs solvent application, drying, heating, and soldering, and then conveys and repeats these processes continuously. This can be explained with reference to the drawings as follows.

添附図面において1は必要の幅と長さを有する
機枠であつて、該機枠1の一側上方両端に鎖車
2,3を回転自在に設け、鎖車2の軸4に大歯車
5を軸止めし、この大歯車5に電動機6の回転軸
に設けた減速装置7の小歯車8を咬合せしめて、
鎖車2の回転を減速する。往行移送ベルト9の下
方に位置せしめて、上方枠14,14の上方内側
にレール20,21を設け、該レール20,21
は溶融半田槽37の上方のレールを流体シリンダ
ー38,39にて受枠23の両側を揺動せしめる
と共に、機枠1の流体シリンダー26の上方およ
び流体シリンダー69の上方に設けないものであ
る。
In the attached drawings, reference numeral 1 denotes a machine frame having the necessary width and length, and chain wheels 2 and 3 are rotatably provided at both upper ends of one side of the machine frame 1, and a large gear 5 is attached to the shaft 4 of the chain wheel 2. A small gear 8 of a reduction gear 7 provided on the rotating shaft of an electric motor 6 is engaged with the large gear 5.
The rotation of chain wheel 2 is decelerated. Rails 20 and 21 are provided below the forward transport belt 9 and on the upper inner side of the upper frames 14 and 14.
The rail above the molten solder tank 37 is made to swing on both sides of the receiving frame 23 by means of fluid cylinders 38 and 39, and is not provided above the fluid cylinder 26 or above the fluid cylinder 69 of the machine frame 1.

鎖車2,3に無端鎖帯よりなる往行移送ベルト
9を懸架し、該往行移送ベルト9を電動機6の駆
動により左に移動、即ち往行せしめると共に、鎖
車3の部分にて前記往行移送ベルト9を右方向に
反転移動するように形成する。
A forward transfer belt 9 made of an endless chain belt is suspended between the chain wheels 2 and 3, and the forward transfer belt 9 is moved to the left by the drive of the electric motor 6, that is, moved forward, and at the same time, the chain wheel 3 The forward conveyance belt 9 is formed to move in reverse in the right direction.

前記機枠1の中央部に位置せしめて、数本の支
枠10,11,12,13の上方を、該機枠1の
上方枠14に取付け、該支枠10,11,12,
13のそれぞれの下端部より少しく上方を機枠1
に連結すると共に、支枠10,11,12に中間
支枠Cを横設し、中間支枠Cの右方上面に、フラ
ツクスの如き溶媒溶融槽15を取付け、該溶融槽
15の下方に熱気を送る熱気送管16の一端を連
結して溶融槽15内に容入した溶媒を溶融し、該
溶融溶媒を前記溶融槽15に設けた熱気送管16
より岐出した押上管17より沸騰状に押し上げ、
該溶融溶媒をプリント基板18に配設したプリン
ト端子とプリント回路との半田付け部に附着する
ものである。
The upper parts of several support frames 10, 11, 12, 13 are attached to the upper frame 14 of the machine frame 1, and the support frames 10, 11, 12,
The machine frame 1 is slightly above the lower end of each of 13.
At the same time, an intermediate support frame C is installed horizontally on the support frames 10, 11, and 12, and a solvent melting tank 15 such as flux is attached to the upper right side of the intermediate support frame C, and hot air is placed below the melting tank 15. A hot air pipe 16 provided in the melting tank 15 is connected to one end of the hot air pipe 16 to melt the solvent contained in the melting tank 15.
Push up to a boiling state from the push-up tube 17 that branches out,
The molten solvent is applied to the soldered portions of printed terminals and printed circuits arranged on the printed circuit board 18.

