JPS612347A - Cleaning for ag soldered sealing ring - Google Patents
Cleaning for ag soldered sealing ringInfo
- Publication number
- JPS612347A JPS612347A JP12276084A JP12276084A JPS612347A JP S612347 A JPS612347 A JP S612347A JP 12276084 A JP12276084 A JP 12276084A JP 12276084 A JP12276084 A JP 12276084A JP S612347 A JPS612347 A JP S612347A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- sealing ring
- ring
- cleaning
- kovar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、集積回路用セラミックス容器に取付けるＡｇ
ろう付封着リングの清浄方法に係り、特にそのＡｇろう
付封着リングのＡｇろうの清浄方法に関する。Detailed Description of the Invention (Industrial Application Field) The present invention provides an Ag
The present invention relates to a method for cleaning a brazed sealing ring, and more particularly to a method for cleaning Ag solder in an Ag brazed sealing ring.
（従来技術とその問題点）
従来、集積回路用セラミックス容器に封着リングを取付
けるにはＡｇろうプリフォーム材を用いているが、Ａｇ
ろうの圧延、引抜加工工程に於いて、潤滑剤や周囲の塵
埃がＡｇろう表面に押し込まれたり、又スタンピング加
工中の異物付着等によりろう付は後、ろう付は表面に異
物が浮上し、ろう付は後行われるＮｉめっきやＡｕめっ
きのふくれやめっき剥れの原因となり、その対策に苦慮
していた。(Prior art and its problems) Conventionally, Ag brazing preform material has been used to attach a sealing ring to a ceramic container for integrated circuits.
During the rolling and drawing process of the solder, lubricant and surrounding dust may be forced into the surface of the Ag solder, or foreign matter may adhere to the surface during the stamping process, causing foreign matter to float to the surface after brazing. Brazing causes blistering and peeling of the Ni plating and Au plating that is applied afterwards, and it has been difficult to find a countermeasure for this.
この為、Ａｇろう加工工程を清浄化するとか、酸、アル
カリ等でＡｇろうの表面処理を行うとか、ろう付は以降
に洗浄する等の手段を講じているが、程度の差こそあれ
、完全な解決にはならず、不良品の発生を目視による全
数選別等に頼っているのか現状である。For this reason, measures have been taken such as cleaning the Ag brazing process, treating the surface of the Ag brazing with acid, alkali, etc., and cleaning after brazing, but although there are varying degrees of There is no solution to this problem, and the current situation is that we are relying on visual inspection to screen out all defective products.
（発明の目的）
本発明は、上記の問題を解決する為になされたもので、
封着リングにＡｇろうを取付けると共にＡｇろう中の不
純物残渣を表面に浮上させ、その浮上残渣及び周囲に付
着している異物を完全に取り除くことのできるようにし
たＡｇろう付封着すングの清浄方法を提供することを目
的とするものである。(Object of the invention) The present invention was made to solve the above problems,
This is an Ag soldering sealing ring that attaches Ag solder to the sealing ring, floats the impurity residue in the Ag solder to the surface, and completely removes the floating residue and foreign matter attached to the surrounding area. The purpose is to provide a cleaning method.
（発明の構成）
本発明のＡｇろう付封着リングの清浄方法は、Ａｇろう
とコバール又はＦｅ−Ｎｉ合金で作った各リングをカー
ボン治具に入れ、Ａｇろうの融点以上の温度で熔融して
Ａｇろう付封着リングとなして、Ａｇろう中の不純物残
渣を表面に浮上させ、然る後Ａｇろうと同一成分又はそ
の成分の内いずれか一つを含む金属で作った粒子で構成
させるメディアを用いて前記Ａｇろう付封着リングを研
摩することにより、Ａｇろう表面の浮上残渣及び周囲に
付着している異物を取り除くものである。(Structure of the Invention) The method of cleaning the Ag solder sealing ring of the present invention involves placing each ring made of Ag solder and Kovar or Fe-Ni alloy in a carbon jig, and melting the rings at a temperature higher than the melting point of the Ag solder. As a sealing ring with Ag solder, the impurity residue in the Ag solder floats to the surface, and then the media is made of particles made of metal containing the same components as the Ag solder or one of the components. By polishing the Ag solder sealing ring using the Ag solder, floating residue on the surface of the Ag solder and foreign matter adhering to the surrounding area are removed.
