JPS61258462A - Assembly of electronic component parts - Google Patents

Assembly of electronic component parts

Info

Publication number
JPS61258462A
JPS61258462A JP61117255A JP11725586A JPS61258462A JP S61258462 A JPS61258462 A JP S61258462A JP 61117255 A JP61117255 A JP 61117255A JP 11725586 A JP11725586 A JP 11725586A JP S61258462 A JPS61258462 A JP S61258462A
Authority
JP
Japan
Prior art keywords
lead frame
leads
wiring board
circuit element
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61117255A
Other languages
Japanese (ja)
Other versions
JPH041504B2 (en
Inventor
Keizo Otsuki
大槻　桂三
Kazuo Shimizu
一男 清水
Fumihito Inoue
文仁 井上
Susumu Okikawa
進 沖川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61117255A priority Critical patent/JPS61258462A/en
Publication of JPS61258462A publication Critical patent/JPS61258462A/en
Publication of JPH041504B2 publication Critical patent/JPH041504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce the cost of a wiring board and improve a mounting density by a method wherein a lead frame is plated and a circuit element is fixed to a tab, and the tab, the circuit element and parts of the leads are sealed with sealing resin and the lead frame is cut off. CONSTITUTION:An electronic part 7 is composed of a cuboid sealing part 8 and a plurality of leads 9 which are extended from the sides of the sealing part 8 and bent downward at their intermediate portions. The tips of the leads 9 extended downward touch the upper surface of a wiring board 10 and these touching parts are fixed with solder, welding material, to fix the electronic part 7 to the wiring board 10. Outside ends of the leads 9 in a lead frame 12 are separated from the framework 13 in the manufacturing process of the lead frame and, in this condition, the whole lead frame is plated with silver. After a circuit element 15 is fixed on a tab 14, electrodes of the circuit element 15 are connected to the inner ends of the leads 9 with wires 16. Then the portion inside a dam 17 is molded with resin and the unnecessary dam 17 and framework 13 are cut off and removed. With this constitution, the cost of the wiring board can be reduced and the mounting density can be improved.

Description

【発明の詳細な説明】 収千余１ 構造）に関する。[Detailed description of the invention] Over 1,000 yen structure).

封正忙の側面から複数のリード（外部端子）を突出する
構造の電子部品（たとえば半導体装ｇｌ＞をプリント基
板、セラミック基板等の配線板に取り付ける構造として
は、従来、第１図（ａ）、（１））で示す構造が知られ
ている。同図（ａ）の構造は封止部１から嫌びるリード
２を途中で同一方向に折り曲げてインライン形にし、各
リード２を配線板３に設けた取付孔４に挿し込み、配線
板３を貫通した先端部と配線板３とを半田５を介して固
定する構造となっている。また、同図（ｋｌ）の構造は
インライン形のリード２の先端を再び外方に折り曲げて
フラットタイプとし、この先端平坦部６を配線板３に載
せて図示しない半田を介して固定するｙｔａである。な
お、これらの図ておいては配線板面の配線層は省略して
あろう しかし、前者の挿込構造は配線板に取付孔を穿たなけれ
ばならず、配線板コストが高くなる難点がある。また、
後者のフラットタイプは取付面積が広くなり、実装密度
が低くなる欠点がある。Conventionally, as a structure for attaching an electronic component having a structure in which multiple leads (external terminals) protrude from the side surface of the seal (for example, a semiconductor device) to a wiring board such as a printed circuit board or a ceramic board, the structure shown in Fig. 1 (a) is used. , (1)) are known. In the structure shown in FIG. 2(a), the leads 2 that are removed from the sealing part 1 are bent in the same direction midway to form an in-line shape, each lead 2 is inserted into a mounting hole 4 provided in a wiring board 3, and the wiring board 3 is It has a structure in which the penetrating tip portion and the wiring board 3 are fixed via solder 5. The structure shown in the same figure (kl) is a yta type in which the tip of the inline lead 2 is bent outward again to make it a flat type, and the flat tip 6 is placed on the wiring board 3 and fixed via solder (not shown). be. Note that the wiring layer on the wiring board surface is omitted in these figures, but the former insertion structure requires drilling holes in the wiring board, which has the disadvantage of increasing the cost of the wiring board. be. Also,
The latter flat type has the disadvantage that the installation area is large and the mounting density is low.