機枠1の上方両側にレール20,21を設け、
該レール20,21の下方に、ほぼ正方形に形成
されている受枠19を固定し、レール20,21
の上方に受枠23の突子24,24,25,25
の下端を載せると共に、前記機枠1の一側方に一
端を凹字形に形成し、かつ他端を段状の扁平に案
内22を形成して設け、該案内22に移送ベルト
9を支架するものであつて、案内22をレール2
0と並行して上方支枠14の一方に設け、前記レ
ール20,21間に、プリント基板18を支架す
る受枠23を支架するものである。即ち突子2
4,24,25,25をレール20,21上に載
せると共に、突子24,24の上方突出部を往行
移送ベルト9に必要の間隔を設けて内側に突設し
てある係子に係止し、該往行移送ベルト9の往行
即ち左移行のとき、受枠23を左に移動するよう
に形成し、往行移送ベルト9を鎖歯車3の折り返
し部の方向に往行して、機枠1の一側方に設けた
流体シリンダー26のピストンロツド27の上方
に設けてある受装置28に受枠23と、これに支
架してあるプリント基板18とを移すように形成
されている。
Rails 20 and 21 are provided on both sides above the machine frame 1,
A substantially square receiving frame 19 is fixed below the rails 20, 21, and the rails 20, 21 are fixed to each other.
The protrusions 24, 24, 25, 25 of the receiving frame 23 are placed above the receiving frame 23.
At the same time, a guide 22 is provided on one side of the machine frame 1 with one end formed in a concave shape and the other end formed into a stepped flat shape, and the transfer belt 9 is supported on the guide 22. The guide 22 is connected to the rail 2.
0 is provided on one side of the upper support frame 14, and between the rails 20 and 21, a support frame 23 for supporting the printed circuit board 18 is supported. That is, protrusion 2
4, 24, 25, and 25 are placed on the rails 20 and 21, and the upper protrusions of the protrusions 24 and 24 are engaged with retainers that protrude inwardly from the forward conveyance belt 9 at a necessary interval. When the forward transfer belt 9 moves forward, that is, when it moves to the left, the receiving frame 23 is formed to move to the left, and the forward transfer belt 9 moves forward in the direction of the folded portion of the chain gear 3. The receiving frame 23 and the printed circuit board 18 supported thereon are transferred to a receiving device 28 provided above a piston rod 27 of a fluid cylinder 26 provided on one side of the machine frame 1.

受枠23の両側に長孔29,29,30,30
を縦方向に並列してそれぞれ穿つと共に、長孔2
9,29,30,30の側方に目盛31,31,
31,31を設け、前記長孔29,29,30,
30に弾性鋼板製の支持子32,33の基部を摺
動するように挿入し、該支持子32,33の両端
に蝶螺子34,34,35,35を設け、該蝶螺
子34,34,35,35にてプリント基板18
の大小に対応して、支持子32,33の間隔を調
整するように形成し、前記支持子32,33の下
方を、それぞれ内方に向つて折曲し、かつ櫛形状
に形成すると共に、下端をそれぞれ傾め内側下方
に折曲して受部J,Kを相対状に設け、該受部
J,K上にプリント基板18の両側を落ち込み状
に支架するものである。
Elongated holes 29, 29, 30, 30 on both sides of the receiving frame 23
are vertically parallel to each other, and long holes 2
Scales 31, 31 on the sides of 9, 29, 30, 30,
31, 31 are provided, and the long holes 29, 29, 30,
The bases of supports 32, 33 made of elastic steel plates are slidably inserted into the supports 30, and butterfly screws 34, 34, 35, 35 are provided at both ends of the supports 32, 33, and the butterfly screws 34, 34, Printed circuit board 18 at 35,35
The spacing between the supports 32 and 33 is adjusted according to the size of the supports 32 and 33, and the lower portions of the supports 32 and 33 are respectively bent inward and formed into a comb shape. The lower ends are each tilted and bent inwardly downward to provide receiving portions J and K opposite each other, and both sides of the printed circuit board 18 are supported on the receiving portions J and K in a depressed manner.

