JPS61205112A - Injection compression molding method - Google Patents

Injection compression molding method

Info

Publication number
JPS61205112A
JPS61205112A JP4589885A JP4589885A JPS61205112A JP S61205112 A JPS61205112 A JP S61205112A JP 4589885 A JP4589885 A JP 4589885A JP 4589885 A JP4589885 A JP 4589885A JP S61205112 A JPS61205112 A JP S61205112A
Authority
JP
Japan
Prior art keywords
mold clamping
mold
time
clamping force
movable mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4589885A
Other languages
Japanese (ja)
Other versions
JPH0460016B2 (en
Inventor
Takayoshi Tanaka
隆義 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Petrochemical Co Ltd
Original Assignee
Idemitsu Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Petrochemical Co Ltd filed Critical Idemitsu Petrochemical Co Ltd
Priority to JP4589885A priority Critical patent/JPS61205112A/en
Publication of JPS61205112A publication Critical patent/JPS61205112A/en
Publication of JPH0460016B2 publication Critical patent/JPH0460016B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/561Injection-compression moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To constitute the title method that neither molding strain is generated nor a matter wherein a warp or crack is generated on a molded article does happen even if a large-sized and flat article is molded, by a method wherein mold clamping force at the time of cooling after injection and filling is controlled according to properties of molten resin. CONSTITUTION:Although injection and filling are completed at the time t2, a movable mold 10 keeps forward movement on at low speed and arrivew at l3 at the time t4. Under the above-mentioned state, at the time when the movable mold 10 has arrived at the time t5, an instruction signal is sent cut to an electromagnetic pressure control valve 30 for mold clamping force presetting through a control circuit 34, hydraulic pressure to be applied to a mold clamping cylinder 22 is controlled so that mold clamping force becomes of p3, the movable mold 10 is pushed back a little and arrives at a position p4. When the movable mold arriaves at the time t6, the instruction signal is sent out to the control valve 30 through the control circuit 34 again, the hydraulic pressure to be applied to the mold clamping cylinder 22 is controlled so that the mold clamping force becomes of p4 and the movable mold 10 is advanced a little and arrives at a position l5. When the movable mold 10 arrives at the time t7, the hydraulic pressure to be applied to the mold clamping cylinder 22 is controlled so that the mold clamping force is restored to the p2.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は射出圧縮成形方法に係り、特に型締め後の冷却
過程の改良に関するもので、比較的大型で平な物品の成
形等に利用できるものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an injection compression molding method, and particularly relates to an improvement in the cooling process after mold clamping, and can be used for molding relatively large and flat articles. It is something.

[背景技術とその問題点] 一般に射出成形法による成形品、特に比較的大型で平な
物品には、そりやクラックが発生するという欠点がある
[Background Art and Problems Therein] In general, molded articles produced by injection molding, particularly relatively large and flat articles, have the drawback of warping and cracking.

この欠点を改良する方法として従来の射出成形法と圧縮
成形法とを組合せて両者の利点を生かした射出圧縮成形
方法が知られている。
As a method for improving this drawback, an injection compression molding method is known in which the conventional injection molding method and compression molding method are combined to take advantage of the advantages of both methods.

この方法によれば1例えば、ポリカーボネート樹脂を成
形する場合、従来の射出成形に比べ、成形歪、そり等は
大きく改善される。
According to this method, for example, when polycarbonate resin is molded, molding distortion, warpage, etc. can be greatly improved compared to conventional injection molding.

しかしながら、この方法であっても近年における技術的
要請に十分に応えるものとは必ずしもいえない。
However, even this method cannot necessarily be said to fully meet recent technical demands.

これをおぎなう方法として、成形時の金型温度を高める
方法があるが、成形サイクルが長くなるとともに、金型
温度を均一に保つことが困難である。
One way to overcome this problem is to increase the mold temperature during molding, but this lengthens the molding cycle and makes it difficult to maintain a uniform mold temperature.

また、射出圧縮成形体をアニーリングする方法もあるが
、工程が増し実用上不利である。
There is also a method of annealing the injection compression molded body, but this increases the number of steps and is disadvantageous in practice.

