JPS6119620A - Liquid epoxy resin composition - Google Patents
Liquid epoxy resin compositionInfo
- Publication number
- JPS6119620A JPS6119620A JP14015684A JP14015684A JPS6119620A JP S6119620 A JPS6119620 A JP S6119620A JP 14015684 A JP14015684 A JP 14015684A JP 14015684 A JP14015684 A JP 14015684A JP S6119620 A JPS6119620 A JP S6119620A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- liquid epoxy
- inorganic filler
- resin composition
- per
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は液状エポキシ樹脂組成物に関する。[Detailed description of the invention] The present invention relates to liquid epoxy resin compositions.
更に詳しくは、本発明は線膨張係数が小さく耐クラツク
性が改良された硬化物を与え、特に半導体素子の封止剤
として有用な液状エポキシ樹脂組成物に関する。More specifically, the present invention relates to a liquid epoxy resin composition that provides a cured product with a small coefficient of linear expansion and improved crack resistance, and is particularly useful as a sealant for semiconductor devices.
現在、半導体素子の封止には、エポキシ樹脂を主剤とし
溶融シリカまたは結晶シリカなどを充填剤としフェノー
ルノボラックを硬化剤とした主成分に、硬化促進剤など
を配合した組成物が使用されている。この組成物は粉状
であるが、取扱いが容易なようにタブレット状またはペ
レット状に成形される。このタブレットまたはペレット
は低圧トランスファー成形機の、シリンダ一部に導入さ
れ、加熱溶融され、あらかじめ半導体素子が配置された
金型内に圧入され加熱硬化されて半導体素子の樹脂封止
が完成する。この方法は低圧トランスファー成形法と呼
ばれ、大量生産が容易なため半導体素子の樹脂封止の主
流となっている。しかし、設備費が高いため少量多品種
生産には適さない。Currently, compositions are used to encapsulate semiconductor devices, consisting of an epoxy resin as the main ingredient, fused silica or crystalline silica as a filler, and phenol novolak as a hardener, with a curing accelerator added to the main ingredients. . Although this composition is in powder form, it can be shaped into tablets or pellets for easy handling. This tablet or pellet is introduced into a part of the cylinder of a low-pressure transfer molding machine, heated and melted, and then press-fitted into a mold in which a semiconductor element has been placed in advance and heated and hardened to complete resin encapsulation of the semiconductor element. This method is called low-pressure transfer molding, and because it is easy to mass-produce, it has become the mainstream method for resin encapsulation of semiconductor devices. However, due to high equipment costs, it is not suitable for low-volume, high-mix production.
少量多品種生産には、注型法・ディッピング法・ドロッ
ピング法などが使用される。注型法とは、型わくの中に
素子をセットし液状封止剤を注入した後加熱硬化させる
方法である。ディッピング法とは、素子を液状封止剤に
浸漬し、素子表面に封止剤を付着させた後加熱硬化させ
る方法である。ドロッピング法とは、素子に液状封止剤
を滴下し加熱硬化させる方法である。Casting, dipping, and dropping methods are used for low-volume, high-mix production. The casting method is a method in which an element is set in a mold, a liquid sealant is injected, and then the element is heated and cured. The dipping method is a method in which an element is immersed in a liquid sealant, the sealant is adhered to the surface of the element, and then heated and cured. The dropping method is a method in which a liquid sealant is dropped onto an element and cured by heating.
このように、液状封止剤を使用する方法は設備費が安く
かつ少量多品種生産に適しているが、低圧トランスファ
ー成形法に比較して、以下の点で樹脂封止された半導体
素子の信頼性が低いのが問題となって、いる。As described above, the method of using liquid encapsulant has low equipment costs and is suitable for low-volume, high-mix production; however, compared to low-pressure transfer molding, the reliability of resin-encapsulated semiconductor elements is The problem is that the gender is low.
