JPS61201443A - Apparatus for vacuum treatment - Google Patents

Apparatus for vacuum treatment

Info

Publication number
JPS61201443A
JPS61201443A JP4109385A JP4109385A JPS61201443A JP S61201443 A JPS61201443 A JP S61201443A JP 4109385 A JP4109385 A JP 4109385A JP 4109385 A JP4109385 A JP 4109385A JP S61201443 A JPS61201443 A JP S61201443A
Authority
JP
Japan
Prior art keywords
sample
treatment chamber
rotating shaft
noise
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4109385A
Other languages
Japanese (ja)
Inventor
Katsuyasu Nishida
西田　勝安
Hideji Yamamoto
山本　秀治
Katsuyoshi Kudo
勝義 工藤
Katsuji Matano
勝次 亦野
Atsushi Kohama
小浜　敦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4109385A priority Critical patent/JPS61201443A/en
Publication of JPS61201443A publication Critical patent/JPS61201443A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To index revolution of a sample table for sample setting with high accuracy by eliminating influence of noise given to the index of revolution of the sample table for sample setting. CONSTITUTION:A top end of a rotating shaft 20 is protruded in a treatment chamber 10. The rotating shaft 20 is provided so as to rotate freely while being electrically isolated from the treatment chamber 10 and keeping airtightness of the treatment chamber 10. An indexer 50 whose output shaft is hollow is put on the rotating shaft 20 by a flange 21 outside the treatment chamber 10. A motor which is not influenced by noise, for instance a three-phase motor 60, is installed outside the treatment chamber 10 and a pulley 61 is attached to it. A decelerator 70 is installed outside the treatment chamber 10 and a pulley 71 is attached to it. The rotating shaft 20 is connected to a high frequency source 90 installed outside the treatment chamber 10.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、真空処理装置に係り、特に試料設置用の試料
台の回転割出しが必要な真空処理装置に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a vacuum processing apparatus, and particularly to a vacuum processing apparatus that requires rotational indexing of a sample stage for setting a sample.

〔発明の背景〕[Background of the invention]

試料設置用の試料台の回転割出しが必要な真空処理装置
としては、例えば、実開昭５９−９９４３８号公報記載
のような、試料である基板が複数枚同時に載置される試
料台である電極の回動軸に設けられた被駆動歯車にモー
タで駆動される駆動歯車をスプリング力により常時押付
けるようにしたものが知られている。An example of a vacuum processing apparatus that requires rotational indexing of a sample stage for sample installation is a sample stage on which a plurality of substrates as samples are placed simultaneously, as described in Japanese Utility Model Application Publication No. 59-99438. A device is known in which a driving gear driven by a motor is constantly pressed by a spring force against a driven gear provided on a rotating shaft of an electrode.

しかし、この装置でモータ番ζパルスモータを用いた場
合、ノイズが乗り易く、このノイズ暑こ起因する税調が
生じて試料設置用の試料台の回転割出しを高精度に行え
なくなるといった問題が生じる。However, when a motor number ζ pulse motor is used in this device, there is a problem that noise is easily generated, and tax adjustment due to this noise occurs, making it impossible to perform highly accurate rotational indexing of the sample stage for sample installation. .

〔発明の目的〕[Purpose of the invention]

本発明の目的は、試料設置用の試料台の回転割出し蓚こ
与えるノイズの影響をなくすことで、試料設置用の試料
台の回転割出しを高精度に行うことができる真空処理装
置を提供することにある。An object of the present invention is to provide a vacuum processing apparatus that can perform rotational indexing of a sample stage for sample installation with high precision by eliminating the influence of noise caused by rotational indexing of the sample stage for sample installation. It's about doing.