[発明の目的j 本発明の目的は、大型で平な物品を成形しても成形歪を
生ぜず、成形品にそりやクラックが発生することのない
射出圧縮成形方法を提供することにある。
[Objective of the Invention j An object of the present invention is to provide an injection compression molding method that does not cause molding distortion even when a large flat article is molded, and does not cause warpage or cracks in the molded product.

[問題点を解決するための手段および作用]本発明は、
射出充填後における冷却時の型締力を溶融樹脂の性質に
応じて制御することにより、冷却時に成形品に成形歪が
生じないようにして、成形品にそりやクラックが発生す
ることのないようにしたものである。
[Means and effects for solving the problems] The present invention has the following features:
By controlling the mold clamping force during cooling after injection and filling according to the properties of the molten resin, molding distortion does not occur in the molded product during cooling, and warpage and cracks are prevented from occurring in the molded product. This is what I did.

具体的には、圧縮代を見込んだ位置まで型締めし、つい
で金型内に溶融樹脂を射出充填した後、再型締めにより
前記圧縮代分を圧縮して冷却固化する射出圧縮成形方法
において、 前記冷却時の型締力を前記溶融樹脂の性質に応じて制御
する構成を有している。
Specifically, in an injection compression molding method, the mold is clamped to a position that takes into account the compression allowance, then the molten resin is injected and filled into the mold, and then the mold is re-clamped to compress the compression allowance and cooled and solidified. The mold clamping force during cooling is controlled according to the properties of the molten resin.

[実施例] 第1図は本発明の方法を実施する射出圧縮成形装置を示
している。
[Example] FIG. 1 shows an injection compression molding apparatus for carrying out the method of the present invention.

同図において、固定グイプレート2と固定プレート4と
は、複数本のタイバー6を介して互いに連結されている
In the figure, the fixed gouly plate 2 and the fixed plate 4 are connected to each other via a plurality of tie bars 6.

前記タイバー6には、前記固定グイプレート2に対して
接近または離反する移動グイプレート8が摺動自在に設
けられている。
A movable gouging plate 8 that approaches or moves away from the fixed gouging plate 2 is slidably provided on the tie bar 6.

前記移動グイプレート8には移動金型10が、前記固定
グイプレート2には固定金型12が夫々取付けられてい
る。
A movable die 10 is attached to the movable gouge plate 8, and a fixed die 12 is attached to the fixed gouge plate 2, respectively.

また、前記固定金型12には注入口14が形成され、こ
の注入口14を通じて射出シリンダ16によって射出さ
れる非晶質または結晶質溶融樹脂18が前記移動金型1
0と固定金型12によって形成されるキャビティー20
内へ射出されるように構成されている。
Further, an injection port 14 is formed in the fixed mold 12, and the amorphous or crystalline molten resin 18 injected by the injection cylinder 16 through the injection port 14 is transferred to the movable mold 12.
0 and a cavity 20 formed by the fixed mold 12
It is configured to be ejected inward.

この場合、非晶質溶融樹脂18として、例えば粘度平均
分子量が15000〜35000程度のポリカーボネー
ト樹脂、ポリスチレン樹脂(一般用、耐衝撃用)、AS
樹脂、ABS樹脂、ポリアクリロニトリルもしくはポリ
メチルメタクリレート等が用いられ、また結晶質溶融樹
脂18としては、ポリプロピレン樹脂、ポリエチレン樹
脂等が用いられる。
In this case, as the amorphous molten resin 18, for example, polycarbonate resin with a viscosity average molecular weight of about 15,000 to 35,000, polystyrene resin (general use, impact resistance), AS
Resin, ABS resin, polyacrylonitrile, polymethyl methacrylate, etc. are used, and as the crystalline molten resin 18, polypropylene resin, polyethylene resin, etc. are used.

一方、前記固定プレート4には型締シリンダ22が取付
けられ、この型締シリンダ22の型締ラム24の先端が
前記移動グイプレート8に連結されている。
On the other hand, a clamping cylinder 22 is attached to the fixed plate 4, and the tip of a clamping ram 24 of the clamping cylinder 22 is connected to the movable gouging plate 8.