すなわち、線膨張係数が大きく温度変化により半導体素
子に応力がかかり配線の断線または、封止樹脂そのもの
にクラックが生じるなどの不良が起る。線膨張係数を小
さくするには、一般に線膨張係数の低い無機充填剤を充
填する方法が用いられるが、高充填する場合には液状封
止剤の流動性が著゛シ＜低下し、前述のような成形方法
が使用できなくなる。このため反応性希釈剤が使用され
る場合もあるが、これも耐警性の低下を招くなどの欠点
を有してい名。更には、イオン性の不純物の混入により
半導体集積回路の配線を形成しているアルミの腐蝕を生
じるなどの問題がある。That is, the coefficient of linear expansion is large, and stress is applied to the semiconductor element due to temperature changes, resulting in defects such as disconnection of wiring or cracks in the sealing resin itself. In order to reduce the coefficient of linear expansion, a method of filling an inorganic filler with a low coefficient of linear expansion is generally used, but when the filling is high, the fluidity of the liquid sealant decreases significantly, resulting in the above-mentioned problem. This makes it impossible to use such molding methods. For this reason, reactive diluents are sometimes used, but these also have drawbacks such as a decrease in security. Furthermore, there are other problems such as corrosion of the aluminum forming the wiring of the semiconductor integrated circuit due to the mixing of ionic impurities.
たとえば、特開昭５９−８７２０号公報には聾１
無機充填路として、結晶性シリカ、溶融シリカ、アルミ
ナ、三酸化アンチモン、ガラス繊維、マイカ、タルク、
クレーなどを含有してなる液状エポキシ樹脂組成物が開
示されているが、線膨粘度の低下が著しく、粘度低下を
回避するために反応性希釈剤が必要となる。しかし反応
性希釈剤の使用、は、熱変形温度の低下、熱分解開始温
度の低下など耐熱性の低下を招くことになり好ましくな
い。For example, Japanese Patent Application Laid-Open No. 59-8720 describes the use of crystalline silica, fused silica, alumina, antimony trioxide, glass fiber, mica, talc,
A liquid epoxy resin composition containing clay or the like has been disclosed, but the linear expansion viscosity decreases significantly, and a reactive diluent is required to avoid the decrease in viscosity. However, the use of a reactive diluent is undesirable because it causes a decrease in heat resistance such as a decrease in heat distortion temperature and a decrease in thermal decomposition initiation temperature.
本発明者らはかかる実情に鑑みて、低圧トランスファー
成形法での樹脂封止と優るとも劣らない樹脂封止を可能
にし、線膨張係数の小さい硬化物を与える液状封止剤に
？いて鋭意研究した。その結果、球状の無機充填剤を液
状封止剤組成物の一成分として配合することを見出し、
本発明に到達したものである。In view of these circumstances, the present inventors have developed a liquid sealant that enables resin sealing that is as good as that achieved by low-pressure transfer molding and provides a cured product with a small coefficient of linear expansion. I did a lot of research. As a result, they discovered that a spherical inorganic filler can be incorporated as a component of a liquid sealant composition,
This has led to the present invention.
すなわら本発明は、分子中に２個以上のエポ 鯉キ
シ基を有する液状エポキシ樹脂、球状の無機充填剤、硬
化剤および硬化促進剤を含有してなる液状エポキシ樹脂
組成物を提供する。That is, the present invention provides a liquid epoxy resin composition containing a liquid epoxy resin having two or more epoxy groups in the molecule, a spherical inorganic filler, a curing agent, and a curing accelerator.
Ｊ−＋
本発明の液状エポキシ樹脂組成物は低粘度であるために
前述した種々の成型方法に適用し、その硬化物の線膨張
係数が小さいという特徴の他に、無機充填剤が増量され
ることで相対的にエポキシ樹脂は減量され名こと（こな
り、結果的にエポキシ樹脂組成物中の不純物イオン、特
に塩累イオンが減量するという特徴がある。J-+ Since the liquid epoxy resin composition of the present invention has a low viscosity, it can be applied to the various molding methods described above, and in addition to the characteristic that the linear expansion coefficient of the cured product is small, the amount of inorganic filler is increased. As a result, the amount of the epoxy resin is relatively reduced, and as a result, the amount of impurity ions, especially salt ions, in the epoxy resin composition is reduced.
本発明に使用されるエポキシ樹脂とは、分子中に２個以
上のエポキシ基を有する液状エポキシ樹脂であって、ビ
スフェノニールＡのジグリシジルエーテル、ビスフェノ
ールＦのジグリシジルエーテルなどのビスフェノール型
の液状エポキシ樹脂、低分子量フェノールノボラックの
グリシジルエーテル、低分子量クレゾールノボラックの
グリシジルエーテルなどのノボラック型の液状エポキシ
樹脂などが例示されるが、本発明はこれらに限定される
ものではない。The epoxy resin used in the present invention is a liquid epoxy resin having two or more epoxy groups in the molecule, and is a liquid epoxy resin of bisphenol type such as diglycidyl ether of bisphenol A and diglycidyl ether of bisphenol F. Examples include epoxy resins, novolak-type liquid epoxy resins such as glycidyl ether of low molecular weight phenol novolac, and glycidyl ether of low molecular weight cresol novolak, but the present invention is not limited thereto.
