JPS61226991A - Multilayer circuit board - Google Patents
Multilayer circuit boardInfo
- Publication number
- JPS61226991A JPS61226991A JP6785785A JP6785785A JPS61226991A JP S61226991 A JPS61226991 A JP S61226991A JP 6785785 A JP6785785 A JP 6785785A JP 6785785 A JP6785785 A JP 6785785A JP S61226991 A JPS61226991 A JP S61226991A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- power supply
- line
- multilayer circuit
- ground line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、回路基板の多層化構造に関するもので、具体
的には、信号ライン専用の回路基板とこの信号ラインと
協働する給電・接地ライン専用の回路基板とを同時並行
的に製作可能に両回路基板を別体に構成１． ｔ：上で
積層接合するような簡易製造型多層回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a multilayer structure of a circuit board, and specifically relates to a circuit board dedicated to a signal line and a power supply/grounding structure that cooperates with the signal line. Both circuit boards are separated so that the line-specific circuit board and the circuit board can be manufactured simultaneously 1. t: relates to an easily manufactured multilayer circuit board that is laminated and bonded on the top.
「従来の技術」
乙の種の多層回路基板の従来法は、所要の信号ラインを
多数形成しｔコ内層に給電ライン及びシールドないしは
接地ラインを設けるために、内層基板の導体パターンを
予め形成しｔコ後、外層基板をプリプレグで一体的に積
層しｔこうえで必要なスルーホール加工並びに外層パタ
ーンの形成処理を施して多層化構造の回路基板を製作す
るのが通常である。即ち、内層基板及び外層基板は相互
に関連しｔコニ程で順次連続−貫的に処理されるもので
あって、多層化の度合に応じてその工数は膨大となるの
が一般的である。``Prior art'' In the conventional method for manufacturing multilayer circuit boards of the type described above, a conductor pattern on the inner layer board is formed in advance in order to form a large number of required signal lines and provide a power supply line and a shield or ground line on the inner layer. After this, it is usual to integrally laminate an outer layer board using prepreg, and perform necessary through-hole processing and outer layer pattern formation processing to produce a multilayered circuit board. That is, the inner layer substrate and the outer layer substrate are interconnected and are sequentially and continuously processed over a period of time, and the number of steps is generally enormous depending on the degree of multilayering.
「発明が解決しようとする問題点」
上記の如く、連続−貫的工程を介して製作される従来の
多層回路基板は、その高度な機能性によって電子回路素
子の高密度実装を達成可能であるので、情報処理装置等
その他種々の電子機濶に多用されているが、加ニブ四セ
スが極めて多いため工期も相当に要すること、各層をプ
リプレグを介して積層するために大型の加熱加圧ラミネ
ートプレスを設置する必要があること、更に、設計ミス
などによる内層基板との接続不具合等の修正は極めて困
難であり、また、製品の高コスト化は避けられないなど
の不都合がある。"Problems to be Solved by the Invention" As mentioned above, the conventional multilayer circuit board manufactured through a continuous process can achieve high-density packaging of electronic circuit elements due to its advanced functionality. Therefore, it is widely used in various other electronic equipment such as information processing equipment, but it requires a considerable amount of time due to the extremely large number of four cutting nibs, and it requires a large heat and pressure laminate to laminate each layer via prepreg. In addition, it is extremely difficult to correct connection problems with the inner layer board due to design errors, and the cost of the product is unavoidable.
「問題点を解決するための手段」
上記に鑑み、本発明は、所要の信号ラインのみを片面又
は両面に被着形成すると共に、両面の信号ラインの必要
な個所にスルーホール導通を設け得る信号ライン用回路
基板を備え、一方、該信号ライン用回路基板に必要な給
電ライン及び接地ラインを別体に形成した給電・接地ラ
イン用回路基板を具備し、これら周回路基板を耐熱性感
圧接着剤等の接合材で積層するようにしｔコ多層回路菖
板を提供するものであり、ここで、給電・接地ライン用
回路基板は随意可撓性回路基板で構成する乙とが可能で
あり、このような実施形態に於いては、該基板の両面に
それらラインの一方又は双方を設ける場合にその間に形
成する導通構造を、導通個所のラインを一方から他方面
に一部露出するように形成した開切起部で半田付けして
構成するような手段も好適なものとして採用できる。"Means for Solving the Problems" In view of the above, the present invention provides a signal line that allows only the required signal lines to be formed on one side or both sides, and through-hole continuity to be provided at the required locations of the signal lines on both sides. The circuit board is equipped with a power supply/ground line circuit board in which a power supply line and a ground line necessary for the signal line circuit board are separately formed, and these peripheral circuit boards are bonded using a heat-resistant pressure-sensitive adhesive. The present invention provides a multilayer circuit board that is laminated with bonding materials such as In such an embodiment, when one or both of these lines are provided on both sides of the substrate, the conductive structure formed between them is formed such that the line at the conductive point is partially exposed from one side to the other side. A suitable means may also be employed in which the opening portion is soldered.