前記型締シリンダ22は油圧制御装置26に油圧的に接
続されており、この油圧制御装置26によって油圧制御
がなされる。
The mold clamping cylinder 22 is hydraulically connected to a hydraulic control device 26, and hydraulically controlled by the hydraulic control device 26.

この油圧制御装置26は、電磁切換弁28及び型締圧力
設定用電磁圧力制御弁30によって構成され、この電磁
切換弁28の第1及び第2の各ボートは前記型締シリン
ダ22に接続されているとともに、第3及び第4のポー
トは夫々前記型締圧力設定用電磁圧力制御弁30及び油
圧源32に油圧的に接続されている。またこれら電磁切
換弁28及び型締圧力設定用電磁圧力制御弁30は制御
回路34に電気的に接続され、該制御回路34から送出
される電気的信号によって駆動制御される。
This hydraulic control device 26 is composed of an electromagnetic switching valve 28 and a mold clamping pressure setting electromagnetic pressure control valve 30, and each of the first and second ports of this electromagnetic switching valve 28 is connected to the mold clamping cylinder 22. In addition, the third and fourth ports are hydraulically connected to the mold clamping pressure setting electromagnetic pressure control valve 30 and the hydraulic pressure source 32, respectively. The electromagnetic switching valve 28 and the electromagnetic pressure control valve 30 for setting the mold clamping pressure are electrically connected to a control circuit 34, and are driven and controlled by electrical signals sent from the control circuit 34.

さらに前記制御回路34は射出シリンダ駆動源36に電
気的に接続され該射出シリンダ駆動源36に電気的指令
信号を送出する。
Further, the control circuit 34 is electrically connected to an injection cylinder drive source 36 and sends an electrical command signal to the injection cylinder drive source 36.

この射出シリンダ駆動源36は前記油圧源32及び射出
シリンダ16に油圧的に接続されているとともに、前記
制御回路34から送出される指令信号に基づいて前記射
出シリンダ16を駆動するものである。
The injection cylinder drive source 36 is hydraulically connected to the hydraulic power source 32 and the injection cylinder 16, and drives the injection cylinder 16 based on a command signal sent from the control circuit 34.

次に、上述の装置によっって本発明を実施する場合の実
施例を第2図を参照して説明する。
Next, an embodiment in which the present invention is implemented using the above-mentioned apparatus will be described with reference to FIG.

第2図は、成形工程における移動金型10に加えられる
力、すなわち、型締力(p)及びこの移動金型lOの開
眼位置(文。)からの移動距離(L)の時間的変化を示
す図である。
Figure 2 shows temporal changes in the force applied to the movable mold 10 in the molding process, that is, the mold clamping force (p), and the moving distance (L) of the movable mold 10 from the open position (text). FIG.

同図において、横軸tは時間であり、縦軸のうち、左方
の実&apは型締め力、右方の鎖線りは移動距離である
In the figure, the horizontal axis t is time, the left side of the vertical axis &ap is the mold clamping force, and the right chain line is the moving distance.

また、同図において実線で示される曲線pは型締力の変
化を示す曲線であり、破線で示される曲線文は前記移動
金型lOの開眼位置(fL、 )からの移動距離を示す
ものである。
In addition, the curve p shown by a solid line in the same figure is a curve showing the change in mold clamping force, and the curve line shown by a broken line shows the moving distance of the movable mold IO from the open position (fL, ). be.

いま、移動金型10が開眼位置文。にある状態において
、前記制御回路34をスタートさせると該制御回路34
から前記油圧制御装置26及び射出シリンダ駆動源36
に予め定められた手順に従ってつぎつぎと指令信号が送
出され、以下の成形工程が遂行される。
Now, the movable mold 10 is in the open position. When the control circuit 34 is started in the state where the control circuit 34 is
from the hydraulic control device 26 and the injection cylinder drive source 36.
Command signals are sent out one after another according to a predetermined procedure, and the following molding process is performed.