本発明に使用される無機充填剤は、粒径が１〜５００ミ
クロン、好ましくは１０〜１００ミクロンの球状の無機
充填剤である。The inorganic filler used in the present invention is a spherical inorganic filler with a particle size of 1 to 500 microns, preferably 10 to 100 microns.
無機充填剤の種類は特に限定されないが、アルミナ、溶
融シリカ、結晶シリカなどが例示され、アルミナが特ｉ
ｔ好ましい。これらは□単独もしくは混合糸で使蚕され
るン
無機充填剤の使用量は、組□酸物の全容量に対し、４０
〜６５％が好ましく、より好ましくは４５〜６０％であ
る。充填量が４０容愈％よりも少ないと、線膨張係数の
低減効果が減少する。The type of inorganic filler is not particularly limited, but examples include alumina, fused silica, and crystalline silica, with alumina being particularly preferred.
t preferred. These can be used alone or in mixed yarns. The amount of inorganic filler used is 40
~65% is preferred, more preferably 45-60%. When the filling amount is less than 40% by volume, the effect of reducing the coefficient of linear expansion decreases.
また充填量が６５容量％を越えると、組“酸物の粘度が
高くなり過ぎて、成形加・工が困難となると同時に被封
止体との密着性が低下するなどの欠点が生じる。Furthermore, if the filling amount exceeds 65% by volume, the viscosity of the group of acids becomes too high, resulting in problems such as difficulty in molding and processing, and at the same time, a decrease in adhesion to the object to be sealed.
本発明に使用される硬化剤は、酸無水物が好適に使用で
きる。また、酸無水物とノボラックの混合物も使用でき
”る。酸無水物の具体例としては無水フタル酸、無水マ
レイン酸、ヘキサヒドロ無水フタル酸、テトラヒドロ□
無水フタル酸、メチルへキサヒドロ無水フタル酸、無水
メチルナジック酸、ハイミック酸、メチルテ、トラヒド
ロ無水フタル酸などが例示される。As the curing agent used in the present invention, acid anhydrides can be suitably used. In addition, a mixture of acid anhydride and novolac can also be used. Specific examples of acid anhydride include phthalic anhydride, maleic anhydride, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride.
Examples include phthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hymic acid, methyltetrahydrophthalic anhydride, and trahydrophthalic anhydride.
ノボラックの具体例としては、フェノールノボラック、
オルソクレゾールノボラック、メタクレゾールノボラッ
クなどが例示される。Specific examples of novolak include phenol novolak,
Examples include orthocresol novolak and metacresol novolak.
本発明でのエポキシ樹脂と硬化剤との配合割合は、エポ
キシ樹２１１当量に対して硬化剤を０．４から１．２当
量、好適には０．６から１．０当量の範囲である。硬化
剤が０．４当量未濶の場合は充分に硬化せず、熱変形温
度の低下など硬化物特性が低下する。また、硬化剤を１
．２当量を越えて使用すると、耐湿性が不良となる。In the present invention, the blending ratio of the epoxy resin and the curing agent is in the range of 0.4 to 1.2 equivalents, preferably 0.6 to 1.0 equivalents, based on 211 equivalents of the epoxy resin. If less than 0.4 equivalent of the curing agent is used, the cured product will not be sufficiently cured, and the properties of the cured product will deteriorate, such as a decrease in heat distortion temperature. Also, add 1 curing agent.
．． If more than 2 equivalents are used, moisture resistance will be poor.
本発明の硬化促進剤には、第三級アミンが好適に使用さ
れる。具体例としては、トリー２゜４．６−ジメチルア
ミノメチルフェノール、２−ジメチルアミノメチルフェ
ノール、ピリジン、ベンジルジメチルアミン、トリエタ
ノールアミン、トリエチルアミンピペリジンなどが例示
される。Tertiary amines are preferably used as the curing accelerator of the present invention. Specific examples include tri-24.6-dimethylaminomethylphenol, 2-dimethylaminomethylphenol, pyridine, benzyldimethylamine, triethanolamine, and triethylaminepiperidine.
