JPS61247038A - Injection mold for ic - Google Patents
Injection mold for icInfo
- Publication number
- JPS61247038A JPS61247038A JP8795985A JP8795985A JPS61247038A JP S61247038 A JPS61247038 A JP S61247038A JP 8795985 A JP8795985 A JP 8795985A JP 8795985 A JP8795985 A JP 8795985A JP S61247038 A JPS61247038 A JP S61247038A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin
- gate
- cavity side
- sectional area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 title abstract description 5
- 239000007924 injection Substances 0.000 title abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 238000000465 moulding Methods 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
- B29C2045/2712—Serial gates for moulding articles in successively filled serial mould cavities
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、IC用モールド金型に関し、特に1ケの注入
ダートに2ケのキャピテ°イを有するモールド金型に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mold for IC, and particularly to a mold having two cavities in one injection dart.
モールド金型には、第3,4図に示すように、ランナー
部1から第1のキャビティ3へ樹脂を注入する第1のデ
ート部2と、第1のキャピテイ3から第2のキャビティ
5へ樹脂を注入する第2のダート部4とを有するものが
ある。従来、第2のゲート部4は第3図、第4図に示す
通り断面形状が均一である。さらにモールド成形後の切
断性を向上させるため、キャビティ断面より非常に小さ
いのが普通である。As shown in FIGS. 3 and 4, the mold includes a first date part 2 for injecting resin from a runner part 1 into a first cavity 3, and a first date part 2 for injecting resin from a runner part 1 into a first cavity 3, and a part for injecting resin from a first cavity 3 into a second cavity 5. Some have a second dirt part 4 into which resin is injected. Conventionally, the second gate portion 4 has a uniform cross-sectional shape as shown in FIGS. 3 and 4. Furthermore, in order to improve cutting performance after molding, the cross section is usually much smaller than the cavity cross section.
上述した従来の第2のダート部4は断面が均一かつ小さ
いため、第2のキャビティ5への樹脂の注入効率が悪く
、第2のキャビティ5での樹脂未完てんが発生し易い。Since the conventional second dart portion 4 described above has a uniform and small cross section, the resin injection efficiency into the second cavity 5 is poor, and resin is likely to be incompletely filled in the second cavity 5.
さらに第1及び第2のキャビティ3,5の第2のゲート
部4側に樹脂中に巻き込まれた空気がたまり易く、ティ
ドが発生し易いという欠点があった。Furthermore, there is a drawback that air caught in the resin tends to accumulate on the second gate portion 4 side of the first and second cavities 3 and 5, and tidbits tend to occur.
本発明は前記問題点を解消した装置を提供するものであ
る。The present invention provides an apparatus that solves the above problems.
本発明は第1のキャビティ側の第2のゲート部断面積を
第2のキャビティ側より広くしたことを特徴とするIC
用モールド金型である。The present invention provides an IC characterized in that the cross-sectional area of the second gate portion on the first cavity side is wider than that on the second cavity side.
This is a mold for.
以下、本発明の一実施例を図によって説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第1図、第2図においそ、2はランナー部1から第1の
キャビティ3に樹脂を注入する第1のダート部、4は第
1のキャビティ3から第2のキャビティ5に樹脂を注入
する第2のゲート部である。In Figs. 1 and 2, 2 is a first dart part for injecting resin from the runner part 1 into the first cavity 3, and 4 is a part for injecting resin from the first cavity 3 into the second cavity 5. This is the second gate section.
本実施例において、第2のゲート部4は第1のキャビテ
ィ側の断面積S1を第2のキャビティ側の断面積S2よ
り広< (Sl>82)する。In this embodiment, the second gate portion 4 has a cross-sectional area S1 on the first cavity side that is wider than a cross-sectional area S2 on the second cavity side (Sl>82).
