JPS61228647A - Wafer rearranging apparatus - Google Patents
Wafer rearranging apparatusInfo
- Publication number
- JPS61228647A JPS61228647A JP7150985A JP7150985A JPS61228647A JP S61228647 A JPS61228647 A JP S61228647A JP 7150985 A JP7150985 A JP 7150985A JP 7150985 A JP7150985 A JP 7150985A JP S61228647 A JPS61228647 A JP S61228647A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cassette
- rearranging
- wafers
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体装置の製造に際し、ウニ・−ロフト
中のクエへのウェハ番号を所定の順序に並べ換えるため
のウェハ並べ換え装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a wafer rearranging device for rearranging wafer numbers for queues in a sea urchin loft in a predetermined order when manufacturing semiconductor devices. be.
１１１３図は従来から人手によりウェハ番号の順序を並
べ換える悪様を示す斜視因で、人間がウェハウェハ
５０番号５ａの順序を目２０で見て、第１のカセット１
から第２のカセット２ヘビンセツト２１を使用して手で
並べ換えていた。FIG. 1113 is a perspective view showing how the order of wafer numbers is conventionally rearranged manually.
The cassettes were rearranged by hand using the second cassette 2 heavy set 21.
ところで、上記のウェハ５の並べ換えには入閣が介在す
るため半導体装置の製造工程中における搬送の工程を完
全に自動化することができず、また並べ換える時に、作
業者から発生するごみがウェーＳに付着しやすいという
問題点があった。By the way, since the above-mentioned sorting of the wafers 5 involves the intervention of the government, it is not possible to completely automate the transportation process during the manufacturing process of semiconductor devices, and when sorting the wafers, the waste generated by the workers is transferred to the wafers S. There was a problem that it easily adhered.
この発明は、上記問題点を解決するためになされたもの
で、クエへの並べ換えの自動化を完全に行うウェハ並べ
換え装置を提供することを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a wafer sorting device that completely automates the sorting of wafers into queries.
この発明ｋかかるウニ６並べ換え装置は、ウェハが収納
される第１のカセットと、クエへがそのウェハ番号を所
定の順序に並ぺ換えて収納される＃！２０カセットと、
ウニへのウェハ番号を読取るカメラと、このカメラの被
写体となる位置に前記ウェハを位置させる７ライメント
手段と、第１のカセットに収納されているウェハな１枚
ずつ取出しウェハホルダで保持して１Ｉ２０カセツトへ
移動させる左右方向並べ換え手段と、クエへを前後方向
に移動して＃Ｉ２のカセットへカメラで読取ったウェハ
番号が所定の順序になるように並べ換えて収納する前後
方向並べ換え手段とからなるものである。The urchin 6 rearranging device according to the present invention has a first cassette in which wafers are stored, and a wafer in which the wafer numbers are rearranged in a predetermined order. 20 cassettes and
A camera for reading the wafer number, a alignment means for positioning the wafer at a position to be photographed by the camera, and a 1I20 cassette for taking out the wafers stored in the first cassette one by one and holding them with a wafer holder. The device consists of a left-right sorting means for moving the wafers to the cassette #I2, and a front-back sorting means for moving the wafers back and forth and storing them in the #I2 cassette in such a manner that the wafer numbers read by the camera are arranged in a predetermined order. be.
この発明においては、＠１のカセツ）Ｋ収納されている
ウェハを１枚ずつ取出して、カメラによりウェハ番号を
貌取り、菖２のカセットへ左右方向並べ換え手段と前後
方向並べ換え手段により所定の順序で収納する。In this invention, the wafers stored in the cassette (1) are taken out one by one, the wafer numbers are taken out by a camera, and the wafers are placed in the cassette (2) in a predetermined order by the left-right sorting means and the front-back sorting means. Store it.
第１図はこの発明の一実施例を示す構成略図、１ｉ４２
図は第１図のＡ−ＡＭＡＩＣよる断面略図である。FIG. 1 is a schematic configuration diagram showing one embodiment of the present invention, 1i42
The figure is a schematic cross-sectional view taken along A-AMAIC in FIG. 1.
これらの図において、第３図と同一符号は同一部分を示
し、＠１のカセット１にはウェハ５が入っており、第２
のカセッ）２＆Ｃは並べ換え用のためのものであるため
まだウェハ５は入っていない。In these figures, the same reference numerals as in Fig. 3 indicate the same parts; cassette 1 @1 contains wafer 5;
Since cassettes 2 & C are for sorting, they do not contain wafers 5 yet.
