JPS612394A - Polymer molding unit for electromagnetically shielding - Google Patents

Polymer molding unit for electromagnetically shielding

Info

Publication number
JPS612394A
JPS612394A JP12194884A JP12194884A JPS612394A JP S612394 A JPS612394 A JP S612394A JP 12194884 A JP12194884 A JP 12194884A JP 12194884 A JP12194884 A JP 12194884A JP S612394 A JPS612394 A JP S612394A
Authority
JP
Japan
Prior art keywords
conductive
fibers
flocks
electromagnetic shielding
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12194884A
Other languages
Japanese (ja)
Inventor
博 竹田
正敏 藤川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Priority to JP12194884A priority Critical patent/JPS612394A/en
Publication of JPS612394A publication Critical patent/JPS612394A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、電磁シールド性を有する高分子成形体に関す
る。この高分子成形体は、優れた電磁シールド性を示す
ため、特に、コンピューター機器等の′11を子機器を
収納する筐体等として有用である。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a polymer molded article having electromagnetic shielding properties. Since this polymer molded product exhibits excellent electromagnetic shielding properties, it is particularly useful as a casing for accommodating sub-devices such as computer equipment.

近年、コンピータ機器は急速な発展を遂げている。高密
度、高出力のコンピュータ機器には、多数のIC、LS
Iが使用されているが、これらは高+z;J 波・やル
スを発生させ、周囲のラジオ、テレビ。
In recent years, computer equipment has undergone rapid development. High-density, high-output computer equipment requires a large number of ICs, LS
I are used, but these generate high +z;

その他の周辺機器にノイズを生じ、大きな障害となる。It causes noise to other peripheral devices and becomes a major hindrance.

このような障害電波を遮蔽することを′6磁シールドと
呼んでおり、米国連邦通信委員会はコンピュータ機器に
限らずデジタル技術を応用したあらゆるIL子装置へ、
について発生する1 01d(z以上の“周波数帯をシ
ールドするよう規制している。また、欧州諸国において
も電磁波障害に対する規制が実施されており、規制が強
化される傾向がみられる。従って、欧米諸国への輸出依
存度が高い我国の家電、電子機器などの業界においても
対策を迫られている。一方、我国でのこの種の規制も数
年内には実施されるといわれており、高分子成形体に導
電性を与え、電磁シールドの機能を持たせる技術の開発
は重要度が高捷っている。
Shielding such interference radio waves is called '6 magnetic shielding,' and the US Federal Communications Commission recommends that it be used not only for computer equipment but also for all IL child devices that apply digital technology.
Regulations are in place to shield the 101d (Z and above) frequency bands that occur in the area.European countries are also enforcing regulations against electromagnetic interference, and there is a tendency for regulations to be strengthened. Japan's home appliance and electronic equipment industries, which are highly dependent on exports to other countries, are also being forced to take countermeasures.On the other hand, it is said that this type of regulation will be implemented in Japan within the next few years. The development of technology that gives molded objects electrical conductivity and electromagnetic shielding functionality is of great importance.

従来の技術 ]ンピュータ機器等の電子機器を収納する筐体である高
分子成形体に電磁シールド性を付与する方法としては、
唾鉛溶射、導電性塗料等によって高分子成形体表面に導
電性皮膜を形成する表面処理手法が一般的に用いられて
いる。ところが、唾鉛溶射は加工装置が高価であり、処
理コストが高い;高分子成形体との密着性をよくするだ
めに能鉛溶射の前に表面予備処理が必要であシ量産性が
乏しい;騒音、空気汚染などの環境問題が発生しやすい
等の欠点がある。寸だ、導電性塗料は安価であるが、長
期間使用中にクラック発生、剥離などを生じ易く、耐久
性に問題がある。
[Prior art] As a method of imparting electromagnetic shielding properties to a polymer molded body, which is a housing for housing electronic equipment such as computer equipment,
A commonly used surface treatment method is to form a conductive film on the surface of a polymer molded body using salivary lead spraying, conductive paint, or the like. However, salivary lead thermal spraying requires expensive processing equipment and processing costs; surface pretreatment is required before hot lead thermal spraying to improve adhesion to the polymer molding, and mass productivity is poor; There are disadvantages such as environmental problems such as noise and air pollution. Although conductive paints are inexpensive, they tend to crack and peel during long-term use, and they have problems with durability.