これらの硬化促進剤の使用量はエポキシ樹脂１００重量
部に対して０．１から８．０重量部、好ましくは０．２
から２．０Ｍ１７１部である。硬化促進剤が０．１重量
部未満では硬化促進効果が乏しい。The amount of these curing accelerators used is 0.1 to 8.0 parts by weight, preferably 0.2 parts by weight, per 100 parts by weight of the epoxy resin.
2.0M171 parts. If the amount of the curing accelerator is less than 0.1 part by weight, the curing accelerating effect is poor.
また８重量部よりも多くなると耐湿性、貯蔵安定性の低
下をもたらし好ましくない。Moreover, if the amount exceeds 8 parts by weight, moisture resistance and storage stability are unfavorably lowered.
本発明の液状エポキシ樹脂組成物には、更に無機充填剤
の表面処理のためカップリング剤、カーボンブラックな
どの着色剤、テトラブロムビスフェノールＡのジグリシ
ジルチーチルなどの難燃付与剤、また必要に応じてカル
ナバワックスなどの離型剤の添加が可能である。カップ
リング剤の具体例としては、γ−グリシドキシプロピル
トリメトキシシラン、β−（８，４エポキシシクロヘキ
シル）蚕チルトリエトキシシランなどが例示される。カ
ップリング剤は、無機充填剤１００重量部に対して通常
０．１から８重量部、好ましくは０．２〜２１ｔ−１１
部の範囲で使用される。カップリング剤は０．１重量部
より少なくても、また８重早部より多くて本耐湿性の低
下をもたらす傾向があり好ましくない。The liquid epoxy resin composition of the present invention further contains a coupling agent for surface treatment of the inorganic filler, a coloring agent such as carbon black, a flame retardant agent such as diglycidyl tetyl of tetrabromobisphenol A, and as necessary. If necessary, a mold release agent such as carnauba wax can be added. Specific examples of the coupling agent include γ-glycidoxypropyltrimethoxysilane and β-(8,4 epoxycyclohexyl)silkworm tiltriethoxysilane. The coupling agent is usually 0.1 to 8 parts by weight, preferably 0.2 to 21 parts by weight, per 100 parts by weight of the inorganic filler.
Used within the scope of the section. Even if the coupling agent is less than 0.1 part by weight, it is not preferable if it is more than 8 parts by weight, as this tends to lower the moisture resistance.
本発明の組成物は、公知の混合装置であるロール混練機
、ニーダ混練機などを用いることによって容易に調整で
きる。The composition of the present invention can be easily prepared by using a known mixing device such as a roll kneader or a kneader kneader.
以下、実施例および比較例をあげて本発明を説明するが
、本発明はこれらに限定されるものではない。The present invention will be explained below with reference to Examples and Comparative Examples, but the present invention is not limited thereto.
実施例１〜４および比較例１〜６
エポキシ樹脂、酸無水物、硬化促進剤、無機充填剤、着
色剤の各成分を第１表に示す割合で配合し、ニーグーを
用いて温度４０”Ｃで１０分間真空混合し液状エポキシ
樹脂組成物を得た。Examples 1 to 4 and Comparative Examples 1 to 6 Epoxy resin, acid anhydride, hardening accelerator, inorganic filler, and colorant were mixed in the proportions shown in Table 1, and heated at 40"C using a Ni-Goo. The mixture was mixed under vacuum for 10 minutes to obtain a liquid epoxy resin composition.
実施例１〜４に記載した無機充填剤は、住友アルミ精錬
株式会社製の平均粒径５０〜６０ミクロンの球状アルミ
ナである。The inorganic filler described in Examples 1 to 4 is spherical alumina manufactured by Sumitomo Aluminum Refining Co., Ltd. and having an average particle size of 50 to 60 microns.
得られた組成物の粘度、硬化物のガラス転移温度、熱膨
張係数、耐クラツク性、耐水性及び塩素イオン濃度を調
べ、えられた結果を第２表に示す。The viscosity of the resulting composition, the glass transition temperature, thermal expansion coefficient, crack resistance, water resistance and chloride ion concentration of the cured product were examined, and the results are shown in Table 2.
流動性については、Ｅ型粘度計を用いて４０℃に於ける
粘度で評価を行った。The fluidity was evaluated by the viscosity at 40° C. using an E-type viscometer.