前記のように溶融槽15の上方において押上管
17にて沸騰状に押し上げられる溶媒をプリント
基板18のプリント端子とプリント回路との半田
付け部に附着し、引続いて左方向に移動する往行
移送ベルト9の往行に伴い、プリント基板18を
溶媒乾燥兼加熱装置36のヒーターにて加熱して
溶媒を乾燥し、かつ半田付け易いように加熱す
る。乾燥兼加熱装置36は、中間支枠14の左上
方に設け、溶媒を乾燥し、かつ加熱したプリント
基板18を溶融半田槽37の上方に移動し、該溶
融半田槽37の内方に溶融半田を常時収容し置く
ものであつて、支持子32,33の受部J,K間
に支架してあるプリント基板18を溶融半田槽3
7に移動する初期において、流体シリンダー3
8,39を交互に昇降して、溶融半田槽37の上
方に設けたレール20,21を交互に揺動即ち昇
降して、該プリント基板18を溶融半田槽37内
に導き入れて、前記プリント基板18のプリント
端子と、これに接続されるプリント配線との接続
部に半田付けを行うもので、プリント基板18が
溶融半田槽37内を通過する時間や、該プリント
基板18を流体シリンダー38,39の下降や上
昇時間および電動機6,63、流体シリンダー2
6,65の始動、停止は総てタイマスイツチ4
0,41、その他のタイマスイツチの開閉によつ
て行うものである。溶融半田槽37の下方に昇降
するように設けた枠42の下方において流体シリ
ンダー43のピストンロツド44の上方を作動板
45に連結し、該流体シリンダー43を駆動し、
前記流体シリンダー43のピストンロツド44を
昇降することにより作動板45を昇降し、該作動
板45にて受枠23の両側を交互に昇降するもの
である。
As mentioned above, the solvent that is pushed up to a boiling state by the push-up tube 17 above the melting tank 15 is attached to the soldered parts of the printed terminals and printed circuits of the printed circuit board 18, and then moved to the left. As the transfer belt 9 moves back and forth, the printed circuit board 18 is heated by the heater of the solvent drying/heating device 36 to dry the solvent and to heat it to facilitate soldering. A drying/heating device 36 is provided at the upper left of the intermediate support frame 14 to dry the solvent and move the heated printed circuit board 18 above a molten solder tank 37 to deposit molten solder inside the molten solder tank 37. The printed circuit board 18 supported between the receiving parts J and K of the supports 32 and 33 is placed in the molten solder bath 3.
At the beginning of moving to 7, the fluid cylinder 3
8 and 39 are alternately raised and lowered, and the rails 20 and 21 provided above the molten solder tank 37 are alternately swung, that is, raised and lowered, and the printed circuit board 18 is introduced into the molten solder tank 37. Soldering is performed at the connection between the printed terminals of the board 18 and the printed wiring connected thereto, and the time it takes the printed board 18 to pass through the molten solder bath 37 and the time it takes for the printed board 18 to pass through the fluid cylinder 38, 39 lowering and rising time, electric motors 6, 63, fluid cylinder 2
6 and 65 are all started and stopped by timer switch 4.
This is done by opening and closing timer switches such as 0, 41, and others. The upper part of the piston rod 44 of a fluid cylinder 43 is connected to an actuating plate 45 below a frame 42 provided to move up and down below the molten solder tank 37, and the fluid cylinder 43 is driven;
By raising and lowering the piston rod 44 of the fluid cylinder 43, an actuating plate 45 is raised and lowered, and both sides of the receiving frame 23 are raised and lowered alternately by the actuating plate 45.

溶融半田槽37の左側下方に位置せしめて、可
逆電動機46を設け、該可逆電動機46の回転軸
に減速機を設け、該減速機の歯車47と溶融半田
槽37の左側方に設けた転子48とにベルト49
を懸架して、転子48を正回転と逆回転とをする
ように形成し、転子48の同一軸に設けた鎖転子
と、転子48の左傾め上方に設けた鎖転子50お
よび前記溶融半田槽37の右側上方に設けた鎖転
子51と、該鎖転子51の左傾め下方に設けた鎖
転子52とに無端鎖帯53を正逆何れの方向にも
移動するように懸架する。
A reversible electric motor 46 is provided at the lower left side of the molten solder bath 37, a reduction gear is provided on the rotating shaft of the reversible electric motor 46, and a gear 47 of the reduction gear and a trochanter provided on the left side of the molten solder bath 37. 48 and belt 49
is suspended, and the trochanter 48 is formed to rotate forward and backward. A chain trochanter is provided on the same axis of the trochanter 48, and a chain trochanter 50 is provided above the trochanter 48 and tilted to the left. The endless chain band 53 is moved in either forward or reverse direction between a chain trochanter 51 provided on the upper right side of the molten solder tank 37 and a chain trochanter 52 provided on the lower left side of the chain trochanter 51. Suspend it like this.