（実施例）
本発明のＡｇろう付封着リングの清浄方法の一実施例を
詳細に説明する。厚さ０．０８１ｍ、外周の一辺１２ｍ
ｍ、内周の一辺Ｌｏｉｖの方形リングに打抜いたＡ ｇ
−Ｃｕ ２８％のＡｇろうリングと、厚さ Ｑ、５ｍｍ
。(Example) An example of the method for cleaning an Ag brazed sealing ring of the present invention will be described in detail. Thickness: 0.081m, outer circumference: 12m
m, A punched into a rectangular ring with one side of the inner circumference Loiv g
-Cu 28% Ag brazing ring and thickness Q, 5mm
.
外周の一辺１２．５ｍ１．内周の一辺１０鶴の方形リン
グに打抜いたＦｅ−Ｎｉ−Ｃｏリングとをカーボン治具
に入れ、Ｎ２雰囲気中にて８５０℃で熔融し、１分間経
過した後冷却し、Ａｇろう付コバールリングを形成した
。One side of the outer circumference 12.5m1. A Fe-Ni-Co ring punched into a rectangular ring with an inner circumference of 10 squares on each side was placed in a carbon jig, melted at 850°C in a N2 atmosphere, cooled after 1 minute, and soldered with Ag brazed Kovar. formed a ring.
このＡｇろう付コバールリングのＡｇろう表面を顕微鏡
で観察した処、黒色異物及び茶褐色の異物が浮上してお
り、これをＸ線マイクロアナライザーで分析した結果、
Ｍｇ、Ｓｉ、Ｃａ、ＡＩ。When the Ag solder surface of this Ag brazed Kovar ring was observed under a microscope, black foreign matter and brown foreign matter were found floating.As a result of analyzing this with an X-ray microanalyzer,
Mg, Si, Ca, AI.
０、ＣＩ等が検出された。0, CI, etc. were detected.
次にこのＡｇろう付コバールリング１００（ｌｉｆヲハ
レル研摩機に入れ、Ａ ｇ −Ｃｕ ２８％笹吹（粒径
０．１〜２Ｍ）をメディアとして略同体積入れ、純水に
て３０分間研摩した後、水洗、湯洗し、乾燥した。Next, this Ag brazed Kovar ring 100 (lif) was placed in a polishing machine, approximately the same volume of Ag-Cu 28% Sasabuki (particle size 0.1 to 2M) was added as a media, and the ring was polished with pure water for 30 minutes. Afterwards, it was washed with water, hot water, and dried.
このＡｇろう付コバールリングのＡｇろう表面をＸ線マ
イクロアナライザーにて検査した一処、異物は全く検出
されず、熔融時Ａｇ表面に浮上した異物は完全に除去さ
れていることが確認された。When the Ag solder surface of this Ag brazed Kovar ring was inspected using an X-ray microanalyzer, no foreign matter was detected, and it was confirmed that the foreign matter that floated to the Ag surface during melting had been completely removed.
然してこのＡｇろう付コバールリング１００個をＷメタ
ライズ、Ｎｉめっきしたセラミック容器にろう付けした
処、ろうのフィレット部分には全く異物が存在せず、清
浄なろう付は面を得ることができた。更にその上に厚さ
２μのＮｉめっきと厚さ１μのＡｕめっきを施し、５０
０°Ｃにて１５分間大気中で加熱した後、フィレット部
分のめっき表面を調べた処、めっきのふくれや剥離は全
く無かった。However, when 100 of these Ag-brazed Kovar rings were brazed to a W metalized and Ni-plated ceramic container, no foreign matter was present in the fillet portion of the fillet, and a clean brazing surface was obtained. Furthermore, Ni plating with a thickness of 2μ and Au plating with a thickness of 1μ are applied to
After heating in the air at 0°C for 15 minutes, the plating surface of the fillet portion was examined and found that there was no blistering or peeling of the plating.
然るに従来方法でコバールリングをＷメタライズ、Ｎｉ
めっきしたセラミック容器にＡｇろうにてろう付けし、
その上に厚さ２μのＮｉめっきと厚さ１μのＡｕめっき
を施し、５００℃にて１５分間大気中で加熱した後、フ
ィレット部分のめっき表面を調べた処、５〜１００μφ
のふくれが１００個中６Ｏ個のものに発生しており、大
なり、小なり欠陥を持っていることが再確認された。However, using the conventional method, the Kovar ring was treated with W metallization and Ni.