したがって、本発明の目的は配線板コストの低廉化およ
び実装密度の向上を図ることが可能な電子部品の組立方
法を提供することにある。以下実施例により本発明を説
明する。Therefore, an object of the present invention is to provide a method for assembling electronic components that can reduce wiring board costs and improve packaging density. The present invention will be explained below with reference to Examples.

第２図は本発明の一実施例による電子部品の実装構造を
示す。同図に示す電子部品７は直方体からなる封止部８
と、封止部８の側面から延び途中で下方に折れ曲がる複
数のリード９とからなっている。そして、この電子部品
７は下方に延びるリード９の先端を配線板（配線層は省
略しである。）ｌＯの上面に当接し、その当接部を鑞材
である半田１１によって配線板ＩＯに固定している。FIG. 2 shows a mounting structure for electronic components according to an embodiment of the present invention. The electronic component 7 shown in the figure has a sealing part 8 made of a rectangular parallelepiped.
and a plurality of leads 9 extending from the side surface of the sealing part 8 and bending downward in the middle. Then, this electronic component 7 has the tip of the lead 9 extending downward in contact with the upper surface of the wiring board (wiring layer is omitted) IO, and the contact portion is attached to the wiring board IO using solder 11, which is a solder material. Fixed.

このような実装構造によれば、配線板１０に取付孔を設
ける必要がないことから配線板の製造コストが安価とな
る。また、フラットタイプのようような実装構造では取
付面積が狭くてもよく、実装密度の向上を図ることがで
きる。特にモールド部から４方向ＫＩＪ−ドが延在する
構造では取付面積の縮小化に効果が顕著である。According to such a mounting structure, since there is no need to provide a mounting hole in the wiring board 10, the manufacturing cost of the wiring board becomes low. Further, in a mounting structure such as a flat type, the mounting area may be small, and the mounting density can be improved. Particularly in a structure in which the KIJ-dore extends in four directions from the mold part, the effect of reducing the mounting area is remarkable.

なお、前記実施例にあって、封止部８の外縁からリード
９の屈曲部までの距離ｔをできるだけ短かくすることに
よって実装面積をさらに狭くすることができる。ｔた、
リードを封止部の界面で折り曲げるようにすればリード
の折り曲げが容易となる利点もある。また、リード９の
長さく高さＨ）を短かくすることによって、電子部品の
ノ・／ドリンク時にリードが引っ掛りにくくなる。この
ため、リード曲がりの発生を少なくすることもできる。In the above embodiment, the mounting area can be further reduced by making the distance t from the outer edge of the sealing part 8 to the bent part of the lead 9 as short as possible. It was,
If the leads are bent at the interface of the sealing part, there is an advantage that the leads can be easily bent. Furthermore, by shortening the length and height H) of the lead 9, the lead is less likely to be caught when inserting/drinking electronic components. Therefore, the occurrence of lead bending can also be reduced.

また、この実装構造ではリード端面のソルダビリティ（
ｆ−田の濡れ性）の良否が接続の良否に大きく影響する
。そこで、ソルダビリティを向上させるためにリード表
面に銀めっき等を砲こす場合もリードの先端面にも銀め
っきを施こす必要がある。この場合、第３図で示すよう
なリードフレーム１２を用いて電子部品を組み立てると
よい０このリードフレーム１２はリードフレーム製造の
段階でリード９の外端（モールド部から露出する先端）
をリードフレーム枠１３かも分離しておき、この状態で
リードフレーム全体を恨めつきする。In addition, this mounting structure also has the solderability of the lead end face (
The quality of the f-field wettability greatly affects the quality of the connection. Therefore, even when silver plating or the like is applied to the lead surface in order to improve soldability, it is necessary to also apply silver plating to the tip end surface of the lead. In this case, it is preferable to assemble electronic components using a lead frame 12 as shown in FIG.
The lead frame frame 13 is also separated, and the entire lead frame is held in this state.