無端鎖帯53の上方即ち鎖転子50,51とに
上記のように懸架した無端鎖帯53の上方中央部
に転子55を左右何れの方向にも反転するように
取付け、この転子55に支杆56を取付け、この
支杆56に掻取子Bの上端を固定し、掻取子Bの
下方に杆59を固定し、該掻取子Bは金属板にて
形成され、かつ遊離端より支杆56の方向に向つ
て適宜の間隔を置いて切目57を設けると共に、
端部を「へ字形」に折曲して掻取部58を形成し
該掻取部58の折曲部外方に杆59を固定し、該
杆59の両端を溶融半田槽37の上縁に常時載せ
るように形成し、無端鎖帯53を可逆電動機46
の逆回転して左方に移動する場合、掻取部58は
溶融半田槽37の上縁より上方にあつて、溶融半
田槽37内の溶融半田に接触しないように形成さ
れており、プリント基板18が溶融半田槽37に
おいてプリント端子と、これに接続してあるプリ
ント回路とに半田付けする直前に、可逆電動機4
6を正回転し、無端鎖帯53の上方を右に移動す
ることによつて、支杆56および掻取子B、杆5
9を支杆56を中心として200度反転し、杆59
を溶融半田槽37の上縁に接触せしめて、掻取部
58を溶融半田に入れる程度を所定に保持せしめ
無端鎖帯53の上方を前記のように右方向への移
動によつて、溶融半田の表面の酸化膜を掻取部5
8にて右方向に掻き集め、溶融半田槽37の右方
に排出する。酸化膜を溶融半田槽37より排出し
た後、プリント基板18を溶融半田槽37に導き
入れ、プリント端子とこれに接続したプリント回
路との接続部に半田付けを行うものである。
A trochanter 55 is attached above the endless chain belt 53, that is, at the upper central part of the endless chain belt 53 suspended from the chain trochanters 50 and 51 as described above, so as to be reversed in either the left or right direction. A support rod 56 is attached to the support rod 56, the upper end of the scraper B is fixed to the support rod 56, a rod 59 is fixed below the scraper B, and the scraper B is formed of a metal plate and is free. In addition to providing cuts 57 at appropriate intervals from the end toward the support rod 56,
The end portion is bent into a “F” shape to form a scraping portion 58, a rod 59 is fixed outside the bent portion of the scraping portion 58, and both ends of the rod 59 are attached to the upper edge of the molten solder tank 37. The endless chain band 53 is connected to the reversible electric motor 46
When rotating in the opposite direction and moving to the left, the scraping part 58 is located above the upper edge of the molten solder tank 37 and is formed so as not to come into contact with the molten solder in the molten solder tank 37. Immediately before 18 is soldered to the printed terminal and the printed circuit connected to it in the molten solder tank 37, the reversible motor 4
6 in the forward direction and move it to the right above the endless chain band 53, the support rod 56, the scraper B, and the rod 5
9 is flipped 200 degrees around support rod 56, and the rod 59
is brought into contact with the upper edge of the molten solder bath 37 to maintain the level at which the scraping portion 58 enters the molten solder, and by moving the endless chain band 53 to the right as described above, the molten solder is removed. The part 5 that scrapes off the oxide film on the surface of
At step 8, the solder is collected to the right and discharged to the right of the molten solder tank 37. After the oxide film is discharged from the molten solder bath 37, the printed circuit board 18 is introduced into the molten solder bath 37, and the connection portion between the printed terminal and the printed circuit connected thereto is soldered.

