JPS61245872A - Manufacture of heat resistant substrate - Google Patents
Manufacture of heat resistant substrateInfo
- Publication number
- JPS61245872A JPS61245872A JP8828185A JP8828185A JPS61245872A JP S61245872 A JPS61245872 A JP S61245872A JP 8828185 A JP8828185 A JP 8828185A JP 8828185 A JP8828185 A JP 8828185A JP S61245872 A JPS61245872 A JP S61245872A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- polyimide
- aluminum
- metal
- resistant substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
Landscapes
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は印刷配線板に用いられる耐熱性基鈑の製造法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a heat-resistant substrate used for printed wiring boards.
絶縁性基材の表面に導体回路を形成した印刷配線板用基
板としては、フェノール樹脂やエボヤシ樹脂をセルロー
ズ基材やガラス布に含浸硬化させた絶縁性基材表面に銅
箔を貼着したもの、あるいはポリイミド等のフィルムの
上に銅箔を貼着したフレキシブルプリント基板がある。Printed wiring board substrates with conductor circuits formed on the surface of an insulating base material are those made by impregnating and hardening a cellulose base material or glass cloth with phenol resin or ebony resin and pasting copper foil on the surface of the insulating base material. Alternatively, there is a flexible printed circuit board in which copper foil is adhered to a film such as polyimide.
このうちフレキシブルプリント基板は近年電子機器の小
型化、高密度化、薄型化を達成する手段として多用され
る傾向にある。従来のフレキシブルプリント基板はポリ
イミドフィルムと鋼箔を接着剤によシ接着する方法によ
り製造されている為に、この耐熱性、耐薬品性、難燃性
、電気特性あるいは密着性といりた特性は使用する接着
剤に支配されてしまい、ポリイミドの優れた緒特性を充
分にいかすことが出来ないものであった。Among these, flexible printed circuit boards have recently been increasingly used as a means to achieve smaller size, higher density, and thinner electronic equipment. Conventional flexible printed circuit boards are manufactured by bonding polyimide film and steel foil with adhesive, so their properties such as heat resistance, chemical resistance, flame retardance, electrical properties, and adhesion are The excellent adhesive properties of polyimide could not be fully utilized because the adhesive used was the one controlling the problem.
この問題を解決する方法として鋼箔上にポリアミド酸（
ポリイミドの前駆体）又はポリイミドの溶液を直接流延
塗布、溶媒除去、硬化によシ製造する方法（以下ダイレ
クトコート法と略す）が提案されている。As a way to solve this problem, polyamic acid (
A method has been proposed in which a polyimide precursor (polyimide precursor) or a polyimide solution is directly cast-coated, solvent removed, and cured (hereinafter abbreviated as direct coating method).
この方法によれば前述の接着剤による特性低下が解決さ
れるだけでなく製造工程の大巾な簡素化が可能となる。This method not only solves the above-mentioned deterioration in properties caused by the adhesive, but also enables a significant simplification of the manufacturing process.
しかしながらこの方法を大気中で行なうと。However, if this method is performed in the atmosphere.
得られるプリント基板のポリイミド層自体の特性がフィ
ルム単独で作製したものに比べ大きく低下するという問
題点がさる。本発明はかへる欠点のないダイレクトコー
ト法耐熱性基板を提供せんとするものである。Another problem is that the properties of the polyimide layer itself of the resulting printed circuit board are significantly lower than those made from a film alone. The present invention aims to provide a heat-resistant substrate using a direct coating method that does not have such drawbacks.
本発明者らは上記ダイレクトコート法により得られるプ
リント基板のポリイミド層の劣化機構について鋭意研究
した結果ポリイミド層の劣化は酸素の存在下での銅（Ｉ
ｔ）イオンとポリイミドの反応に起因するものであるこ
とをつきとめた。The present inventors conducted intensive research on the deterioration mechanism of the polyimide layer of printed circuit boards obtained by the above-mentioned direct coating method.
t) It was determined that this was caused by a reaction between ions and polyimide.
そこで金属基材としてアルミニウムを用いるとポリイミ
ド層の劣化が銅の場合に比較して大巾に改善されること
を見出し本発明に至った。Therefore, the inventors have discovered that the use of aluminum as the metal base material significantly improves the deterioration of the polyimide layer compared to the case of copper, leading to the present invention.
すなわち本発明はアルミニウム基材もしくは表面が金属
アルミニウムで徨われた金属基材の表面に、ポリアミド
酸またはポリイミドワニスを直接塗布し、乾燥硬化させ
ることによってポリイミド層を金属基材上に直接形成さ
せることを特徴とするものである。That is, the present invention involves directly applying polyamic acid or polyimide varnish to the surface of an aluminum base material or a metal base material whose surface is covered with metal aluminum, and drying and curing to form a polyimide layer directly on the metal base material. It is characterized by:
ここでアルミニウム基材とはアルミ箔あるいはアルミ薄
板を含み、また表面が金属アルミニウムで覆われた金属
基材とは圧接（クラッド）、メッキ、スパッタリングあ
るいはイオンビーム法といり之方法によシ銅箔等の金属
表面に金属アルミニウムの層を形成し次複合材を含むも
のである。Here, the aluminum base material includes aluminum foil or aluminum thin plate, and the metal base material whose surface is covered with metal aluminum refers to copper foil that is bonded by pressure bonding (cladding), plating, sputtering, or ion beam method. A layer of metallic aluminum is formed on the surface of a metal such as, and then a composite material is included.