そして、タブ１４上に回路素子１５を固定した後、回路
素子１５の電極とリード９の内端をワイヤ１６で繋ぎ、
その後ダム１７の内部をレジンでモールドし、不要なダ
ム１７．リードフレーム枠Ｉ３を切断除去する。また、
タブリード１８はモールド部１９あるいはリードフレー
ム枠１３の付は根から切断する。この実施例では、リー
ド先端面にもソルダビリティの良好な銀めっきが施こさ
れるので、電子部品の取り付けの信頼性も向上する。ま
た、このようなリードフレームを用いることによって、
リード切断成形機の金型の構造も簡素となることから、
金型製Ｊをコストも安価となる。After fixing the circuit element 15 on the tab 14, the electrode of the circuit element 15 and the inner end of the lead 9 are connected with a wire 16.
After that, the inside of the dam 17 is molded with resin, and unnecessary dam 17. Cut and remove the lead frame frame I3. Also,
The tab lead 18 is cut from the root of the mold part 19 or the lead frame frame 13. In this embodiment, since silver plating with good solderability is also applied to the lead end surfaces, the reliability of mounting electronic components is also improved. Also, by using such a lead frame,
Since the structure of the mold of the lead cutting molding machine is also simple,
The cost of mold-made J is also low.

なお、このような形状のリードフレームにあっては、レ
ジ／モールド時のレジンの内圧によってダムが外方に曲
がるおそれもあることから、不要なあきリードの外端を
リードフレーム枠に連結したり、ダムとリードフレーム
枠間に補強片を渡すようにすることが望ましい。これら
あきリードおよび補強片はダム切断によってリードから
外れてしまうので製造上も特に間値はない。In addition, with a lead frame of this type, there is a risk that the dam may bend outward due to the internal pressure of the resin during registration/molding, so do not connect the outer ends of unnecessary open leads to the lead frame frame. , it is desirable to pass a reinforcing piece between the dam and the lead frame frame. Since these open leads and reinforcing pieces are separated from the leads by cutting the dam, there is no particular limit in manufacturing.

一方、第４図（ａ＞　、　（ｂ）に示すように、ソルダ
ビリティの良好な金属でリードフレームが作られている
場合には、同図（ｂ）で示すように、リード９の先端部
にダム切断面２０およびリード切断面２】が現われるよ
うにすることが望ましい。このようにすると、ダム切断
面２０　、１７一ド切断面２１は鏝後に切断されて現わ
れた面であることからきれいな面となって、ソルダビリ
ティも良好となる。On the other hand, as shown in FIG. 4(a) and (b), if the lead frame is made of a metal with good solderability, the tip of the lead 9 It is desirable that the dam cut surface 20 and the reed cut surface 2 appear on the trowel.In this way, the dam cut surface 20, 17 and the lead cut surface 21 are the surfaces cut after the trowel, so they are clean. The solderability is also good.

以上のように、本発明の１！ソ部品つ取付ｌ１ｌｌ造に
よれば、配線板−コストの軽減化、実装密度の向上を図
ることができるので、電子部品の実装コストを低減でき
る。As mentioned above, 1! of the present invention! According to the one-piece mounting structure, it is possible to reduce the wiring board cost and improve the mounting density, thereby reducing the mounting cost of electronic components.

また、本発明によれば、電子部品の実装の信頼性も高い
等多くの効果２奏する。Further, according to the present invention, there are many effects such as high reliability in mounting electronic components.

【図面の簡単な説明】[Brief explanation of drawings]