〔発明の概要〕[Summary of the invention]

本発明は、試料設置用の試料台の回転軸に取り付けられ
前記試料台に設置される試料の個数と同数の回転割出し
を行う割出し機と、ノイズの影響を受けないモータと、
該モータの回動を減速して前記割出し機に与える減速機
とを具備したことを特徴とするもので、試料設置用の試
料台の回転割出し１こ与えるノイズの影響をなくすこと
で、試料設置用の試料台の回転割出しを高精度に行える
ようにしたものである。The present invention provides an indexer that is attached to a rotating shaft of a sample stage for sample installation and performs rotational indexing for the same number of samples as the number of samples installed on the sample stage, and a motor that is not affected by noise.
It is characterized by comprising a reducer that reduces the rotation of the motor and applies it to the indexer, and eliminates the influence of noise that affects the rotation index of the sample stage for sample installation. This allows highly accurate rotational indexing of the sample stage for sample installation.

〔発明の実施例〕[Embodiments of the invention]

本発明の一実施例を図面により説明する。 An embodiment of the present invention will be described with reference to the drawings.

図面で、処理室１０の、この場合、底壁には、この場合
、上端部を処理室１０内に突出して回動輪２０が、処理
室１０と電気的に絶縁され気密を保持して回動可能に設
けられている。試料設置用の試料台、例えば、試料電極
３０は、処理室１０内で試料設置面を上面として回動軸
２０の上端に略水平に設けられている。試料電極３０は
、複数個の試料４０を被処理面上向姿勢にて同一円周上
の別々の位置に設置可能な形状２寸法を有している。出
力軸が中空である割出し機５０は、処理室１０外で回動
軸２０にフランジ２１を介して環装されて取り付けられ
ている。割出し機５０は、試料電極３０＃ζ設置される
試料４００個数と同数の回転割出しを行う機能を有して
いる。ノイズの影響を受けないモータ、例えば、三相モ
ータ６０は、処理室１０外に設置され、三相モータ６０
には、プーリ６１が設けられている。減速機７０は、処
理室１０外に設置され、減速機７０には、プーリ７１が
設けられている。減速機７０は、三相モータ６０の回動
を減速して割出し機５０に与える機能を有している。プ
ーリ６１，７１には、ベルト８０が無端に巻掛けられて
いる。尚、回動軸２０は、処理室１０外に設置された電
源である高周波電源９０に接続されている。In the drawing, a rotating wheel 20 is installed on the bottom wall of the processing chamber 10, in this case, with its upper end protruding into the processing chamber 10, and is electrically insulated from the processing chamber 10 and rotates while maintaining airtightness. possible. A sample stage for installing a sample, for example, a sample electrode 30, is provided approximately horizontally at the upper end of the rotating shaft 20 in the processing chamber 10 with the sample installation surface as the upper surface. The sample electrode 30 has a shape and two dimensions that allow a plurality of samples 40 to be installed at different positions on the same circumference with the surface to be processed facing upward. The indexing machine 50 having a hollow output shaft is attached to the rotating shaft 20 via a flange 21 so as to be attached to the rotating shaft 20 outside the processing chamber 10 . The indexing machine 50 has a function of performing rotational indexing for the same number of samples as the number of 400 samples installed on the sample electrodes 30#ζ. A motor that is not affected by noise, for example, a three-phase motor 60, is installed outside the processing chamber 10, and the three-phase motor 60
A pulley 61 is provided. The reducer 70 is installed outside the processing chamber 10, and the reducer 70 is provided with a pulley 71. The speed reducer 70 has the function of slowing down the rotation of the three-phase motor 60 and applying it to the indexer 50. A belt 80 is endlessly wound around the pulleys 61 and 71. Note that the rotation shaft 20 is connected to a high frequency power source 90 that is a power source installed outside the processing chamber 10.

図面で、三相モータ６０の回動は、減速機７０で大きな
減速比で減速されて割出し機５０に与えられる。割出し
機５０では、試料４０の個数と同数１ζ更薯こ減速され
ると同時に回動軸２０を介して試料電極３０の回転と停
止とが繰り返し実施される。この回転と停止とのインタ
ーバルは電気的に任意基こ設定することができる。これ
により試料電極３０には、所定個数の試料４０が設定位
置に精度良く設置され、その後、例えば、プラズマ１ζ
より所定処理される。また、処理済みの試料４０は、試
料電極３０から確実に除去されて処理室１０外へ搬出さ
れる。In the drawing, the rotation of the three-phase motor 60 is reduced by a reduction gear 70 at a large reduction ratio and is applied to the indexer 50. In the indexer 50, the sample electrode 30 is repeatedly rotated and stopped via the rotating shaft 20 while being decelerated by 1ζ times equal to the number of samples 40. The interval between rotation and stop can be electrically set on an arbitrary basis. As a result, a predetermined number of samples 40 are placed on the sample electrode 30 at set positions with high accuracy, and then, for example, plasma 1ζ
A predetermined process is performed. Moreover, the processed sample 40 is reliably removed from the sample electrode 30 and carried out of the processing chamber 10.