ｓａｇ ３ｂはウェハ押上片で、任意のウェハ５を１
枚押し上げた後に下降させるよ５ＫＩ１ｇ成されている
が、駆動機構等は省略しである。４は７ライメント装置
で、円筒状になっているローラ４ａを駆動ローラ４Ｃで
駆動されるベル）４ｂの駆動によって回転させ、ウェハ
５に接触させながらく点線で示す）、ローラ４ａの回転
力でウェハ５を回転させて各ウェハ５の周辺の一部を切
欠いた平坦部が下方になるよ５に７ライメントする。な
お、９２図ではクーラ４ａが＃ｌＩ図の点線の位置にあ
る伏線を示している。またこの７ライメント装置４は、
ウェハ押上片３ａとの動作の干渉を防ぐため、第１図の
よ５に、実線で示す待避点ａまで回動して待避するよう
Ｋなっている。６はウェハホルダで、第１図に矢印すで
示すように回動可能であり、７ライメントされたクエへ
５がウェハ押上片３ａによって押上げられた後に、この
ウニへ５をホールドする。１は前記ウェハ５を＃Ｉｘの
カセット１から＃１２のカセット２へ左右方向に移動さ
せる左右方向並べ換え装置、８は前記ウェハ５を前後方
向へ移動させる前後方向並べ換え装置で、ウェハホルダ
６、左右方向並べ換え装置１等を一体として移動させる
。９は前記ウェハ番号５ａの読取りを行うカメラで、こ
のカメラ９はアライメントが前後左右方向く少しずれ【
も充分読取れる機構を有している。１０はカセット押え
である。sag 3b is a wafer pushing piece that lifts any wafer 5 into one
The 5KI1g is designed to raise the sheet and then lower it, but the drive mechanism etc. are omitted. 4 is a 7 alignment device, in which a cylindrical roller 4a is rotated by the drive of a bell 4b driven by a drive roller 4C, and is brought into contact with the wafer 5 (as shown by the dotted line), and the wafer is moved by the rotational force of the roller 4a. Rotate the wafer 5 and align the wafer 5 so that the flat part of each wafer 5 with a part of its periphery facing downward. In addition, in FIG. 92, the cooler 4a is foreshadowed at the position of the dotted line in FIG. In addition, this 7-line device 4 is
In order to prevent the operation from interfering with the wafer push-up piece 3a, it is configured to rotate and retreat to a retreat point a shown by a solid line as shown in FIG. 1 (5). A wafer holder 6 is rotatable as shown by the arrow in FIG. 1, and holds the wafer 5 on the lined wafer after the wafer holder 5 is pushed up by the wafer push-up piece 3a. Reference numeral 1 denotes a left-right rearranging device for moving the wafers 5 in the left-right direction from cassette 1 of #Ix to cassette 2 of #12; 8 denotes a front-back rearranging device for moving the wafers 5 in the front-back direction; The sorting device 1 and the like are moved as one unit. Reference numeral 9 denotes a camera for reading the wafer number 5a.
It also has a mechanism that allows for sufficient reading. 10 is a cassette holder.
なお、ウェハ押上片３ ｌｉｅ ３ ｂｅ ウェハホ
ルダ６、左右方向並べ換え装置１と前後方向並べ換え装
置８は一体化された構造となっている。Note that the wafer push-up piece 3 lie 3 be wafer holder 6, the left-right rearrangement device 1, and the front-back rearrangement device 8 have an integrated structure.
次に動作について説明する。Next, the operation will be explained.
第１図、第２図に示すように第１のカセット１と第２の
カセット２を載置して、カセット押え１０で押える。次
に第１のカセット１に入ったクエへ５を７ライメント装
置４でウェハ番号５麿が上側にくるよ５に７ライメント
する・
７ライメントが終った後、７ライメント装置４は待避点
ａへ待避させる。As shown in FIGS. 1 and 2, the first cassette 1 and the second cassette 2 are placed and held down with a cassette presser 10. Next, apply 7 alignment to the wafer 5 in the first cassette 1 so that wafer number 5 is on the upper side using the 7 alignment device 4. After completing the 7 alignment, the 7 alignment device 4 moves to the shelter point a. Evacuate.
任意のウェハ５の１枚をウェハ押上片３ｍで押上げて、
ウェハホルダ６でホールドする。Push up one of the arbitrary wafers 5 with the wafer pusher piece 3m,
Hold with wafer holder 6.
カメラ９でウェハ番号５ｍの貌取り可能な位置まで前後
方向並べ換え装置８によってウェハ５を移動させウェハ
番号５ａを読取る。絖取られたウェハ５は纂２のカセツ
）２に左右方向並べ換え装置１と前後方向並べ換え装置
８とＫよって、あらかじめ決められている並べ換えの位
置忙ウェハ５を移動させる。次にウェハ押上片３ｂを押
上げて、ウェハホルダ６よりウェハ５を受取り、ウニへ
押上片３ｂを下降させて、ウェハ５を＃！２のカセッ）
２に収納し１次のウニ・１５の並べ換え動作に移る。The wafer 5 is moved by the front-back rearranging device 8 to a position where the wafer number 5m can be taken out using the camera 9, and the wafer number 5a is read. The removed wafers 5 are moved to a predetermined rearrangement position by the left-right sorting device 1 and the front-to-back sorting devices 8 and K to the cassette 2 of the cassette 2. Next, push up the wafer push-up piece 3b to receive the wafer 5 from the wafer holder 6, lower the push-up piece 3b to the sea urchin, and move the wafer 5 to #! 2 cassette)
2 and move on to the first sorting operation of sea urchins/15.