第１図・嶌）、（ｂ）は従来の電子部品の取付構造？示
す断面図および正面図、第２図は本発明の一実施例によ
る電子部品の取付構造を示す一部断面図、第３図は本発
明の他の実施例に用いるリードフレームの〒面図、第４
図（ａ）　、　（ｂ）は本発明の池の実施例による電子
部品の斜視図およびリードの一部の斜視図である。 １・・封止部、２・・リード、３・・配線板、４・・取
付孔、５・・半田、６・！先端平坦部、７Ｑ−電子部品
、８・・封止部、９・−リード、１０・・配線板、】１
・・半田、１２・・リードフレーム、１３会・リードフ
レーム枠、１４−争タブ、１５・・回路素？−１ｔ６・
、ワイヤ、１７・・ダム、】８・・タブリード、１９・
・モールドｉ、２０・・ダム切断面、２１＠ｅリ一ド切
断面。 第　　１　　図 （、）　　　　　　　　　　　　（ｂ）第　　４　　図Is Fig. 1 (Shima) and (b) the conventional mounting structure for electronic components? 2 is a partial sectional view showing an electronic component mounting structure according to one embodiment of the present invention, and FIG. 3 is a top view of a lead frame used in another embodiment of the present invention. Fourth
Figures (a) and (b) are a perspective view of an electronic component and a perspective view of a portion of a lead according to an embodiment of the present invention. 1...Sealing part, 2...Lead, 3...Wiring board, 4...Mounting hole, 5...Solder, 6...! Flat end, 7Q-electronic component, 8...Sealing part, 9--Lead, 10...Wiring board, ]1
...Solder, 12..Lead frame, 13.Lead frame frame, 14.Tab, 15..Circuit element? -1t6・
, wire, 17... dam, ]8... tab lead, 19...
・Mold i, 20...Dam cutting surface, 21@e lead cutting surface. Figure 1 (,) (b) Figure 4

Claims (1)

【特許請求の範囲】[Claims] １、回路素子が固定される短形のタブと、そのタブの辺
に沿って複数配列してなるリードとを有し、それらリー
ドの先端は自由端をなしている電子部品用リードフレー
ムを用意し、そのリードフレームに半田濡れ性の良好な
めっき処理し、そのタブに回路素子を固定し、そのタブ
、回路素子およびリードの一部を樹脂封止体により封止
し、リードフレームを切断することを特徴とする電子部
品の組立方法。1. Prepare a lead frame for electronic components that has a rectangular tab to which a circuit element is fixed, and a plurality of leads arranged along the sides of the tab, with the tips of these leads forming free ends. Then, the lead frame is plated with good solder wettability, the circuit element is fixed to the tab, the tab, the circuit element, and a part of the lead are sealed with a resin sealant, and the lead frame is cut. A method for assembling electronic components characterized by:
JP61117255A 1986-05-23 1986-05-23 Assembly of electronic component parts Granted JPS61258462A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61117255A JPS61258462A (en) 1986-05-23 1986-05-23 Assembly of electronic component parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61117255A JPS61258462A (en) 1986-05-23 1986-05-23 Assembly of electronic component parts

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1146179A Division JPS55103789A (en) 1979-02-05 1979-02-05 Strucutre for mounting electronic part

Publications (2)

Publication Number Publication Date
JPS61258462A true JPS61258462A (en) 1986-11-15
JPH041504B2 JPH041504B2 (en) 1992-01-13

Family

ID=14707235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61117255A Granted JPS61258462A (en) 1986-05-23 1986-05-23 Assembly of electronic component parts

Country Status (1)

Country Link
JP (1) JPS61258462A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5671897A (en) * 1979-11-13 1981-06-15 Sanyo Electric Co Ltd Nonvolatile storage device
JPS58215794A (en) * 1982-06-08 1983-12-15 Toshiba Corp Non-volatile memory device
JPS59135600U (en) * 1983-02-25 1984-09-10 株式会社アドバンテスト Electronic equipment with rewritable non-volatile memory

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141961A (en) * 1974-10-07 1976-04-08 Nippon Electric Co Handotai shusekikairosochoriidofureemu
JPS5816339B2 (en) * 1975-04-04 1983-03-30 日本電気株式会社 Hand tie souchi
JPS5363979A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Sealing method of semiconductor element and lead frame used for the same
JPS5380969A (en) * 1976-12-27 1978-07-17 Hitachi Ltd Manufacture of resin shield type semiconductor device and lead frame used for the said process
JPS53141577A (en) * 1977-05-17 1978-12-09 Mitsubishi Electric Corp Lead frame for integrated circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5671897A (en) * 1979-11-13 1981-06-15 Sanyo Electric Co Ltd Nonvolatile storage device
JPS58215794A (en) * 1982-06-08 1983-12-15 Toshiba Corp Non-volatile memory device
JPS59135600U (en) * 1983-02-25 1984-09-10 株式会社アドバンテスト Electronic equipment with rewritable non-volatile memory

Also Published As

Publication number Publication date
JPH041504B2 (en) 1992-01-13

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