硬化物の物性は、注型にエポキシ樹脂組成物を注入して
、１００℃、２時間次いて１５０”Ｃ１４時間硬化した
ものについて評価を行った。The physical properties of the cured product were evaluated by injecting the epoxy resin composition into a casting mold and curing it at 100° C. for 2 hours and then at 150”C for 14 hours.
ガラス転移温度と線膨張係数は、５×５×５ｍの大きさ
の注型成形品を熱機械的分析装置（ＴＭＡ ）で測定し
た。The glass transition temperature and coefficient of linear expansion were measured using a thermomechanical analyzer (TMA) for a cast molded product with a size of 5 x 5 x 5 m.
組成物の耐熱性については、ガラス転移温度で評価した
。The heat resistance of the composition was evaluated based on the glass transition temperature.
また、耐クラツク性については、エポキシ樹脂組成物と
半導体構成基材との線膨張係数の差が小さいほうが良好
であるため、エポキシ樹脂組成物の線膨張係数で評価し
た。Furthermore, crack resistance was evaluated based on the linear expansion coefficient of the epoxy resin composition, since it is better if the difference in linear expansion coefficient between the epoxy resin composition and the semiconductor constituent substrate is smaller.
更に、耐クラツク性の評価としてＪＩＳ Ｂ１２５１
（ばね座金）に規定する２号１２５の座金を内径６０■
、深さ２０１１１１１の平底ざらの中心部に静置し、エ
ポキシ樹脂組成物を気泡が含まれないようにして、座金
１約２１＋Ｉ１１の高さまで流し込み注型成形を行い試
験片を作製した。えられた試験片を一５５℃のドライア
イス−エタノール中に３０分間浸漬し、次いで１５０℃
の熱風循環式乾燥器中に８０分間放置した。この操作を
１サイクルとしてクラック発生迄のサイクル数を調べた
。Furthermore, JIS B1251 was used to evaluate crack resistance.
(Spring washer) No. 2 125 washer with an inner diameter of 60mm
, the epoxy resin composition was placed in the center of a flat-bottomed dish with a depth of 2011111 mm, and the epoxy resin composition was poured to a height of approximately 21 + I11 of the washer 1 to prepare a test piece. The obtained test piece was immersed in dry ice-ethanol at -55°C for 30 minutes, and then heated at 150°C.
The sample was left in a hot air circulation type dryer for 80 minutes. This operation was regarded as one cycle, and the number of cycles until cracking occurred was investigated.
耐水性は、ＪＩＳ Ｋ６９１１の５．２６に基づき試験
片をＰ ＣＴ （Ｐｒｅｓｓｕｒｅ Ｃｏｏｋｅｒ Ｔ
ｅ５ｔ ）１２１℃、２気圧の条件で吸水率（％）を調
べた。Water resistance was determined by measuring the test piece with PCT (Pressure Cooker T) based on 5.26 of JIS K6911.
e5t) The water absorption rate (%) was examined under the conditions of 121°C and 2 atm.
成形品のイオン性不純物は、５Ｘ５Ｘ８０諺の注型成形
品と蒸留水２５−をテフロン製気密セル（内径５６ｍ、
高さ４０■）に調整し、１６０℃の熱風循環式乾燥器中
に２０時間放置し、処理後、抽出液をイオンクロマトグ
ラフィー（横河北辰電気製）で塩素イオン濃度の測定を
行った。Ionic impurities in the molded product can be removed by pouring the 5X5X80 cast molded product and distilled water into a Teflon airtight cell (inner diameter 56m,
The extract was adjusted to a height of 40 cm) and left in a hot air circulation dryer at 160° C. for 20 hours. After treatment, the extract was subjected to ion chromatography (manufactured by Yokogawa Hokushin Electric Co., Ltd.) to measure the chloride ion concentration.
第２表より、明らかなように、本発明による半導体封止
用液体エポキシ樹脂組成物は、充てん剤が同一容積量で
みて粘度が大巾に低く加工性にも優れている。As is clear from Table 2, the liquid epoxy resin composition for semiconductor encapsulation according to the present invention has a significantly lower viscosity and excellent processability, considering the same volume of filler.
比較例６に示す様に、無定形の溶融シリカを容積分率で
５５％のものは流動性がなく成形加工出来ない。As shown in Comparative Example 6, amorphous fused silica with a volume fraction of 55% has no fluidity and cannot be molded.