Brazed to a plated ceramic container with Ag wax,
On top of that, Ni plating with a thickness of 2μ and Au plating with a thickness of 1μ was applied, and after heating in the air at 500℃ for 15 minutes, the plating surface of the fillet part was examined, and the diameter was 5 to 100μφ.
Blisters occurred in 60 out of 100 items, and it was reconfirmed that they had defects of some degree or another.
（発明の効果）
以上の説明で判るように本発明のＡｇろう付封着リング
の清浄方法は、Ａｇろうとコバール又はＦｅ−Ｎｉ合金
で作った各リングをカーホン治具に入れ、Ａｇろうの融
点以上の温度で溶融してＡｇろう付封着リングとなして
、Ａｇろう中の不純物残渣を表面に浮上させ、然る後Ａ
ｇろうと同一成分又は成分の内いずれか一つを含む金属
で作った粒子で構成されるメディアを用いて前記Ａｇろ
う付封着リングを研摩して、Ａｇろう表面の浮上残渣及
び周囲に付着している異物を取り除くのであるから、従
来完全に取り除くことができなかったＡｇろう表面の汚
れを簡単に完全に取り除くことができて清浄化できる。(Effects of the Invention) As can be seen from the above explanation, the method for cleaning the Ag brazed sealing ring of the present invention involves placing each ring made of Ag wax and Kovar or Fe-Ni alloy in a carphone jig, and It is melted at a temperature above to form a sealing ring with Ag solder, and the impurity residue in the Ag solder floats to the surface, and then the A
The Ag soldering sealing ring is polished using a media made of particles made of metal that is the same as the Ag wax or contains any one of the ingredients to remove floating residue on the surface of the Ag wax and the surrounding area. Since the foreign matter contained in the solder is removed, dirt on the surface of the Ag solder, which could not be completely removed in the past, can be easily and completely removed and cleaned.
またろう材の材質を変化させることなく清浄化できる。Furthermore, it can be cleaned without changing the material of the brazing filler metal.
さらに従来封着リングをろう付けしたパッケージを研摩
すると変形したが、本発明はＡｇろう付封着リングの状
態で研摩するのであるからパンケージが変形することが
無い等の効果がある。Furthermore, conventionally, when a package with a soldered sealing ring is polished, it becomes deformed, but in the present invention, since the Ag soldered sealing ring is polished, there is an effect that the pan cage is not deformed.
Claims (1)
グをカーボン治具に入れ、Ａｇろうの融点以上の温度で
熔融してＡｇろう付封着リングとなした後、Ａｇろうと
同一成分又はその成分の内いずれか一つを含む金属で作
った粒子で構成されるメディアを用いて前記Ａｇろう付
封着リングを研摩することを特徴とするＡｇろう付封着
リングの清浄方法。Each ring made of Ag wax and Kovar or Fe-Ni alloy is placed in a carbon jig and melted at a temperature higher than the melting point of Ag solder to form a sealing ring with Ag solder. A method for cleaning an Ag brazed sealing ring, comprising polishing the Ag brazed sealing ring using a media made of particles made of a metal containing any one of the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12276084A JPS612347A (en) | 1984-06-14 | 1984-06-14 | Cleaning for ag soldered sealing ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12276084A JPS612347A (en) | 1984-06-14 | 1984-06-14 | Cleaning for ag soldered sealing ring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS612347A true JPS612347A (en) | 1986-01-08 |
| JPH0337464B2 JPH0337464B2 (en) | 1991-06-05 |
Family
ID=14843932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12276084A Granted JPS612347A (en) | 1984-06-14 | 1984-06-14 | Cleaning for ag soldered sealing ring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS612347A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6195130B1 (en) | 1997-08-22 | 2001-02-27 | Nec Corporation | Vertical timing signal generating circuit |
-
1984
- 1984-06-14 JP JP12276084A patent/JPS612347A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6195130B1 (en) | 1997-08-22 | 2001-02-27 | Nec Corporation | Vertical timing signal generating circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337464B2 (en) | 1991-06-05 |
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