JPS61197664U - - Google Patents
Info
- Publication number
- JPS61197664U JPS61197664U JP1985082708U JP8270885U JPS61197664U JP S61197664 U JPS61197664 U JP S61197664U JP 1985082708 U JP1985082708 U JP 1985082708U JP 8270885 U JP8270885 U JP 8270885U JP S61197664 U JPS61197664 U JP S61197664U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- component
- terminal
- electrical component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の一実施例における接続装置の
上面図、第２図はその正面図、第３図はその側面
図、第４図は従来の接続装置の側面図、第５図は
同接続装置の主要部の回路図である。
１…リジツトプリント基板、２…コイル部品、
３…ジヤツク、４…フレキシブルプリント基板、
５…ホルダー。
Fig. 1 is a top view of a connecting device according to an embodiment of the present invention, Fig. 2 is a front view thereof, Fig. 3 is a side view thereof, Fig. 4 is a side view of a conventional connecting device, and Fig. 5 is the same. FIG. 3 is a circuit diagram of the main parts of the connection device. 1... Rigid printed circuit board, 2... Coil parts,
3...Jack, 4...Flexible printed circuit board,
5...Holder.
Claims (1)
の第１の電気部品の端子に接続される第２の電子
部品を有し、この第２の部品の端子に接続された
フレキシブルプリント基板の配線導体の他端を前
記第１の電気部品のリード脚に位置決めし接続す
るように構成したことを特徴とする接続装置。 A second electronic component is connected to the terminal of the first electrical component with lead legs attached to the rigid printed circuit board, and the wiring conductor of the flexible printed circuit board is connected to the terminal of the second component. A connecting device characterized in that the end thereof is configured to be positioned and connected to a lead leg of the first electrical component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082708U JPH049750Y2 (en) | 1985-05-31 | 1985-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082708U JPH049750Y2 (en) | 1985-05-31 | 1985-05-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61197664U true JPS61197664U (en) | 1986-12-10 |
| JPH049750Y2 JPH049750Y2 (en) | 1992-03-11 |
Family
ID=30630664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985082708U Expired JPH049750Y2 (en) | 1985-05-31 | 1985-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH049750Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5146956U (en) * | 1974-10-03 | 1976-04-07 | ||
| JPS55123193A (en) * | 1979-03-16 | 1980-09-22 | Omron Tateisi Electronics Co | Method of connecting substrates |
| JPS5952687U (en) * | 1982-09-30 | 1984-04-06 | 東芝ライテック株式会社 | Mounting structure of electronic components |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5146956B2 (en) * | 1972-11-09 | 1976-12-11 | ||
| JPS5952687B2 (en) * | 1979-08-24 | 1984-12-21 | 住友金属工業株式会社 | Manufacturing method of tempered high-strength steel plate with excellent low-temperature toughness |
-
1985
- 1985-05-31 JP JP1985082708U patent/JPH049750Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5146956U (en) * | 1974-10-03 | 1976-04-07 | ||
| JPS55123193A (en) * | 1979-03-16 | 1980-09-22 | Omron Tateisi Electronics Co | Method of connecting substrates |
| JPS5952687U (en) * | 1982-09-30 | 1984-04-06 | 東芝ライテック株式会社 | Mounting structure of electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH049750Y2 (en) | 1992-03-11 |