また、粘度が大巾に低い為、充てん剤量を多く添加する
ことが可能であり線膨張係数が小さくなり、耐クラツク
性に優れる。In addition, since the viscosity is extremely low, it is possible to add a large amount of filler, the linear expansion coefficient is small, and the crack resistance is excellent.
更に、無機光てん剤が増量されることで相対的にエポキ
シ樹脂が減量されるためにエポキシ樹脂に含まれるイオ
ン性不純物、特に塩素イオンが少い。Furthermore, since the amount of the epoxy resin is relatively reduced by increasing the amount of the inorganic photonic agent, the amount of ionic impurities, especially chlorine ions, contained in the epoxy resin is reduced.
同様に、吸水率も小さくなっており、半導体素子の液吠
封止用樹脂組成物としてきわめて有用であることがわか
る。Similarly, the water absorption rate is also low, and it can be seen that it is extremely useful as a resin composition for sealing semiconductor devices.
Claims (2)
キシ樹脂、球状の無機充填剤、硬化剤および硬化促進剤
を含有してなる液状エポキシ樹脂組成物。(1) A liquid epoxy resin composition comprising a liquid epoxy resin having two or more epoxy groups in the molecule, a spherical inorganic filler, a curing agent, and a curing accelerator.
項記載の液状エポキシ樹脂組成物。(2) Claim 1 in which the inorganic filler is alumina
The liquid epoxy resin composition described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14015684A JPS6119620A (en) | 1984-07-05 | 1984-07-05 | Liquid epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14015684A JPS6119620A (en) | 1984-07-05 | 1984-07-05 | Liquid epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6119620A true JPS6119620A (en) | 1986-01-28 |
Family
ID=15262169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14015684A Pending JPS6119620A (en) | 1984-07-05 | 1984-07-05 | Liquid epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6119620A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296020A (en) * | 1985-06-26 | 1986-12-26 | Toshiba Corp | Epoxy resin liquid composition for sealing electronic part |
| JPS62240313A (en) * | 1986-04-09 | 1987-10-21 | Mitsubishi Electric Corp | Resin for use in semiconductor sealing |
| JPS63157445A (en) * | 1986-12-22 | 1988-06-30 | Fuji Electric Co Ltd | Resin mold type high-voltage silicon diode |
| JPH05222270A (en) * | 1992-02-07 | 1993-08-31 | Shin Etsu Chem Co Ltd | Fluid epoxy resin composition and its cured material |
| US7067930B2 (en) * | 2000-11-17 | 2006-06-27 | Shin-Etsu Chemical Co., Ltd. | Liquid epoxy resin composition and semiconductor device |
| JP2008149813A (en) * | 2006-12-15 | 2008-07-03 | Honda Motor Co Ltd | Power unit for vehicle |
| CN102329589A (en) * | 2011-09-06 | 2012-01-25 | 蚌埠市立群电子有限公司 | Anti-molten metal adhesive and preparation method thereof |
| JP2014152314A (en) * | 2013-02-13 | 2014-08-25 | Namics Corp | Liquid mold agent, and method for producing liquid mold agent |
-
1984
- 1984-07-05 JP JP14015684A patent/JPS6119620A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296020A (en) * | 1985-06-26 | 1986-12-26 | Toshiba Corp | Epoxy resin liquid composition for sealing electronic part |
| JPS62240313A (en) * | 1986-04-09 | 1987-10-21 | Mitsubishi Electric Corp | Resin for use in semiconductor sealing |
| JPS63157445A (en) * | 1986-12-22 | 1988-06-30 | Fuji Electric Co Ltd | Resin mold type high-voltage silicon diode |
| JPH05222270A (en) * | 1992-02-07 | 1993-08-31 | Shin Etsu Chem Co Ltd | Fluid epoxy resin composition and its cured material |
| US7067930B2 (en) * | 2000-11-17 | 2006-06-27 | Shin-Etsu Chemical Co., Ltd. | Liquid epoxy resin composition and semiconductor device |
| JP2008149813A (en) * | 2006-12-15 | 2008-07-03 | Honda Motor Co Ltd | Power unit for vehicle |
| CN102329589A (en) * | 2011-09-06 | 2012-01-25 | 蚌埠市立群电子有限公司 | Anti-molten metal adhesive and preparation method thereof |
| JP2014152314A (en) * | 2013-02-13 | 2014-08-25 | Namics Corp | Liquid mold agent, and method for producing liquid mold agent |
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