「実 施 例」
第１図は、本発明の一実施例による多層回路基板の概念
的な部分分解斜視図であり、１は信号ライン専用の回路
基板、４は該基板１と別体に形成してそれと積層接合さ
れる給電・接地ライン専用の他の回路基板を示し、この
基板４は硬質回路基板で構成するととも勿論可能である
が、後述のように可撓性回路基板を採用することにより
、簡便な導通構造を具備させることができる。回路基板
１ば信号ライン２の専用のものであるため、これらライ
ン２のパターンニングは両面パターンをも含めて所要の
スルーホール導通処理等と共に比較的簡易に行うことが
できる。一方、乙の基板１と別体に同時並行的に製作可
能な他の回路基板４は給電ライン５及びシールド乃至は
接地ライン６を専用に被着形成するもので、乙の基板４
は仕様に応じて両面タイプにも同様に構成できる。"Embodiment" FIG. 1 is a conceptual partially exploded perspective view of a multilayer circuit board according to an embodiment of the present invention, where 1 is a circuit board dedicated to signal lines, and 4 is formed separately from the board 1. 4 shows another circuit board dedicated to the power supply/grounding line which is laminated and bonded to the circuit board 4. Although it is of course possible to configure this board 4 with a rigid circuit board, it is also possible to adopt a flexible circuit board as described later. Accordingly, a simple conductive structure can be provided. Since the circuit board 1 is dedicated to the signal lines 2, patterning of these lines 2, including double-sided patterns, can be relatively easily performed together with necessary through-hole conduction processing. On the other hand, the other circuit board 4, which can be manufactured simultaneously and separately from the board 1 of Part B, has a power supply line 5 and a shield or ground line 6 specially attached to it.
can be similarly constructed as a double-sided type according to specifications.
そして、周回路基板１及び４は、基本的には相互に独立
したものとして上記の如く各別に構成できる乙とから、
第２図のように、信号ライン用回路基板１のための製造
工程Ａと給電・接地ライン用回路基板４の製造工程Ｂと
を分離独立して行った後、耐熱性感圧接着剤等の利用に
よる節易な積層接合工程Ｃを施し、必要ならば、両基板
１及び４間の最小限のスルーホール導通部３を設けて能
率良く所望の多層回路基板を得ることができる。The circuit boards 1 and 4 can basically be configured independently from each other as described above.
As shown in FIG. 2, after manufacturing process A for the signal line circuit board 1 and manufacturing process B for the power supply/ground line circuit board 4 are performed separately and independently, a heat-resistant pressure-sensitive adhesive or the like is used. A desired multilayer circuit board can be efficiently obtained by carrying out the simple lamination bonding process C according to the method described above, and by providing a minimum through-hole conduction section 3 between the two substrates 1 and 4, if necessary.
なお、積層接合工程Ｃに先立って各基板のパターンライ
ン面に適宜な表面絶縁被覆層を設けることも勿論可能で
あり、また、給電・接地ライン用回路基板４側を可撓性
回路基板で構成するような場合に両面導通構造を要望さ
れる際には、通常のスルーホール導通手段の他、第３図
の如く、給電ライン５を例にすれば、その裏面ライン５
Ａの一部をベース材７と共に表面ライン５側に押込んで
山形状或いはアーチ又はトンネル状等の形状からなる接
続用突起部８を設け、核部８に半田を付着させる乙とに
より籠易強固な導通構造を与えることが可能となり、こ
の回路基板４を更に低コスト化できる。Note that it is of course possible to provide an appropriate surface insulation coating layer on the pattern line surface of each board prior to the lamination bonding process C, and the power supply/grounding line circuit board 4 side may be constructed of a flexible circuit board. When a double-sided conductive structure is required in such a case, in addition to the usual through-hole conductive means, as shown in FIG.
A part of A is pushed into the surface line 5 side together with the base material 7 to form a connecting protrusion 8 having a shape such as a mountain, an arch, or a tunnel, and solder is attached to the core part 8 to make it easier and stronger. It becomes possible to provide a conductive structure, and the cost of this circuit board 4 can be further reduced.
