JPS61259874A - Jig member for soldering - Google Patents

Abstract

PURPOSE:To obtain the jig member for soldering to which no solder is adhered at lower cost with high accuracy and in light weight by making a Ti or Ti alloy the base metal and by making the surface roughness of the part of the base metal to be in contact with the molten solder less than the specified value. CONSTITUTION:The jig member is made so that the part coming in contact with the molten solder of the base metal consisting of Ti or Ti alloy can become less than 3mu surface roughness. The said part of the base metal is coated if necessary by the oxide of Ti, Zr, Al, Si and B, carbide, carboritride, boride or the substance of the one kind or more than two kinds selected among Mo, W or its alloy. This film is formed by either method of an ion plating, sputtering or vacuum deposition. The jig member for soldering which is inexpensive, of high accuracy and light weight and to which no solder is adhered is thus obtd.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ハンダ付け用治具部材に関するものであり、
たとえば自動ハンダ付け装置に用いられる被ハンダ付け
物の支持棒のごとく、溶融ハンダと接触してもハンダが
付着しない特性を要求される部材に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a soldering jig member,
For example, the present invention relates to a member such as a support rod for an object to be soldered used in an automatic soldering device, which is required to have the property that solder does not adhere even when it comes into contact with molten solder.

〔従来の技術〕[Conventional technology]

従来、溶融ハンダと直接接触する支持棒としては、特開
昭５８−８１５６１号に開示されるごとく、タングステ
ンの単体が用いられている。Conventionally, a single piece of tungsten has been used as a support rod that comes into direct contact with molten solder, as disclosed in JP-A-58-81561.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のハンダ付け用の支持棒はタングステン製であった
ので、非常に高価であり、かう加工性が悪いため、精度
よく加工するのが璽しかった。このため、本来タングス
テン製支持捧に付着するはずのないハンダが加工傷等の
欠陥部を起点として局部的に付着し、支持棒の繰返し使
用回数（寿命）が著しく減少したり、被ハンダ付け物の
品質が悪くなる等の問題があった。Conventional support rods for soldering are made of tungsten, which is very expensive and has poor workability, making it difficult to process with high precision. As a result, solder, which should not originally adhere to the tungsten support rod, adheres locally starting from defective parts such as processing scratches, significantly reducing the number of times the support rod can be used repeatedly (life span) and There were problems such as poor quality.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、母材をＴｉまたはＴｉ合金とし、かつ少なく
とも溶融するハンダと接触する部分の面アラサを３μ以
下としたハンダ付け用治具部材とすることにより、上記
問題点を解決するものである。The present invention solves the above problems by providing a soldering jig member in which the base material is Ti or a Ti alloy, and the surface roughness of at least the part that contacts the melting solder is 3μ or less. .

さらに、少なくとも、溶融するハンダと接触する部分を
Ｔｉ、Ｚｒ、Ａ１．Ｓｉ、Ｂの酸化物、窒化物、炭化物
、炭窒化物、ホウ化物やＭｏ、Ｗまたはその合金のうち
これらの１種または２種以上のものからなるハンダと濡
れ難い物質で被覆し、また、ハンダと濡れ難い物質の被
覆をイオンプレーティング、スパッタリングあるいは真
空蒸着のいずれかの方法により行ない、その被膜の厚さ
が１０μ以下とすることが望ましい。Furthermore, at least the portion that comes into contact with the melting solder is made of Ti, Zr, A1. It is coated with a substance that is difficult to wet with solder and is made of one or more of Si, B oxides, nitrides, carbides, carbonitrides, borides, Mo, W, or alloys thereof, and It is desirable that the coating with a substance that is difficult to wet with solder is performed by ion plating, sputtering, or vacuum deposition, and that the thickness of the coating is 10 μm or less.

〔作用〕[Effect]

母材となるＴｉまたはＴｉ合金は、タングステンと比較
して価格が安く、加工性も良いのでハンダ付け用治具部
材を安価に、かつ精度良く製造できる。しかも、比重が
タングステンの約１７４であるため、治具部材を軽量化
できる効果も大きい。ＴｉまたはＴｉ合金は、耐食性に
優れているので、フラックス、ペースト等による腐食に
も強く、またハンダとの濡れ性も小さいのでハンダは付
着し難い。このような性質は、タングステンでも有して
いるが、本来ハンダが付着しないはずの従来のタングス
テン棒では、表面にハンダの局部付着が発生していた。Ti or Ti alloy, which serves as the base material, is cheaper than tungsten and has good workability, so it is possible to manufacture soldering jig members at low cost and with high precision. Moreover, since the specific gravity is about 174 that of tungsten, it has a great effect of reducing the weight of the jig member. Ti or Ti alloy has excellent corrosion resistance, so it is resistant to corrosion by flux, paste, etc., and also has low wettability with solder, so it is difficult for solder to adhere to it. Although tungsten also has such properties, in conventional tungsten rods, which are not supposed to have solder attached to them, localized adhesion of solder occurs on the surface.