すなわち、まず、時間E0において、移動金型lOに加
わる型締力がp+  (約50〜80kg/cmG程度
)になるように前記電磁切換弁28及び型締圧力設定用
電磁圧力制御弁30に指令信号が送出され、これにより
、前記型締シリンダ22に所定の油圧が加えられて前記
移動金型1oは高速(約30m/秒以上)で前進し、該
移動金型10が交1の位置、すなわち、成形品肉厚に溶
融樹脂18の圧縮代を見込んだ位置に至った時点1+で
前記制御回路34から前記射出シリンダ駆動源36に指
令信号が送出され、前記射出シリンダ16が駆動されて
溶融樹脂18が注入口14を通ってキャビティー20内
へ射出充填される。この射出充填が80〜90%程度な
された時点、すなわち、第2図におけるt2の時点に至
ると、前記制御回路34から前記型締圧力設定用電磁圧
力制御弁30に再び指令信号が送出され前記型締力がp
2 (成形機の型締力の80%すなわち約100kg/
cm、G以上)になるように前記型締シリンダ22に加
わる油圧が制御される。
That is, first, at time E0, a command is given to the electromagnetic switching valve 28 and the electromagnetic pressure control valve 30 for setting the clamping pressure so that the clamping force applied to the movable mold lO becomes p+ (approximately 50 to 80 kg/cmG). A signal is sent, and as a result, a predetermined hydraulic pressure is applied to the mold clamping cylinder 22, and the movable mold 1o moves forward at high speed (approximately 30 m/sec or more), and the movable mold 10 is at the intersection 1 position. That is, at the time 1+ when the molded product wall thickness takes into account the compression allowance of the molten resin 18, a command signal is sent from the control circuit 34 to the injection cylinder drive source 36, and the injection cylinder 16 is driven to melt the resin. Resin 18 is injected into cavity 20 through injection port 14 . When this injection filling is approximately 80 to 90% complete, that is, at time t2 in FIG. 2, a command signal is again sent from the control circuit 34 to the electromagnetic pressure control valve 30 for setting mold clamping pressure. The mold clamping force is p
2 (80% of the mold clamping force of the molding machine, or approximately 100 kg/
The hydraulic pressure applied to the mold clamping cylinder 22 is controlled so that the mold clamping cylinder 22 becomes equal to or higher than cm, G).

この状態で射出充填が続行され、taの時点に至って射
出充填が完了するが、移動金型loは低速度で前進を続
け、14の時点で9.3に至る。
The injection filling continues in this state, and the injection filling is completed at the time ta, but the movable mold lo continues to advance at a low speed and reaches 9.3 at the time 14.

この状態はt5まで維持され、t5に至った時点で前記
制御回路34から前記型締圧力設定用電磁圧力制御弁3
0に指令信号が送出され、型締力がp3になるように前
記型締シリンダ22に加えられる油圧が制御される。こ
れにより、前記移動金型10は少し押しもどされて交4
の位置に至る。
This state is maintained until t5, at which point the control circuit 34 sends the mold clamping pressure setting electromagnetic pressure control valve 3 to the control circuit 34.
A command signal is sent to p3, and the hydraulic pressure applied to the mold clamping cylinder 22 is controlled so that the mold clamping force becomes p3. As a result, the movable mold 10 is pushed back a little and crossed 4.
reach the position.

この状態はtaの時点まで維持され、taの時点に至る
と再び前記制御回路34から前記型締圧力設定用電磁圧
力制御弁3oに指令信号が送出され、型締力がp4にな
るように前記型締シリンダ22に加えられる油圧が制御
される。これにより、前記移動金型lOは少し前進して
交5の位置に至る。
This state is maintained until the time ta, and at the time ta, a command signal is again sent from the control circuit 34 to the electromagnetic pressure control valve 3o for setting the mold clamping force, so that the mold clamping force becomes p4. The hydraulic pressure applied to the mold clamping cylinder 22 is controlled. As a result, the movable mold lO moves forward a little and reaches the intersection 5 position.

さらに、この状態はt7に至るまで維持され。Furthermore, this state is maintained until t7.

t7の時点に至ると前記制御回路34から前記型締圧力
設定用電磁圧力制御弁30に指令信号が送出され、型締
力が22に復帰するように前記型締シリンダ22に加え
られる油圧が制御される。これにより成形品に最後の型
締めが加えられ、前記移動金型10は再び又3の位置に
達する。
At time t7, a command signal is sent from the control circuit 34 to the electromagnetic pressure control valve 30 for setting the mold clamping pressure, and the hydraulic pressure applied to the mold clamping cylinder 22 is controlled so that the mold clamping force returns to 22. be done. As a result, the final mold clamping is applied to the molded product, and the movable mold 10 reaches the position 3 again.