発明が解決しようとする問題点 本発明者等は、上記のような従来のγ1イ、磁シールド
性付与技術の欠点を解決するため鋭意検討を重ねた結果
、旨分子基体に導電性繊維−をフロックとして埴毛υロ
エし、しかも、植毛の根元で・i’jt毛間に2、導電
性を持たせるようにすることによって、非常に優れた電
磁シールド性を有することを見出し、本発明に到達した
Problems to be Solved by the Invention The inventors of the present invention have conducted intensive studies to solve the above-mentioned drawbacks of the conventional γ1 and magnetic shielding technology, and have developed a method of adding conductive fibers to the molecular base. It was discovered that very excellent electromagnetic shielding properties can be achieved by using clay hair υ loe as a flock and providing conductivity at the root of the flocked hair and between the hairs. Reached.

従って、本発明の目的は、導電性層の耐久性が優れ、か
つ安価に製作でhる優れた電磁シールド性を有する高分
子成形体を提供するにある。
Accordingly, an object of the present invention is to provide a polymer molded article having excellent electromagnetic shielding properties, which has a conductive layer with excellent durability, can be manufactured at low cost, and has excellent electromagnetic shielding properties.

問題点を解決するための手段 本発明に係る電磁シールド性を有する高分子成形体は、
高分子基体の表面に導電性繊維からなるフロックを植毛
固着してなり、植毛の根元において植毛間に導電性が付
与されていることを特徴とする。
Means for Solving the Problems The polymer molded article having electromagnetic shielding properties according to the present invention is
It is characterized in that flocks made of conductive fibers are flocked and fixed to the surface of a polymer base, and conductivity is imparted between the flocks at the roots of the flocks.

本発明に用いられる4市性繊維としては、金属繊維、炭
素繊維、導電性金属をメッキしてなる繊維2合成繊維の
製造過程においてカー?ンブラックや銅粉のような導電
物質を約20%またはそれ以上混入してなる繊維、硫酸
銅と含硫黄還元剤(例えば、チオ硫酸ソーダ)を含む水
溶液で処理して硫化鋼を数多以上付着および/または含
有せしめた繊維、硫酸鋼とヨウ素を含む物質(例えば、
ヨー化カリウム)とを含む水溶液で処理してヨウ化銅を
数チ以上付着および/または含有せしめた繊維等を挙げ
ることができるが、硫化銅あるいはヨウ化鋼のような半
導体物質を付着および/または含有せしめた繊維等を挙
げることができるが゛、これらに限定されるものではな
い。
The four types of fibers used in the present invention include metal fibers, carbon fibers, and fibers plated with conductive metal. Fibers containing about 20% or more of a conductive material such as carbon black or copper powder are treated with an aqueous solution containing copper sulfate and a sulfur-containing reducing agent (e.g., sodium thiosulfate) to produce a large number of sulfurized steels. Attached and/or contained fibers, sulfuric acid steel and iodine-containing substances (e.g.
Examples include fibers that have been treated with an aqueous solution containing copper iodide (potassium iodide) to adhere and/or contain several molecules of copper iodide; or fibers contained therein, but are not limited thereto.

導電性繊維のフロックとは0.5〜8. Oranの長
さにカットされたR維であり、第1図に示した如く、高
分子成形体表面に塗布した接着剤に刺し込み植毛される
。フロックの長さが0.5mm以下では刺し込み植毛が
困難であり、8.0■以上では植毛時の平行性が損われ
、固着性が弱くなり好ましくない。
Conductive fiber flock is 0.5 to 8. The fibers are R fibers cut to the length of Oran, and as shown in FIG. 1, they are pierced into an adhesive applied to the surface of the polymer molded body and implanted. If the length of the flock is less than 0.5 mm, it will be difficult to implant the flock, and if it is more than 8.0 mm, the parallelism during flocking will be impaired and the fixation will be weakened, which is not preferable.

本発明の電磁シールド用高分子成形体は、第1図に示す
ごとく、高分子基体3上に導電物体層2が形成され、接
着剤層4を介して導電性繊維からなるフロック1が植毛
されている。各フロック1は植毛の根元において導電物
体層2によって各フロック間に導電性が付与されている
。第1図では、導電物体層2と接着剤層4とは別々に形
成されているが、例えば、接着剤の中に金属粉のような
導電性物質を混合したり、導電機能をもつ接着剤を用い
ることによって導電物体層と接着剤層は合体することが
できる。
As shown in FIG. 1, the polymer molded body for electromagnetic shielding of the present invention has a conductive layer 2 formed on a polymer base 3, and flocks 1 made of conductive fibers interposed through an adhesive layer 4. ing. Each flock 1 is provided with electrical conductivity between each flock by a conductive material layer 2 at the root of the flocked hair. In FIG. 1, the conductive material layer 2 and the adhesive layer 4 are formed separately, but for example, a conductive material such as metal powder may be mixed into the adhesive, or an adhesive with a conductive function may be used. The conductive body layer and the adhesive layer can be combined by using a.