この発明は以上説明したとおり、菖１のカセットに収納
されているウェハを１枚ずつ取出してカメラによってウ
ェハ番号を読取り、菖２の左セットヘ左右方向並べ換え
手段により移動させ、次いでウェハを前後方向並べ換え
手段により前後方向に移動して第２のカセットへ所定の
順序に並べ換えて収納するよ５に構成したので、９工へ
の並べ換えに人手を必要とせず、かつ手作業によるごみ
が発生しないので、搬送工種の自動化による省力化と製
品の歩留りの向上がはかれる利点を有する。As explained above, in this invention, the wafers stored in the cassette of irises 1 are taken out one by one, the wafer numbers are read by a camera, the wafers are moved to the left set of irises 2 by the left-right sorting means, and then the wafers are rearranged in the front-back direction. Since the structure is configured such that the cassettes are moved in the front and rear direction by means of a means and arranged in a predetermined order and stored in the second cassette, there is no need for manpower to rearrange the cassettes into the second cassette, and no waste is generated due to manual work. It has the advantage of saving labor and improving product yield by automating the transportation process.
第１図はこの発明の一実施例を示す構成略図、第２図は
第１図のＡ−ＡＩｊＫよる断面略図、第３図は従来から
人手によるクエへの番号の順序を並び換える膳様を示す
斜視図である。
図において、１はｔａｌのカセット、２は＃Ｉ２のカセ
ットｓ ３ ａ ｅ ３ ｂはウニへ押上片、４はア
ライメント装置、５はウェハ、５ａはクエへ番号、６は
ウェハホルダ、Ｔは左右方向並べ換え装置、８は前後方
向並べ換え装置、８はカメラ、１０はカセット押えであ
る。
なお、各図中の同一符号は同一または相当部分を示す。
第１図
８；前便方釦並く検え装置
第２図
１０ニア７ｔ！−ソトオ甲大。
第３図Fig. 1 is a schematic configuration diagram showing an embodiment of the present invention, Fig. 2 is a schematic cross-sectional view taken along A-AIjK in Fig. 1, and Fig. 3 is a diagram showing a conventional way of manually rearranging the order of numbers. FIG. In the figure, 1 is the cassette of tal, 2 is the cassette of #I2, s 3 a e 3 b is the push-up piece for the sea urchin, 4 is the alignment device, 5 is the wafer, 5a is the number for the cube, 6 is the wafer holder, and T is the left and right direction. 8 is a rearrangement device, 8 is a camera, and 10 is a cassette holder. Note that the same reference numerals in each figure indicate the same or corresponding parts. Figure 1 8; Front button and inspection device Figure 2 10 Near 7t! - Sotoo Kodai. Figure 3
Claims (1)
そのウエハ番号を所定の順序に並べ換えて収納される第
２のカセットと、前記ウェハのウェハ番号を読取るカメ
ラと、このカメラの被写体となる位置に前記ウエハを位
置させるアライメント手段と、前記第１のカセツトに収
納されている前記ウェハを１枚ずつ取出しウェハホルダ
で保持して前記第２のカセツトへ移動させる左右方向並
べ換え手段と、前記ウェハを前後方向に移動して前記第
２のカセツトへ前記カメラで読取つたウェハ番号が所定
の順序になるように並べ換えて収納する前後方向並べ換
え手段とからなることを特徴とするウェハ並べ換え装置
。a first cassette in which wafers are stored; a second cassette in which the wafers are stored with their wafer numbers rearranged in a predetermined order; a camera that reads the wafer numbers of the wafers; and a position to be photographed by this camera. an alignment means for positioning the wafers in the first cassette, a left-right rearranging means for taking out the wafers stored in the first cassette one by one, holding them in a wafer holder, and moving them to the second cassette; 1. A wafer sorting device comprising: a front-back sorting means for sorting and storing the wafer numbers read by the camera into the second cassette in a predetermined order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7150985A JPS61228647A (en) | 1985-04-02 | 1985-04-02 | Wafer rearranging apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7150985A JPS61228647A (en) | 1985-04-02 | 1985-04-02 | Wafer rearranging apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61228647A true JPS61228647A (en) | 1986-10-11 |
Family
ID=13462734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7150985A Pending JPS61228647A (en) | 1985-04-02 | 1985-04-02 | Wafer rearranging apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61228647A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110650A (en) * | 1986-10-28 | 1988-05-16 | Mitsubishi Electric Corp | Lot former for wafer |
| US8888433B2 (en) | 2004-08-19 | 2014-11-18 | Brooks Automation, Inc. | Reduced capacity carrier and method of use |
-
1985
- 1985-04-02 JP JP7150985A patent/JPS61228647A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110650A (en) * | 1986-10-28 | 1988-05-16 | Mitsubishi Electric Corp | Lot former for wafer |
| US8888433B2 (en) | 2004-08-19 | 2014-11-18 | Brooks Automation, Inc. | Reduced capacity carrier and method of use |
| US9881825B2 (en) | 2004-08-19 | 2018-01-30 | Brooks Automation, Inc. | Reduced capacity carrier and method of use |
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