この状態はtaの時点まで維持され、taの時点に至る
と前記制御回路34から前記電磁切換弁28及び型締圧
力設定用電磁圧力制御弁30に指令信号が送出され、前
記移動金型10を開眼位置に復帰させるように前記型締
シリンダ22に油圧制御が行なわれる。
This state is maintained until time ta, at which time a command signal is sent from the control circuit 34 to the electromagnetic switching valve 28 and the electromagnetic pressure control valve 30 for setting the mold clamping pressure, and the movable mold 10 is activated. Hydraulic control is performed on the mold clamping cylinder 22 to return it to the open position.

以上の工程サイクルの繰替しにより、製品がつぎつぎと
成形されるものである。
By repeating the above process cycle, products are molded one after another.

上述の実施例にあっては、以下の利点を有する。The above embodiment has the following advantages.

すなわち、前記移動金型lOが圧縮代を見込んだ位置、
すなわち、第2図における文1に達した時点、すなわち
1+の時点から射出充填を開始し、この射出充填期間が
完了する時点、すなわちtaに至る前の時点t2の時点
からさらに強い圧力で再型締めを行っているので、射出
充填が極めて十分になされ、成形品にそりやクラックが
生じる恐れがない。
That is, the position where the movable mold lO takes into account the compression allowance,
That is, injection filling is started from the time point 1 in FIG. Since the molded product is tightened, the injection filling is extremely thorough, and there is no risk of warping or cracking in the molded product.

ヤらに、成形品の冷却固化のi程において溶融樹脂の特
性に応じて前記再型締力を制御しているから、成形歪が
生ずることがない。
Furthermore, since the re-clamping force is controlled in accordance with the characteristics of the molten resin during the cooling and solidifying stage of the molded product, no molding distortion occurs.

すなわち、一般に溶融樹脂が冷却固化する過程において
は、膨張ないし収縮現象を伴うもの、この1膨張ないし
収縮の挙動に追従するように型締力を加減しているから
、その膨張収縮の際に成形品に不必要な応力が加わるこ
とがなく、従って成形歪が生ずることがないものである
In other words, the process of cooling and solidifying molten resin is generally accompanied by expansion or contraction, and the mold clamping force is adjusted to follow the behavior of this expansion or contraction. No unnecessary stress is applied to the product, and therefore no molding distortion occurs.

この成形歪がないことから、成形体にそり、ひけ、クラ
ックもしくは変形等が生ずることはない。
Since there is no molding distortion, warpage, sink marks, cracks, deformation, etc. do not occur in the molded product.

また、このように成形体にそりやクラック等が存在しな
いということは、成形体の耐溶剤性、金型転写性あるい
は寸法精度の向上につながるものである。
Moreover, the absence of warpage, cracks, etc. in the molded product leads to improvements in the solvent resistance, mold transferability, and dimensional accuracy of the molded product.

さらに、溶融樹脂の冷却固化過程における膨張もしくは
収縮現象に対応して型締力を制御しているのでキャビテ
ィ内の溶融樹脂の逆流防止機構が不要となり、金型構造
が単純化できるというメリットも有する。
Furthermore, since the mold clamping force is controlled in response to expansion or contraction phenomena during the cooling and solidification process of the molten resin, there is no need for a backflow prevention mechanism for the molten resin in the cavity, which has the advantage of simplifying the mold structure. .

なお、前記実施例にあっては、溶融樹脂の冷却固化過程
において型締力を2段階に切換えて制御しているが、こ
れは用いる溶融樹脂の種類により、その膨張もしくは収
縮の現象に対応させて必要段階とすることもできる。
In the above embodiment, the mold clamping force is controlled in two stages during the cooling and solidification process of the molten resin, but this is controlled in accordance with the expansion or contraction phenomenon depending on the type of molten resin used. It can also be a necessary step.