また本発明に用いられるポリアミド酸ワニスあるいはポ
リイミドワニスとは芳香族ポリカルボン酸と芳香族ジア
ミン類を反応させて得られるものであれば特に種類は問
わない。Moreover, the type of polyamic acid varnish or polyimide varnish used in the present invention is not particularly limited as long as it is obtained by reacting an aromatic polycarboxylic acid with an aromatic diamine.
本発明で得られる基板の構成としては、アルミ箔単独ま
たは複合箔の片面又は両面にポリイミドをコーティング
しｔものや、ポリイミド層を中にしポリイミド層の両面
に金属箔を配したもの、および、箔の代りに板を使用し
たものが考えられる。The structure of the substrate obtained by the present invention includes aluminum foil alone or composite foil coated with polyimide on one or both sides, a polyimide layer inside and metal foil arranged on both sides of the polyimide layer, and foil. It is possible to use a board instead.
ポリアミド酸ワニスあるいはポリイミドワニスの塗布方
法としては、流延法など通常行なわれている方法が適用
できる。被塗物はその後低温の乾燥機中で溶媒を乾燥除
去したのち高温の硬化炉を通してフィルム化される。As a method for applying the polyamic acid varnish or polyimide varnish, a commonly used method such as a casting method can be applied. The coated material is then dried to remove the solvent in a dryer at a low temperature and then passed through a curing oven at a high temperature to form a film.
以下本発明を実施例によシ更に説明する。The present invention will be further explained below using examples.
実施例１゜
ジアミン成分としてｐ −フェニレンジアミン、酸無水
物としてｓ 、５’、 ４．４’−ビフェニルテトラカ
ルボン酸二無水物ｉＮ−メチルピロリドン溶媒中で反応
させた後粘度調整し回転粘度的１．０００ボイズの粘稠
なポリアミド酸ワニスとした。Example 1 p-phenylenediamine as the diamine component and s,5',4,4'-biphenyltetracarboxylic dianhydride as the acid anhydride iN-Methylpyrrolidone After reaction in a solvent, the viscosity was adjusted and rotational viscosity was determined. A viscous polyamic acid varnish with a void of 1.000 was used.
このワニスを７５μｍ厚のアルミニウム箔上に流延塗布
した後％ ５０℃〜１００℃で乾燥し溶媒を除去した後
、４００℃で１０分加熱しポリアミド酸を閉環反応によ
りポリイミド化してフレキシブルプリント基板を作製し
た。This varnish was cast onto a 75 μm thick aluminum foil, dried at 50°C to 100°C to remove the solvent, and then heated at 400°C for 10 minutes to convert the polyamic acid into polyimide through a ring-closing reaction to form a flexible printed circuit board. Created.
比較例１゜
金属箔として３５μｍ厚の電解鋼箔を用いて実施例１と
同様にしてフレキシブルプリント基板を作製しｔｏ
実施例２゜
金属箔として銅箔（９μ）とアルミ箔（７５μ）のクラ
ッド菖を用いて実施例１と同様にしてフレキシブルプリ
ント基板を作製した。Comparative Example 1 A flexible printed circuit board was produced in the same manner as in Example 1 using electrolytic steel foil with a thickness of 35 μm as the metal foil.Example 2 A cladding of copper foil (9μ) and aluminum foil (75μ) as the metal foil A flexible printed circuit board was produced in the same manner as in Example 1 using irises.
比較例２゜
金属箔として無酸素鋼箔３５μｍ厚にクロムメッキした
ものを使用し実施例１の方法でフレキシブルプリント基
板を作製した。Comparative Example 2 A flexible printed circuit board was produced by the method of Example 1 using oxygen-free steel foil plated with chrome to a thickness of 35 μm as the metal foil.
実施例五
金属箔として比較例２の銅箔に１．０００人厚さに純ア
ルミニウムをスパッタリングにより膜付けしたものに、
実施例１のポリアミド酸ワニスをアプリケータで塗工し
５０℃〜１００℃で溶剤を除去した後、４００℃で１０
分間加熱し硬化させて基板を得た。Example 5 As a metal foil, a pure aluminum film was applied to the copper foil of Comparative Example 2 to a thickness of 1,000 mm by sputtering.
The polyamic acid varnish of Example 1 was applied with an applicator, the solvent was removed at 50°C to 100°C, and then the varnish was applied at 400°C for 10
A substrate was obtained by heating and curing for a minute.