半田付けしたプリント基板18と受枠23とを
受装置28の方向に移動し、該プリント基板18
と受枠23とを受装置28に移すものであつて、
この場合、電動機6の回転を停止し、往行移送ベ
ルト9の移動は停止すると共に、流体シリンダー
26を駆動し、ピストンロツド27を上昇し、こ
れの上方に両端を連結した鎖Aを可逆回転する鎖
滑車E,Dを経て、鎖Aを下方に引き受装置28
を下降し、該受装置28上の受枠23と、これに
支架してあるプリント基板18とを復行移送コン
ベアー60に移す。移し終つた後、流体シリンダ
ー26を上記と逆に駆動し、ピストンロツド27
を下降し、鎖Aを上方に引き、受装置28を上昇
し、該受装置28を次の工程に待機させるもので
ある。該復行コンベアー60は機枠1の両側に設
けた鎖車61,62に懸架し、鎖車62の歯車に
電動機63の減速機の歯車を咬合して復行移送コ
ンベアー60の上方を右の方向に復行せしめ、該
復行移送コンベアー60上の受枠23を、これに
支架したプリント基板18とを受装置64上に移
すものであつて、ピストンロツド66の上方に設
けた受装置64上に受枠23と、これに支架した
プリント基板18を移す。移し終つた後、電動機
63の駆動を止め、復行移送コンベアー60の移
行を停止すると殆んど同時に、前記機枠1の他側
に設けた流体シリンダー65を駆動し、該流体シ
リンダー65のピストンロツド66を下降し、該
ピストンロツド66の上方に両端を連結し、かつ
可逆回転する鎖滑車F,Gに懸架した鎖Hを上方
に引き、該ピストンロツド66の上方に上記のよ
うに設けた受装置64を扛止し、前記受枠23を
前記往行移送ベルト9に係止すると共に、突子2
4,25をレール20,21に載せた後、半田付
けしたプリント基板18を受枠23より外し、該
受枠23に新しいプリント基板18を支架し、次
の半田付け作業をなし得るようになし、次に流体
シリンダー65を上記と反対に駆動し、ピストン
ロツド66を上昇し、鎖Hを下方に引き受装置6
4を下降し、次の工程に備え待機するものであ
る。
The soldered printed circuit board 18 and the receiving frame 23 are moved toward the receiving device 28, and the printed circuit board 18
and the receiving frame 23 to the receiving device 28,
In this case, the rotation of the electric motor 6 is stopped, the movement of the forward transfer belt 9 is stopped, the fluid cylinder 26 is driven, the piston rod 27 is raised, and the chain A connected at both ends above this is reversibly rotated. The chain A is moved downward through the chain pulleys E and D to the receiving device 28.
is lowered, and the receiving frame 23 on the receiving device 28 and the printed circuit board 18 supported thereon are transferred to the return transfer conveyor 60. After the transfer is completed, the fluid cylinder 26 is driven in the opposite direction to the above, and the piston rod 27 is
is lowered, chain A is pulled upward, the receiving device 28 is raised, and the receiving device 28 is placed on standby for the next process. The going-back conveyor 60 is suspended on chain wheels 61 and 62 provided on both sides of the machine frame 1, and the gear of the reducer of the electric motor 63 is engaged with the gear of the chain wheel 62, so that the upper part of the going-out transfer conveyor 60 is moved to the right side. The receiving frame 23 on the returning transfer conveyor 60 and the printed circuit board 18 supported thereon are transferred onto the receiving device 64, which is provided above the piston rod 66. The receiving frame 23 and the printed circuit board 18 supported thereon are transferred. After the transfer is completed, the drive of the electric motor 63 is stopped, and almost at the same time the movement of the return transfer conveyor 60 is stopped, the fluid cylinder 65 provided on the other side of the machine frame 1 is driven, and the piston rod of the fluid cylinder 65 is driven. 66, and pulls upward the chain H, which has both ends connected above the piston rod 66 and is suspended on reversibly rotating chain pulleys F and G, and the receiving device 64 provided above the piston rod 66 as described above. and locks the receiving frame 23 to the forward transport belt 9, and the protrusion 2
4 and 25 on the rails 20 and 21, the soldered printed circuit board 18 is removed from the support frame 23, and a new printed circuit board 18 is supported on the support frame 23 so that the next soldering work can be performed. Then, the fluid cylinder 65 is driven in the opposite direction to the above, the piston rod 66 is raised, and the chain H is moved downward to the underwriting device 6.
4 and waits for the next process.

受装置28の両側を受枠23の送り込みと排出
とに支障のないように外方より内方に向つて上縁
を傾斜せしめ、かつ下方を内方に向けて折曲して
突子24,24,25,25の受部を形成する。
また受装置64の上縁両側を受装置28と同様に
外方より内方に向つて傾斜せしめ、かつ下方を内
方に向けて折曲して突子24,24,25,25
の受部を形成することは、受装置28と同様であ
る。符号67,67は受装置28の案内杆、6
8,68は受装置64の案内杆である。69は復
行移送コンベアー60の停止用流体シリンダーで
ある。
On both sides of the receiving device 28, the upper edges are inclined from the outside to the inside so as not to hinder the feeding and ejection of the receiving frame 23, and the lower part is bent inward to form the protrusions 24, 24. , 25, 25 are formed.
Further, both sides of the upper edge of the receiving device 64 are inclined from the outside to the inside in the same way as the receiving device 28, and the lower part is bent inward to form the protrusions 24, 24, 25, 25.
The formation of the receiving portion is similar to that of the receiving device 28. Reference numerals 67, 67 are guide rods of the receiving device 28;
8 and 68 are guide rods of the receiving device 64. 69 is a fluid cylinder for stopping the return transfer conveyor 60.