また、前記実施例にあっては、溶融樹脂の冷却固化過程
において型締力を再型締力よりも小さくする例を揚げた
が、溶融樹脂によっては逆にこれを高い圧力にし、その
後に低い圧力にする等積々の変形が考えられることは勿
論である。
In addition, in the above embodiment, the mold clamping force is lower than the re-clamping force during the cooling and solidification process of the molten resin, but depending on the molten resin, the pressure may be increased to a high pressure and then lowered. Of course, multiple deformations such as increasing pressure can be considered.

要するに1本発明は、溶融樹脂の冷却固化過程において
、該溶融樹脂に不必要な応力が加わらないように該溶融
樹脂の冷却固化過程における膨張収縮現象に対応させて
型締力を制御する方法は全て含まれるものである。
In short, the present invention provides a method for controlling mold clamping force in response to expansion and contraction phenomena during the cooling and solidifying process of the molten resin so as not to apply unnecessary stress to the molten resin. All are included.

[発明の効果] 以上詳述したように本発明は、溶融樹脂の冷却固化過程
において再型締力を溶融樹脂の特性に応じて制御するこ
とにより、この冷却固化過程において該溶融樹脂に不必
要な応力が加わることを防止し、これにより成形品に成
形歪が生ずることのないようにしたもので、このため、
特に大型で平な成形品も、そり、クラック、ひけもしく
は変形がなく、かつ、耐溶剤性、金型転写性、および寸
法精度の優れたものを比較的容易に得ることを可能とす
る。
[Effects of the Invention] As described in detail above, the present invention controls the re-clamping force in accordance with the characteristics of the molten resin during the cooling and solidification process of the molten resin, so that unnecessary force is applied to the molten resin during the cooling and solidification process. This prevents stress from being applied to the molded product, thereby preventing molding distortion from occurring in the molded product.
In particular, it is possible to relatively easily obtain large, flat molded products that are free from warpage, cracks, sink marks, or deformation, and have excellent solvent resistance, mold transferability, and dimensional accuracy.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の方法を実施するための射出圧縮成形装
置の構成を示す図、第2図は本発明の詳細な説明するた
めの図である。 10・・・移動金型、12・・・固定金型、16・・・
射出シリンダ、18・・・非晶質溶融樹脂、22・・・
型締シリンダ、26・・・油圧制御装置、28・・・電
磁切換弁、30・・・型締圧力設定用電磁圧力制御弁、
34・・・制御回路、36・・・射出シリンダ駆動源。
FIG. 1 is a diagram showing the configuration of an injection compression molding apparatus for carrying out the method of the present invention, and FIG. 2 is a diagram for explaining the present invention in detail. 10... Moving mold, 12... Fixed mold, 16...
Injection cylinder, 18...Amorphous molten resin, 22...
Mold clamping cylinder, 26...hydraulic control device, 28...electromagnetic switching valve, 30...electromagnetic pressure control valve for mold clamping pressure setting,
34... Control circuit, 36... Injection cylinder drive source.

Claims (1)

【特許請求の範囲】[Claims] (1)圧縮代を見込んだ位置まで型締めし、ついで金型
内に溶融樹脂を射出充填した後、再型締めにより前記圧
縮代分を圧縮して冷却固化する射出圧縮成形方法におい
て、 前記冷却時の型締力を前記溶融樹脂の性質に応じて制御
することを特徴とする射出圧縮成形方法。
(1) In an injection compression molding method in which the mold is clamped to a position that takes into account the compression allowance, then the molten resin is injected and filled into the mold, the compression allowance is compressed by re-clamping, and the cooling is solidified. An injection compression molding method characterized in that the mold clamping force at the time of molding is controlled according to the properties of the molten resin.
JP4589885A 1985-03-08 1985-03-08 Injection compression molding method Granted JPS61205112A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4589885A JPS61205112A (en) 1985-03-08 1985-03-08 Injection compression molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4589885A JPS61205112A (en) 1985-03-08 1985-03-08 Injection compression molding method

Publications (2)

Publication Number Publication Date
JPS61205112A true JPS61205112A (en) 1986-09-11
JPH0460016B2 JPH0460016B2 (en) 1992-09-24