この局部付着の原因を調査したところ、加工傷など鋭利
で底の深い欠陥部にフラックスの残査が捕捉され、これ
を起点として、本来ハンダが濡れないはずのタングステ
ン棒表面にハンダの付着がおこることを解明した。すな
わち、母材の表面を面アラサ３μ以下の平滑面とするこ
とにより、ハンダの局部付着を防止する作用が加わる。When we investigated the cause of this localized adhesion, we found that flux residue was trapped in sharp, deep defects such as processing scratches, and this was the starting point for solder adhesion to the surface of the tungsten rod, where solder should not normally get wet. I figured it out. That is, by making the surface of the base material a smooth surface with a surface roughness of 3 μm or less, the effect of preventing local adhesion of solder is added.

表面をＴｉ、　Ｚｒ、　Ａｌ、Ｓｉ、Ｂの酸化物、窒化
物、炭化物、炭窒化物、ホウ化物やＭｏ、Ｗまたはその
合金等のハンダと濡れ難い物質で被覆することにより、
治具部材の耐ハンダ付着性をさらに良好ならしめると同
時に、底の深い鋭利な欠陥部が、薄膜で覆われるので表
面がよりいっそう平滑化され、ハンダの局部付着防止効
果はより向上する。薄膜の被膜をイオンプレーティング
、スパッタリングあるいは真空蒸着のいずれかの方法に
より行なうと、被膜の表面性状が良好で膜厚さも均一と
なり、より優れた耐ハンダ付着性を有する。By coating the surface with a substance that is difficult to wet with solder, such as Ti, Zr, Al, Si, B oxides, nitrides, carbides, carbonitrides, borides, Mo, W, or their alloys,
The solder adhesion resistance of the jig member is further improved, and at the same time, deep and sharp defects are covered with a thin film, so the surface is made even smoother, and the effect of preventing local adhesion of solder is further improved. When a thin film is formed by ion plating, sputtering, or vacuum evaporation, the surface quality of the film is good, the film thickness is uniform, and the film has better solder adhesion resistance.

また、被膜の厚さが１０μ以上になると、被膜が剥離し
易くなるので、１０μ以下の厚さが望ましい。Furthermore, if the thickness of the coating is 10 μm or more, the coating will easily peel off, so a thickness of 10 μm or less is desirable.

なお１本発明における被膜は、ＴｉＮ、ＺｒＮ、ＢＮ、
Ａｌ□０３．５ｉｎ２、Ｗ、Ｍｏなどハンダと濡れない
性質を有する物質であれば、とくに限定されない。Note that the coating in the present invention includes TiN, ZrN, BN,
The material is not particularly limited as long as it is a material that does not get wet with solder, such as Al□03.5in2, W, and Mo.

〔実施例〕〔Example〕

次に、本発明を実施例により詳述する。 Next, the present invention will be explained in detail with reference to Examples.

第１表に示す母材１表面被膜１面アラサを有する２、５
ｍｍφＸ８０１１１１ＩＩＱの４種類の試験棒を作成し
、フラックス塗布→ハンダ浴漬１０秒→水洗→乾燥を順
次繰り返してハンダ付着テストを実施した。なお、ハン
ダ浴の温度は、２５０℃である。2, 5 with base material 1 surface coating 1 surface roughness shown in Table 1
Four types of test rods of mmφX801111IIQ were prepared, and a solder adhesion test was conducted by sequentially repeating flux application → immersion in a solder bath for 10 seconds → water washing → drying. Note that the temperature of the solder bath was 250°C.