「発明の効果」
以上説明したように、本発明に係る多層回路基板は、信
号ライン専用の回路基板と及び給電・接地ライン用回路
基板とを独立させて別体側工程で製造後、周回路基板を
耐熱性感圧接着剤等の簡便な貼合せ手段で積層一体化す
るものであるから、それらの周回路基板を同時並行的に
製作することによる大幅な工期短縮化を達成できる。ま
ｔコ、両基板の積層用ラミネートプレス等も簡易小型な
もので十分であること、そして、斯かる積層接合工程前
に於ける各基板のチェック並びにパターン修正処理等も
格段に容易である他、給電・接地ライン用回路基板には
ノイズ抑制機能をも期待できるなど、この種の多層回路
基板の低コスト化手段として最適なものがある。"Effects of the Invention" As explained above, the multilayer circuit board according to the present invention is manufactured by separating the circuit board dedicated to signal lines and the circuit board for power supply/grounding lines in separate processes, and then manufacturing the peripheral circuit board. Since these circuit boards are laminated and integrated using a simple bonding method such as a heat-resistant pressure-sensitive adhesive, it is possible to significantly shorten the construction period by manufacturing these peripheral circuit boards simultaneously. Also, a simple and small laminate press for laminating both substrates is sufficient, and it is also much easier to check each substrate and perform pattern correction processing before the lamination bonding process. The power supply/ground line circuit board can also be expected to have a noise suppression function, and is the best method for reducing the cost of this type of multilayer circuit board.
第１図は、本発明の一実施例に基づく多層回路基板の概
念的な部分分解斜視説明図、第２図は、信号ライン用回
路基板と給電・接地ライン用回路基板とを独立的に製造
したのち、両回路基板を積層一体化する概念的な製造工
程図、そして、
第３図は、給電・接地ライン用回路基板に可撓性回路基
板を適用した場合に採用可能な両面パターンの導通構造
を説明するための図である。
１：信号ライン用回路基板
２：信号ラ イ ン
３ニスル一ホール導通部
４：給電接地ライン用基板
５：給電ラ イ ン
６：接地ラ イ ン
８：接続用突起部
派 へ。FIG. 1 is a conceptual partially exploded perspective view of a multilayer circuit board according to an embodiment of the present invention, and FIG. 2 shows a signal line circuit board and a power supply/ground line circuit board manufactured independently. After that, a conceptual manufacturing process diagram for laminating and integrating both circuit boards, and Figure 3 shows the conduction of double-sided patterns that can be adopted when a flexible circuit board is applied to the power supply/ground line circuit board. FIG. 3 is a diagram for explaining the structure. 1: Signal line circuit board 2: Signal line 3 Nissle-hole conduction section 4: Power supply ground line circuit board 5: Power supply line 6: Ground line 8: Connection protrusion section.
Claims (2)
すると共に、両面の信号ラインの必要な個所にスルーホ
ール導通を設け得る信号ライン用回路基板を備え、一方
、該信号ライン用回路基板に必要な給電ライン及び接地
ラインを別体に形成した給電・接地ライン用回路基板を
具備し、これら両回路基板を耐熱性感圧接着剤等の接合
材で積層すべく構成したことを特徴とする多層回路基板
。(1) A signal line circuit board is provided on which only the required signal lines can be deposited on one or both sides, and through-hole conduction can be provided at the required locations of the signal lines on both sides, and on the other hand, the signal line circuit board The present invention is characterized in that it is equipped with a power supply/ground line circuit board in which the power supply line and ground line necessary for Multilayer circuit board.
板で構成すると共に、該基板の両面にそれらラインの一
方又は双方を設ける場合にその間に形成する導通構造を
、導通個所のラインを一方から他方面に一部露出するよ
うに形成した開切起部で半田付けして構成するようにし
た特許請求の範囲第（１）項に記載の多層回路基板。(2) When the circuit board for the power supply/ground line is constructed of a flexible circuit board, and one or both of these lines are provided on both sides of the board, the conductive structure formed between the lines at the conductive point is The multilayer circuit board according to claim 1, wherein the multilayer circuit board is constructed by soldering at a cut-out portion formed so as to be partially exposed from one side to the other side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6785785A JPS61226991A (en) | 1985-03-30 | 1985-03-30 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6785785A JPS61226991A (en) | 1985-03-30 | 1985-03-30 | Multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61226991A true JPS61226991A (en) | 1986-10-08 |
| JPH0560279B2 JPH0560279B2 (en) | 1993-09-01 |
Family
ID=13357032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6785785A Granted JPS61226991A (en) | 1985-03-30 | 1985-03-30 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61226991A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02295192A (en) * | 1989-05-10 | 1990-12-06 | Matsushita Electric Works Ltd | Multilayer printed wiring board |
| JPH02295191A (en) * | 1989-05-10 | 1990-12-06 | Matsushita Electric Works Ltd | Multilayer printed wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443571A (en) * | 1977-09-12 | 1979-04-06 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
-
1985
- 1985-03-30 JP JP6785785A patent/JPS61226991A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443571A (en) * | 1977-09-12 | 1979-04-06 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02295192A (en) * | 1989-05-10 | 1990-12-06 | Matsushita Electric Works Ltd | Multilayer printed wiring board |
| JPH02295191A (en) * | 1989-05-10 | 1990-12-06 | Matsushita Electric Works Ltd | Multilayer printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0560279B2 (en) | 1993-09-01 |
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