比較例＆
金属箔として３５μｍ厚の銅箔にニッケルメッキしたも
のを用い実施例３と同様にして基板を得た。Comparative Example & A substrate was obtained in the same manner as in Example 3 using a 35 μm thick copper foil plated with nickel as the metal foil.
実施例４゜
４．４′−ジアミノジフェニルエーテルと３．３’、
４ 。Example 4゜4.4'-diaminodiphenyl ether and 3.3',
4.
４′−ビフェニルテトラカルボン酸二無水物をｐ−クロ
ルフェノール中で１７０℃、ＩＨｒｌ［縮合反応させ回
転粘度１７００ポアズのポリイミドワニスを得た。溶液
中のポリイミドは５ｗｔ。4'-biphenyltetracarboxylic dianhydride was subjected to an IHrl condensation reaction in p-chlorophenol at 170°C to obtain a polyimide varnish having a rotational viscosity of 1700 poise. The polyimide in the solution was 5wt.
％である。このポリイミドワニスを７５μｎのアルミ箔
上に流延し％ １００℃でＩＨｒ％２００℃でＩＨｒ、
３００℃でＩＨｒ加熱しフレキシブルプリント基板を得
た。%. This polyimide varnish was cast on a 75 μn aluminum foil,
A flexible printed circuit board was obtained by IHr heating at 300°C.
比較例４゜
３５８℃厚の両面粗化銅箔を用いた他は実施例４と（ロ
）様にして７レキシプルプリント基板を得た。Comparative Example 4 A 7-lexiple printed circuit board was obtained in the same manner as in Example 4 except that a double-sided roughened copper foil having a thickness of 358°C was used.
実施例１〜４、比較例１〜４により作製した基板をエツ
チングにより金属箔を完全に除去しポリイミド層のみの
フィルムを得てこの引張強度と破断伸び率を測定した。The metal foil of the substrates prepared in Examples 1 to 4 and Comparative Examples 1 to 4 was completely removed by etching to obtain a film having only a polyimide layer, and the tensile strength and elongation at break were measured.
また実施例１で使用し次ポリアミド酸ワニスをガラス板
に塗布して作製し之ポリイミドフィルムの引張試験を行
いブランクとした。測定結果を表１に示す。Further, a tensile test of the polyimide film used in Example 1, which was prepared by coating a glass plate with the polyamic acid varnish, was used as a blank. The measurement results are shown in Table 1.
表１
表１から明らかなように、ポリイミドと接する金属がア
ルミニウムの場合には、ポリイミドの劣化が冥用上問題
ない範囲に納まる。Table 1 As is clear from Table 1, when the metal in contact with the polyimide is aluminum, the deterioration of the polyimide falls within a range that poses no practical problems.
上述の如く、本発明によればダイレクトコート法による
ポリイミドの劣化のない耐熱性基板の製造が可能にな、
っｔ。As described above, according to the present invention, it is possible to manufacture a heat-resistant substrate without deterioration of polyimide by a direct coating method,
t.
Claims (1)
で覆われた金属基材の表面に、ポリアミド酸またはポリ
イミドワニスを直接塗布し、乾燥硬化させることを特徴
とする耐熱性基板の製造法。 ２、アルミニウム基材がアルミ箔である特許請求の範囲
第１項記載の耐熱性基板の製造法。 ３、金属基材が銅箔である特許請求の範囲第１項記載の
耐熱性基板の製造法。[Claims] 1. Production of a heat-resistant substrate characterized by applying polyamic acid or polyimide varnish directly to the surface of an aluminum base material or a metal base material whose surface is covered with metal aluminum, and drying and curing it. Law. 2. The method for producing a heat-resistant substrate according to claim 1, wherein the aluminum base material is aluminum foil. 3. The method for manufacturing a heat-resistant substrate according to claim 1, wherein the metal base material is copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8828185A JPS61245872A (en) | 1985-04-24 | 1985-04-24 | Manufacture of heat resistant substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8828185A JPS61245872A (en) | 1985-04-24 | 1985-04-24 | Manufacture of heat resistant substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61245872A true JPS61245872A (en) | 1986-11-01 |
Family
ID=13938515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8828185A Pending JPS61245872A (en) | 1985-04-24 | 1985-04-24 | Manufacture of heat resistant substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61245872A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008279663A (en) * | 2007-05-10 | 2008-11-20 | Nikko Kinzoku Kk | Copper foil with al coating for copper clad laminate and copper clad laminate |
| CN100462599C (en) * | 2004-11-15 | 2009-02-18 | 三菱电机株式会社 | Electromagnetic valve for flow control |
-
1985
- 1985-04-24 JP JP8828185A patent/JPS61245872A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100462599C (en) * | 2004-11-15 | 2009-02-18 | 三菱电机株式会社 | Electromagnetic valve for flow control |
| JP2008279663A (en) * | 2007-05-10 | 2008-11-20 | Nikko Kinzoku Kk | Copper foil with al coating for copper clad laminate and copper clad laminate |
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