本発明は上記のように、機枠の上方に往行移送
ベルトを設けると共に、機枠1の下方に復行移送
コンベアーを設け、該往行移送ベルトの下方に溶
媒附着装置、溶媒乾燥兼加熱装置、溶融半田槽の
順に前記往行移送ベルトの往行方向に設け、かつ
前記機枠の一側方に流体シリンダーと、これにピ
ストンロツドおよび鎖を介して昇降する受装置を
設け、該受装置に半田付けしたプリント基板とプ
リント基板を支架した受枠とを移し、これを流体
シリンダーにて下降し、前記半田付けしたプリン
ト基板を復行移送コンベアーに移し、これを前記
機枠の他側方に設けた流体シリンダーの方向に送
り、該プリント基板と、これの受枠とを前記機枠
の右方の流体シリンダーの受装置に移し、該受装
置を機枠の他側に設けた該流体シリンダーのピス
トンロツドと鎖とを介して、前記往行移送ベルト
の右側方に上昇停止し、次に受枠を往行移送ベル
トに係止する一方、半田付けしたプリント基板を
受枠より外し、半田付けしない新しいプリント基
板を受枠に支架し、該往行移送ベルトを往行して
プリント基板に連続して半田付けと自動的に搬送
するように形成したから、プリント基板の半田付
けを連続して行うことができると共に、半田付け
したプリント基板と、機枠の両側に設けた流体シ
リンダーとその間に設けた復行移送コンベアーと
にて始動位置に自動的に戻し、半田付けしたプリ
ント基板と、半田付けしないプリント基板とを交
換し、連続して半田付けができる。更にプリント
基板の往行時半田付けをなし、半田付けしたプリ
ント基板を始動位置に還元することも全部自動
的、かつ循還的に行うことができるので、半田付
け作業を高能率的に行い得ると共に、省力に役立
たしめ得るし、作動も正確であり、操作も容易で
ある。
As described above, the present invention provides an outbound transfer belt above the machine frame, a return transfer conveyor below the machine frame 1, and a solvent application device and a solvent drying/heating device below the outbound transfer belt. A fluid cylinder is provided on one side of the machine frame, and a receiving device that moves up and down via a piston rod and a chain is provided on one side of the machine frame. The soldered printed circuit board and the support frame supporting the printed circuit board are transferred to the frame, which is lowered by a fluid cylinder, and the soldered printed circuit board is transferred to a go-around transfer conveyor, and this is transferred to the other side of the machine frame. The printed circuit board and its receiving frame are transferred to the receiving device of the fluid cylinder on the right side of the machine frame, and the receiving device is transferred to the receiving device of the fluid cylinder provided on the other side of the machine frame. Through the piston rod and chain, it rises and stops on the right side of the forward transfer belt, and then, while the receiving frame is locked to the forward transfer belt, the soldered printed circuit board is removed from the receiving frame, and a new unsoldered printed circuit board is removed. The circuit board is supported on a receiving frame, and the reciprocating transfer belt moves back and forth to continuously solder the printed circuit board and automatically convey it, so that the soldering of the printed circuit board can be performed continuously. At the same time, the soldered printed circuit board and the unsoldered printed circuit board are automatically returned to the starting position by the fluid cylinders installed on both sides of the machine frame and the return transfer conveyor installed between them. You can replace and solder continuously. Furthermore, the process of moving the printed circuit board back and forth, half-soldering it, and returning the soldered printed circuit board to the starting position can all be done automatically and in a circular manner, making it possible to perform the soldering work with high efficiency. At the same time, it is useful for saving labor, is accurate in operation, and is easy to operate.