本実施例によれば、第2のゲート部4は第1のキャビテ
ィ側の断面積S1が広くなっているため、第1のキャビ
ティ3に樹脂の充てんがあまり進行しないうちに第2の
キャビティ5に樹脂が注入されることになり、樹脂の流
れがスムースとなり、前述の未充てん及び♂イドの発生
が押えられる。According to this embodiment, since the second gate part 4 has a large cross-sectional area S1 on the first cavity side, the second cavity 5 is filled before the first cavity 3 is filled with resin much. Since the resin is injected into the mold, the flow of the resin becomes smooth, and the occurrence of the above-mentioned unfilling and male id is suppressed.
さらに、モールド成形後の切断はく第2のキャビティ5
側を先に切断し、しかる後に第1のキャビティ3側を切
断することにより容易に行うことができるものである。Furthermore, the second cavity 5 is cut after molding.
This can be easily done by cutting the side first and then cutting the first cavity 3 side.
以上説明したように本発明によれば、第2のキャビティ
への注入効率を向上することができ、樹脂の未充てん及
び?イドの発生を軽減できる効果る有するものである。As explained above, according to the present invention, it is possible to improve the injection efficiency into the second cavity, and to prevent resin from being unfilled and filling the second cavity. It has the effect of reducing the occurrence of id.
第1図は本発明の一実施例を示す平面図、第2図は第1
図のX−Y線断面図、第3図は従来例を示す平面図、第
4図は第3図のx’−y’線断面図である。
1・・・ランナー部、2・・・第1のダート部、3・・
・第1のキャビティ部、4・・・第2のゲート部、5・
・・第2のキャビティ部
特許出願人 日本電気株式会社
第1図
第2図
第4図Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
3 is a plan view showing a conventional example, and FIG. 4 is a sectional view taken along the line x'-y' of FIG. 3. 1... Runner part, 2... First dirt part, 3...
・First cavity part, 4... Second gate part, 5.
...Second cavity part patent applicant NEC Corporation Figure 1 Figure 2 Figure 4
Claims (1)
部から第1のキャビティへ樹脂を注入する第1のゲート
部と、第1のキャビティから第2のキャビティへ樹脂を
注入する第2のゲート部とを有し、該第2のゲート部は
第1のキャビティ側断面積を第2のキャビティ側より広
くしたことを特徴とするIC用モールド金型。(1) A transfer mold mold has a first gate part that injects resin from the runner part to the first cavity, and a second gate part that injects the resin from the first cavity to the second cavity. The IC molding die is characterized in that the second gate portion has a cross-sectional area on the first cavity side larger than that on the second cavity side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8795985A JPS61247038A (en) | 1985-04-24 | 1985-04-24 | Injection mold for ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8795985A JPS61247038A (en) | 1985-04-24 | 1985-04-24 | Injection mold for ic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61247038A true JPS61247038A (en) | 1986-11-04 |
Family
ID=13929402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8795985A Pending JPS61247038A (en) | 1985-04-24 | 1985-04-24 | Injection mold for ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61247038A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0730938A1 (en) * | 1994-09-21 | 1996-09-11 | Sekisui Kagaku Kogyo Kabushiki Kaisha | Method of manufacturing spheroidal moldings |
US5624691A (en) * | 1994-06-21 | 1997-04-29 | Texas Instruments Incorporated | Transfer mold design |
-
1985
- 1985-04-24 JP JP8795985A patent/JPS61247038A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5624691A (en) * | 1994-06-21 | 1997-04-29 | Texas Instruments Incorporated | Transfer mold design |
US5744083A (en) * | 1994-06-21 | 1998-04-28 | Texas Instruments Incorporated | Method for molding semiconductor packages |
EP0730938A1 (en) * | 1994-09-21 | 1996-09-11 | Sekisui Kagaku Kogyo Kabushiki Kaisha | Method of manufacturing spheroidal moldings |
EP0730938A4 (en) * | 1994-09-21 | 1998-05-27 | Seikisui Chemical Co Ltd | Method of manufacturing spheroidal moldings |
US5792406A (en) * | 1994-09-21 | 1998-08-11 | Sekisui Kagaku Kogyo Kabushiki Kaisha | Method of preparing spherical moldings |
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