以上のような構成をもつ本発明の旨分子成形体は、導電
性^・M、維のフロックを高分子成形体表面に塗布した
接着剤に植毛したものであるため、植毛の根元において
フロック相互間に導電性が付与されているのみならず、
接着剤層上のフロック立毛の先端部分が互いに容易に接
触する。従って、フロック416毛体全体が厚い導電層
を形成しており、少ない導電性繊維の使用量で高いシー
ルド性能が得られる。また、使用する導電性繊維の種類
によって電気比抵抗が異なるため、得られるシールド性
能が異なる。従って、要求されるシールド性能によって
導電性繊維を適宜選べばよい。特に、硫化銅を付着およ
び/または含有したアクリル系繊維は、金属繊維を使用
したものと同様に高いシールド効果が得られるうえに、
比重が金属繊維に較べて小さいため、軽量な電子機器収
納用筐体を製作することができるので極めて有利である
The molecular molded body of the present invention having the above-mentioned structure is made by flocking conductive ^・M fiber flocks to an adhesive applied to the surface of the polymer molded body, so that the flocks do not interact with each other at the root of the flocked hair. Not only is conductivity imparted between the
The tip portions of the raised flocks on the adhesive layer easily come into contact with each other. Therefore, the entire flock 416 hair forms a thick conductive layer, and high shielding performance can be obtained with a small amount of conductive fibers. Furthermore, since the electrical resistivity varies depending on the type of conductive fiber used, the shielding performance obtained varies. Therefore, the conductive fibers may be appropriately selected depending on the required shielding performance. In particular, acrylic fibers that have copper sulfide attached and/or contain them have the same high shielding effect as those using metal fibers, and
Since the specific gravity is smaller than that of metal fibers, it is extremely advantageous because a lightweight housing for housing electronic devices can be manufactured.

本発明に用いられる高分子基体としては、月?リデロビ
レン、ポリ塩化ビニル、ABS 、、flJフェニール
オキサイド等の熱可塑性樹脂、あるいはSMC。
The polymer substrate used in the present invention is moon? Thermoplastic resins such as riderovirene, polyvinyl chloride, ABS, flJ phenyl oxide, or SMC.

BMC等の熱硬化性樹脂から成るものが挙げられ、これ
らは種々の形状で用いられる。
Examples include those made of thermosetting resin such as BMC, and these are used in various shapes.

植毛の根元において植毛間に導電性を付与するために用
いられる導電物体は、基本的には植毛の根元の部分で植
毛間に導電性を付与できるものではあれば何でもよい。
The conductive material used to impart conductivity between the flocks at the root of the flock may basically be of any material as long as it can impart conductivity between the flocks at the root of the flock.

例えば、前述した如く、接着剤自身に導電機能をもつよ
うなもの、従来の接着剤の中に導電物質を混入して導電
性全付与したもの、専′市性をもつ布帛またけ金属箔の
ようなものを用いることができる。製造上の容易さ等を
考え合せると導電性機能を有する接着剤を選択すること
は非常に有利である。
For example, as mentioned above, there are adhesives that have a conductive function themselves, conventional adhesives mixed with conductive substances to give them full conductivity, and specialized fabric-covered metal foils. You can use something like this. Considering the ease of manufacturing, etc., it is very advantageous to select an adhesive having a conductive function.

本発明の電磁シールド用高分子成形体は、布帛のフロッ
ク加工と同一あるいL類似の方法で製作することができ
る。すなわち、接着剤を塗布した高分子基体表面にフロ
ックを散布、吹付、振動あるいは高電圧の静電気を利用
して固着する。これらの方法の中で静電現像を利用する
方法が最も一般的である。
The polymer molded body for electromagnetic shielding of the present invention can be produced by the same method as or similar to the method used for flocking fabric. That is, the flocs are spread, sprayed, vibrated, or fixed to the surface of a polymer substrate coated with an adhesive using high-voltage static electricity. Among these methods, the method using electrostatic development is the most common.