【図面の簡単な説明】[Brief explanation of the drawing]

添附図面は本発明の実施例を示すものにして、
第1図は本発明装置を平面より見た説明図、第2
図は側面より見た本発明装置の説明図、第3図は
機枠の左側方に設けた既半田付けプリント基板を
下降する流体シリンダー部を左方から見た拡大側
面図、第4図は機枠の右側方に設けた既半田付け
プリント基板を上昇する流体シリンダーと、この
附設装置を右方から見た一部拡大側面図、第5図
は溶融半田の酸化膜除去装置の拡大平面説明図、
第6図は掻取部の拡大斜面図、第7図は掻取子の
作動状態を側面から見た拡大説明図、第8図は受
枠部の拡大平面図、第9図はプリント基板支持部
の拡大正面図、第10図は受枠の支持状態を示す
一部拡大正面図、第11図は溶融半田槽の両側に
設ける受枠の昇降装置の拡大側面図、第12図は
同じく一部拡大正面図である。
The accompanying drawings illustrate embodiments of the invention,
Fig. 1 is an explanatory diagram of the device of the present invention seen from a plane;
The figure is an explanatory diagram of the device of the present invention as seen from the side, Figure 3 is an enlarged side view of the fluid cylinder portion that lowers the soldered printed circuit board provided on the left side of the machine frame, seen from the left, and Figure 4 is an enlarged side view of the fluid cylinder part seen from the left. A partially enlarged side view of the fluid cylinder that lifts the soldered printed circuit board installed on the right side of the machine frame, and this attached equipment as seen from the right. Figure 5 is an enlarged plan view of the oxide film removal device for molten solder. figure,
Figure 6 is an enlarged slope view of the scraping section, Figure 7 is an enlarged side view of the operating state of the scraper, Figure 8 is an enlarged plan view of the receiving frame, and Figure 9 is the printed circuit board support section. Fig. 10 is a partially enlarged front view showing the supported state of the receiving frame, Fig. 11 is an enlarged side view of the lifting device for the receiving frame provided on both sides of the molten solder tank, and Fig. 12 is a partially enlarged front view of the receiving frame. It is a diagram.

Claims (1)