その結果は、第１表よりわかるように従来の重版タング
ステン棒では、約４０回の繰返し処理で、棒の表面にハ
ンダの局部付着が発生した。しかし、母材が、Ｔ　ｉ−
６Ａ　ｌ−４Ｖ合金で面アラサが１．８μに加工された
本発明品では、約２００回の繰返しまでハンダの局部付
着がおきず、従来品に比較して約５倍の寿命延長が得ら
れた６また、母材が純Ｔｉで表面に１〜２μのＴｉＮを
スパッタリング法で被覆した本発明品（面７う？２．６
μ）およびＴ　ｉ−６Ａ　ｌ−４Ｖ合金の表面に２〜３
μのＴｉＮをイオンプレーティング法で、被覆した本発
明品（面アラサ１．６μ）では、３００回の繰返しでも
ハンダの付着は認められなかった。As can be seen from Table 1, with the conventional reprinted tungsten rod, local adhesion of solder occurred on the surface of the rod after approximately 40 repeated treatments. However, the base material is Ti-
The product of the present invention, which is made of 6A l-4V alloy and processed to have a surface roughness of 1.8μ, does not have local adhesion of solder until it is repeated about 200 times, resulting in a service life that is about 5 times longer than that of conventional products. In addition, a product of the present invention in which the base material is pure Ti and the surface is coated with 1 to 2 μm of TiN by sputtering method (surface 7 U?2.6
μ) and 2-3 on the surface of Ti-6A l-4V alloy.
In the product of the present invention (surface roughness: 1.6 μ) coated with μ TiN by ion plating, no solder adhesion was observed even after 300 repetitions.

第１表 本発明のハンダ付け用治具部材をＩＣのハンダ付け時の
下側および上側支持棒として用いた結果、上述したと同
様にハンダの付着が生じず、支持棒としての繰返し使用
が可能であり、かつハンダ付けされたＩＣの品質が良好
であることが確認された。Table 1 As a result of using the soldering jig member of the present invention as the lower and upper support rods during IC soldering, no adhesion of solder occurs as described above, and it is possible to use it repeatedly as a support rod. It was confirmed that the quality of the soldered IC was good.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、母材としてＴｉまたはＴｉ合金を用い
、かつ少なくとも溶融するハンダと接触する部分の面ア
ラサを３μ以下とすることにより、安価で高精度かつ軽
量でハンダの付着しない繰返し使用可能なハンダ付け用
治具部材を提供できる。According to the present invention, by using Ti or a Ti alloy as the base material and by setting the surface roughness of at least the part that contacts the melting solder to 3μ or less, it is inexpensive, highly accurate, lightweight, and can be used repeatedly without adhesion of solder. It is possible to provide a soldering jig member.

Claims (1)

【特許請求の範囲】 １　母材がＴｉまたはＴｉ合金であり、該母材の少なく
とも溶融するハンダと接触する部分の面アラサが３μ以
下であることを特徴とするハンダ付け用治具部材。 ２　母材の少なくとも溶融するハンダと接触する部分が
、ハンダと濡れ難い物質で被覆されている特許請求の範
囲第１項記載のハンダ付け用治具部材。 ３　ハンダと濡れ難い物質が、Ｔｉ、Ｚｒ、Ａｌ、Ｓｉ
、Ｂの酸化物、窒化物、炭化物、炭窒化物、ホウ化物や
Ｍｏ、Ｗまたはその合金のうちこれらの１種または２種
以上のものである特許請求の範囲第２項記載のハンダ付
け用治具部材。 ４　ハンダと濡れ難い物質が、イオンプレーティング、
スパッタリングあるいは真空蒸着のいずれかの方法によ
って形成された特許請求の範囲第２項または第３項のい
ずれか記載のハンダ付け用治具部材。 ５　ハンダと濡れ難い物質の被膜厚さが１０μ以下であ
る特許請求の範囲第２項ないし第４項のいずれか記載の
ハンダ付け用治具部材。[Scope of Claims] 1. A soldering jig member, characterized in that the base material is Ti or a Ti alloy, and the surface roughness of at least the portion of the base material that comes into contact with melting solder is 3μ or less. 2. The soldering jig member according to claim 1, wherein at least the portion of the base material that comes into contact with the melting solder is coated with a substance that is difficult to wet with the solder. 3 Substances that are difficult to wet with solder include Ti, Zr, Al, and Si.
, B oxides, nitrides, carbides, carbonitrides, borides, Mo, W, or alloys thereof. Jig parts. 4 Substances that are difficult to wet with solder are ion plating,
The soldering jig member according to claim 2 or 3, which is formed by either sputtering or vacuum deposition. 5. The soldering jig member according to any one of claims 2 to 4, wherein the coating thickness of the substance that is difficult to wet with solder is 10 μm or less.