実楕例 以下、実施例について本発明をさらに詳しく説明する。Real ellipse example Hereinafter, the present invention will be explained in more detail with reference to Examples.

実施例1 単糸繊度3デニールのアクリル系繊維を硫酸銅とチオ硫
酸ナトリウムを含む水溶液中で加熱処理して硫化銅含有
アクリル系導電性繊維(電気比抵抗1.5xlOΩ・m
)を得た。この繊維を・ぐイル長1.0〜3.0団にカ
ットしフロックを得た。塩化ビニル樹脂板に接着剤とし
てアクリル酸エステル溶液に銀粉を30重量%混入した
ものを塗布し、従来公知の高圧静電気方式にて上記フロ
ックを植毛し、80℃で10分間乾燥した。得られた樹
脂板のシールド効果および50℃、95%RHの条件で
3ケ月間長期耐湿テスト後のシールド効果を測定した。
Example 1 An acrylic fiber with a single filament fineness of 3 denier was heat-treated in an aqueous solution containing copper sulfate and sodium thiosulfate to form a copper sulfide-containing acrylic conductive fiber (electrical specific resistance 1.5xlOΩ・m).
) was obtained. This fiber was cut into a fiber length of 1.0 to 3.0 to obtain a flock. An acrylic acid ester solution mixed with 30% by weight of silver powder was applied as an adhesive to a vinyl chloride resin plate, and the flock was flocked using a conventionally known high-pressure electrostatic method, followed by drying at 80° C. for 10 minutes. The shielding effect of the obtained resin plate and the shielding effect after a long-term humidity test for 3 months at 50° C. and 95% RH were measured.

その結果を第1表に示す。同表に明らかなように、長期
間経過後も優れたシールド効果に変化は見られなかった
The results are shown in Table 1. As is clear from the table, no change was observed in the excellent shielding effect even after a long period of time.

第1表 実施例2 繊径が50μmのステンレス繊維を・!イル長2.0〜
6.0+sにカットし、フロックを得た。以下、実施例
1と同様に+1n毛樹脂板を得だ。得られた樹脂板のシ
ールド効果および50℃、95%RHの条件で3ケ月間
長期耐湿テスト後のシールド9効果を測定した。その結
果を第2表に示す。優れたシールド効果に変化は見られ
なかった。
Table 1 Example 2 Stainless steel fiber with a fiber diameter of 50 μm! file length 2.0~
The floc was obtained by cutting at 6.0+s. Thereafter, a +1n hair resin board was obtained in the same manner as in Example 1. The shielding effect of the obtained resin plate and the shielding effect after a long-term humidity test for 3 months at 50° C. and 95% RH were measured. The results are shown in Table 2. No change was observed in the excellent shielding effect.

第2表 実施例3 実施例1および実施例2で得られた樹脂板の1平方メー
トル当たりの重量を第3表に示す。同表にみられるとお
シ、硫化銅含有アクリル系導電性繊維を使用したものは
軽い。但し、塩ビ板は5洞厚で電歇は7kgである・ 第3表 比較例 ニッケル微粒子とアクリル樹脂をメチルインブチルケト
ンに分散させ、塩化ビニル樹脂板にスプレーで塗布して
導電性皮膜を形成した。乾燥後の樹脂板のシールド効果
および50℃、95%RHの条件で3ケ月間長期耐湿テ
スト後のシールド効果を測定した。その結果を第4表に
示す。導電性皮膜の剥離が生じ、長期耐湿テストには耐
えられなかった。
Table 2 Example 3 Table 3 shows the weight per square meter of the resin plates obtained in Example 1 and Example 2. As shown in the same table, products using acrylic conductive fibers containing copper sulfide are light. However, the PVC board is 5 cavities thick and the electric switch weighs 7 kg.Table 3 Comparative Example Nickel fine particles and acrylic resin are dispersed in methyl in butyl ketone and sprayed onto the PVC resin board to form a conductive film. did. The shielding effect of the resin plate after drying and after a long-term humidity test for 3 months at 50° C. and 95% RH were measured. The results are shown in Table 4. The conductive film peeled off and could not withstand a long-term humidity test.