本実施例では、次のような効果を得ることができる。In this embodiment, the following effects can be obtained.

＋１３　　三相モータは、高周波電源のノイズの影響を
受けないため、試料電極の回転割出しに与える影響をな
くすことができ試料電極の回転割出しを高精度に行うこ
とができる。+13 Since the three-phase motor is not affected by the noise of the high frequency power supply, it can eliminate the influence on the rotational indexing of the sample electrode, and can perform rotational indexing of the sample electrode with high precision.

（２）割出し機の出力、軸が中空であるため、帯電も少
なく絶縁及び接地を容易１こ行うことができる。(2) Since the output and shaft of the indexing machine is hollow, there is little charge and insulation and grounding can be easily performed.

（３）減速機での歯車歯面のバックラッシュが発生して
も、この影響は割出し機で吸収されるため、回転軸での
ガタは実質的ζζ生ぜず高精度の回転、停止がなされる
。(3) Even if backlash occurs on the tooth surface of the gear in the reducer, this effect is absorbed by the indexer, so there is virtually no backlash on the rotating shaft, and high-precision rotation and stopping can be achieved. Ru.

〔発明の効果〕〔Effect of the invention〕

本発明は、以上説明したようＩこ、試料設置用の試料台
の回転割出しに与えるノイズの影響をなくすことができ
るので、試料設置用の試料台の回転割出しを高精度に行
うことができる真空処理装置を提供できるという効果が
ある。As explained above, the present invention can eliminate the influence of noise on the rotational indexing of the sample stage for sample installation, so that the rotational indexing of the sample stage for sample installation can be performed with high precision. This has the effect of providing a vacuum processing apparatus that can

【図面の簡単な説明】[Brief explanation of drawings]

図面は、本発明１こよる真空処理装置の一実施例を示す
要部縦断面図である。The drawing is a longitudinal cross-sectional view of essential parts showing an embodiment of the vacuum processing apparatus according to the present invention.

Claims (1)

【特許請求の範囲】[Claims] １．試料設置用の試料台の回転軸に取り付けられ前記試
料台に設置される試料の個数と同数の回転割り出しを行
う割出し機と、ノイズの影響を受けないモータと、該モ
ータの回動を減速して前記割出し機に与える減速機とを
具備したことを特徴と真空処理装置。1. An indexer that is attached to the rotating shaft of a sample stand for sample installation and performs rotation indexing for the same number of samples as the number of samples to be placed on the sample stand, a motor that is not affected by noise, and an indexer that decelerates the rotation of the motor. and a speed reducer for supplying the indexing machine to the indexing machine.
JP4109385A 1985-03-04 1985-03-04 Apparatus for vacuum treatment Pending JPS61201443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4109385A JPS61201443A (en) 1985-03-04 1985-03-04 Apparatus for vacuum treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4109385A JPS61201443A (en) 1985-03-04 1985-03-04 Apparatus for vacuum treatment

Publications (1)

Publication Number Publication Date
JPS61201443A true JPS61201443A (en) 1986-09-06

Family

ID=12598859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4109385A Pending JPS61201443A (en) 1985-03-04 1985-03-04 Apparatus for vacuum treatment

Country Status (1)

Country Link
JP (1) JPS61201443A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2750788A1 (en) * 1996-07-02 1998-01-09 Sony Corp Direct current electrode sputtering equipment for optical disc manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2750788A1 (en) * 1996-07-02 1998-01-09 Sony Corp Direct current electrode sputtering equipment for optical disc manufacture
US6022462A (en) * 1996-07-02 2000-02-08 Sony Corporation DC sputtering system

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