Family

ID=12732061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4589885A Granted JPS61205112A (en) 1985-03-08 1985-03-08 Injection compression molding method

Country Status (1)

Country Link
JP (1) JPS61205112A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629926A (en) * 1985-07-09 1987-01-17 Hitachi Ltd Molding method for optical disk base
JPS62109618A (en) * 1985-11-08 1987-05-20 Sony Corp Injection molding process for disc
JPH01200926A (en) * 1988-02-05 1989-08-14 Fanuc Ltd Compression molding control system in electromotive type injection molding machine
JPH01264817A (en) * 1988-04-18 1989-10-23 Daicel Chem Ind Ltd Injection molding method for plastic board for optical disk
US5008052A (en) * 1987-12-03 1991-04-16 Toshiba Machine Co., Ltd. Mold clamping pressure control method for injection compression molding and injection compression molding machine
JPH03101913A (en) * 1990-04-05 1991-04-26 Hitachi Ltd Injection compression molding method and its device
EP0426129A2 (en) * 1989-11-01 1991-05-08 Sumitomo Heavy Industries, Ltd Injection compression molding method for compact discs or the like
WO1992002352A1 (en) * 1990-08-03 1992-02-20 Komatsu, Ltd. Injection-compression-molding method
JPH0531774A (en) * 1990-11-08 1993-02-09 Kuraray Co Ltd Method of injection-molding synthetic resin molding
JP2001212829A (en) * 2000-02-04 2001-08-07 Nok Corp Mold clamping device
JP2002187177A (en) * 2000-12-21 2002-07-02 Polyplastics Co Method for manufacturing injection compression molded article

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187231A (en) * 1981-05-13 1982-11-17 Matsushita Electric Ind Co Ltd Mold apparatus for compression molding of resin
JPS57187232A (en) * 1981-05-13 1982-11-17 Matsushita Electric Ind Co Ltd Method and device for resin compression molding

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187231A (en) * 1981-05-13 1982-11-17 Matsushita Electric Ind Co Ltd Mold apparatus for compression molding of resin
JPS57187232A (en) * 1981-05-13 1982-11-17 Matsushita Electric Ind Co Ltd Method and device for resin compression molding

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0449446B2 (en) * 1985-07-09 1992-08-11 Hitachi Seisakusho Kk
JPS629926A (en) * 1985-07-09 1987-01-17 Hitachi Ltd Molding method for optical disk base
JPS62109618A (en) * 1985-11-08 1987-05-20 Sony Corp Injection molding process for disc
US5008052A (en) * 1987-12-03 1991-04-16 Toshiba Machine Co., Ltd. Mold clamping pressure control method for injection compression molding and injection compression molding machine
JPH01200926A (en) * 1988-02-05 1989-08-14 Fanuc Ltd Compression molding control system in electromotive type injection molding machine
JPH082574B2 (en) * 1988-02-05 1996-01-17 ファナック株式会社 Compression molding control method in electric injection molding machine
JPH01264817A (en) * 1988-04-18 1989-10-23 Daicel Chem Ind Ltd Injection molding method for plastic board for optical disk
JPH078514B2 (en) * 1988-04-18 1995-02-01 ダイセル化学工業株式会社 Injection molding method for plastic substrates for optical disks
EP0426129A2 (en) * 1989-11-01 1991-05-08 Sumitomo Heavy Industries, Ltd Injection compression molding method for compact discs or the like
US5417899A (en) * 1989-11-01 1995-05-23 Sumitomo Heavy Industries, Ltd. Injection compression molding method for compact discs or the like
JPH03101913A (en) * 1990-04-05 1991-04-26 Hitachi Ltd Injection compression molding method and its device
WO1992002352A1 (en) * 1990-08-03 1992-02-20 Komatsu, Ltd. Injection-compression-molding method
JPH0531774A (en) * 1990-11-08 1993-02-09 Kuraray Co Ltd Method of injection-molding synthetic resin molding
JP2001212829A (en) * 2000-02-04 2001-08-07 Nok Corp Mold clamping device
JP2002187177A (en) * 2000-12-21 2002-07-02 Polyplastics Co Method for manufacturing injection compression molded article

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