第4表 発明の効果 本発明の電磁シールド用高分子成形体は、電磁シールド
効果が非常に太きく、しかも、経時的変化(特に、比較
的高温、高湿下に長時間保持したときの経時的変化)が
非常に少く、耐久性が非常に大きい。まだ、本発明の電
磁シールド用高分子成形体で製作せる筐体は非常に軽量
である。
Table 4 Effects of the Invention The polymer molded article for electromagnetic shielding of the present invention has a very strong electromagnetic shielding effect, and also shows changes over time (especially when kept at relatively high temperature and high humidity for a long time). There is very little physical change) and the durability is very high. However, the casing made of the electromagnetic shielding polymer molded article of the present invention is extremely lightweight.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の電磁シールド用高分子成形体の一例を
示す断面図でちる。 ■・・・導電性繊維の植毛体、2・・・植毛根元の導電
体層、3・・・高分子基体、4・・・接着剤1−9特許
出原白人 旭化成工業株式会社 特許出願代理人
FIG. 1 is a sectional view showing an example of a polymer molded article for electromagnetic shielding according to the present invention. ■... Conductive fiber flocked body, 2... Conductor layer at the root of the flocked hair, 3... Polymer base, 4... Adhesive 1-9 Patent source Shirai Asahi Kasei Co., Ltd. Patent application agent Man

Claims (1)

【特許請求の範囲】[Claims] 1、高分子基体上に導電性繊維からなるフロックを植毛
固着してなり、植毛の根元において植毛間に導電性が付
与されていることを特徴とする電磁シールド性を有する
高分子成形体。
1. A polymer molded article having electromagnetic shielding properties, characterized in that flocks made of conductive fibers are flocked and fixed on a polymer base, and electrical conductivity is imparted between the flocks at the roots of the flocks.
JP12194884A 1984-06-15 1984-06-15 Polymer molding unit for electromagnetically shielding Pending JPS612394A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12194884A JPS612394A (en) 1984-06-15 1984-06-15 Polymer molding unit for electromagnetically shielding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12194884A JPS612394A (en) 1984-06-15 1984-06-15 Polymer molding unit for electromagnetically shielding

Publications (1)

Publication Number Publication Date
JPS612394A true JPS612394A (en) 1986-01-08

Family

ID=14823879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12194884A Pending JPS612394A (en) 1984-06-15 1984-06-15 Polymer molding unit for electromagnetically shielding

Country Status (1)

Country Link
JP (1) JPS612394A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417767U (en) * 1990-05-30 1992-02-14
EP1850650A1 (en) * 2006-04-27 2007-10-31 Nitto Denko Corporation Structure having a characteristic of conducting or absorbing electromagnetic waves
EP1850416A1 (en) 2006-04-28 2007-10-31 Nitto Denko Corporation Adhesive tape having a characteristic of conducting or absorbing electromagnetic waves
JP2007299906A (en) * 2006-04-28 2007-11-15 Nitto Denko Corp Article equipped with electromagnetic wave shielding sheet-like structure
EP1653791A3 (en) * 2004-10-28 2015-03-04 Nitto Denko Corporation Structure having a characteristic of conducting or absorbing electromagnetic waves
KR20170078339A (en) * 2015-12-29 2017-07-07 코오롱글로텍주식회사 Material for shielding or reducing electromagnetic waves of electric vehicle and use of the same
CN111593575A (en) * 2019-02-20 2020-08-28 江苏唐工纺实业有限公司 Preparation method of anti-electromagnetic radiation fabric

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417767U (en) * 1990-05-30 1992-02-14
EP1653791A3 (en) * 2004-10-28 2015-03-04 Nitto Denko Corporation Structure having a characteristic of conducting or absorbing electromagnetic waves
EP1850650A1 (en) * 2006-04-27 2007-10-31 Nitto Denko Corporation Structure having a characteristic of conducting or absorbing electromagnetic waves
EP1850416A1 (en) 2006-04-28 2007-10-31 Nitto Denko Corporation Adhesive tape having a characteristic of conducting or absorbing electromagnetic waves
JP2007299906A (en) * 2006-04-28 2007-11-15 Nitto Denko Corp Article equipped with electromagnetic wave shielding sheet-like structure
KR20170078339A (en) * 2015-12-29 2017-07-07 코오롱글로텍주식회사 Material for shielding or reducing electromagnetic waves of electric vehicle and use of the same
CN111593575A (en) * 2019-02-20 2020-08-28 江苏唐工纺实业有限公司 Preparation method of anti-electromagnetic radiation fabric

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