【特許請求の範囲】[Claims] 1 機枠1の上部に設けた往行駆動されるプリン
ト基板往行移送ベルト9と、機枠1の下部に設け
た復行駆動される半田付けしたプリント基板復行
移送コンベアー60と、往行移送ベルト9の下方
において往行移送ベルト9の往行方向に順次に、
機枠1に設けた溶媒附着装置15と、溶媒乾燥兼
加熱装置36と、溶融半田槽37と、機枠1の一
側方においてプリント基板往行移送ベルト9とプ
リント基板復行移送コンベアー60の一側方の間
を垂直に昇降可能に設けた一方の受装置28と、
両端を一方の受装置28に係止した一方の鎖A
と、一方の受装置28に設け一方の鎖Aを懸架し
た鎖滑車Dと、一方の流体シリンダー26と、こ
の流体シリンダー26のピストンロツド27に設
け一方の鎖Aと鎖滑車Dの間で一方の鎖Aを懸架
した鎖滑車Eとからなる一方の受装置28の昇降
駆動装置と、機枠1の他側方においてプリント基
板往行移送ベルト9とプリント基板復行移送コン
ベアー60の他側方の間を垂直に昇降可能に設け
た他方の受装置64と、両端を他方の受装置64
に係止した他方の鎖Hと、他方の受装置64に設
け他方の鎖Hを懸架した鎖滑車Dと、他方の流体
シリンダー65と、この流体シリンダー65のピ
ストンロツド66に設け他方の鎖Hと鎖滑車Dの
間で他方の鎖Hを懸架した鎖滑車Fとからなる他
方の受装置64と、プリント基板18を支架しな
がら上記プリント基板往行移送ベルト9及びプリ
ント基板復行移送コンベアー60に係止して移送
されるとともに上記一方及び他方の受装置28,
64に載置して昇降される受枠23とを備え、プ
リント基板18の往行において該プリント基板1
8の端子とこれに接続してあるプリント回路に溶
媒附着装置15にて溶媒を附着し溶媒を附着され
たプリント基板18を溶媒乾燥加熱装置36にて
乾燥加熱し乾燥加熱されたプリント基板の端子と
これに接続してあるプリント回路に溶融半田槽3
7に半田付けし、半田付けされたプリント基板1
8を一方の受装置28にて往行移送ベルト9より
復行移送コンベアー60に移送し、さらに復行移
送コンベアー60で復行移送して他方の受装置6
4にて始動位置である往行移送ベルト9の他側方
位置に還元することを連続自動的に繰返して行う
ようにしたことを特徴とするプリント基板の回路
連続半田付け自動搬送装置。
1. A printed circuit board reciprocating conveyor belt 9 provided on the upper part of the machine frame 1 and driven in a reciprocating manner, a soldered printed circuit board reciprocating transport conveyor 60 provided in the lower part of the machine frame 1 and driven in a reciprocating manner, and Below the transfer belt 9, in the forward direction of the forward transfer belt 9,
A solvent application device 15, a solvent drying/heating device 36, a molten solder tank 37, a printed circuit board forward transfer belt 9 and a printed circuit board backward transfer conveyor 60 on one side of the machine frame 1 are installed in the machine frame 1. One receiving device 28 that is vertically movable up and down between one side;
One chain A with both ends locked in one receiving device 28
, a chain pulley D provided on one receiving device 28 and suspending one chain A, one fluid cylinder 26, and one chain pulley D provided on the piston rod 27 of this fluid cylinder 26 between one chain A and chain pulley D. A lifting drive device for one receiving device 28 consisting of a chain pulley E on which a chain A is suspended, and a printed circuit board forward transfer belt 9 and a printed circuit board return transfer conveyor 60 on the other side of the machine frame 1. The other receiving device 64 is vertically movable up and down in between, and the other receiving device 64 is provided at both ends.
A chain pulley D provided on the other receiving device 64 and suspending the other chain H, the other fluid cylinder 65, and the other chain H provided on the piston rod 66 of this fluid cylinder 65. The other receiving device 64 consists of a chain pulley F that suspends the other chain H between the chain pulleys D, and the printed circuit board forward transfer belt 9 and the printed circuit board backward transfer conveyor 60 while supporting the printed circuit board 18. While being locked and transferred, the one and other receiving devices 28,
64 and a receiving frame 23 that is raised and lowered, and when the printed circuit board 18 moves back and forth, the printed circuit board 1
Solvent is applied to the terminals of 8 and the printed circuits connected thereto in the solvent application device 15, and the printed circuit board 18 to which the solvent has been applied is dried and heated in the solvent drying/heating device 36. And the molten solder tank 3 is connected to the printed circuit connected to this.
7 and the soldered printed circuit board 1
8 is transferred from the outgoing transfer belt 9 to the outbound transfer conveyor 60 by one receiving device 28, and further transferred in the outbound transfer conveyor 60 to the other receiving device 6.
4. An automatic circuit continuous soldering device for printed circuit boards, characterized in that returning the forward transfer belt 9 to the other side position which is the starting position at step 4 is continuously and automatically repeated.
JP11614380A 1980-08-23 1980-08-23 Continuous soldering and automatic conveying device for printed board Granted JPS5740993A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11614380A JPS5740993A (en) 1980-08-23 1980-08-23 Continuous soldering and automatic conveying device for printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11614380A JPS5740993A (en) 1980-08-23 1980-08-23 Continuous soldering and automatic conveying device for printed board

Publications (2)

Publication Number Publication Date
JPS5740993A JPS5740993A (en) 1982-03-06
JPS6127149B2 true JPS6127149B2 (en) 1986-06-24

Family

ID=14679807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11614380A Granted JPS5740993A (en) 1980-08-23 1980-08-23 Continuous soldering and automatic conveying device for printed board

Country Status (1)

Country Link
JP (1) JPS5740993A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961097A (en) * 1982-09-30 1984-04-07 近藤 権士 Carrier falling device for soldering equipment
JPS5961095A (en) * 1982-09-30 1984-04-07 近藤 権士 Soldering device
JPS5961096A (en) * 1982-09-30 1984-04-07 近藤 権士 Carrier feeding device for soldering equipment
JPS59165763U (en) * 1983-04-25 1984-11-07 日本電気株式会社 automatic soldering equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5079752A (en) * 1973-11-19 1975-06-28
JPS50145864A (en) * 1974-05-14 1975-11-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5079752A (en) * 1973-11-19 1975-06-28
JPS50145864A (en) * 1974-05-14 1975-11-22

Also Published As

Publication number Publication date
JPS5740993A (en) 1982-03-06

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