JPS61192476U - - Google Patents
Info
- Publication number
- JPS61192476U JPS61192476U JP7496085U JP7496085U JPS61192476U JP S61192476 U JPS61192476 U JP S61192476U JP 7496085 U JP7496085 U JP 7496085U JP 7496085 U JP7496085 U JP 7496085U JP S61192476 U JPS61192476 U JP S61192476U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- flexible printed
- conductor
- soldering
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第2〜4図は従来例を示し、第2図イはリジツ
ドプリント板4に取付けたフレキシブルプリント
板と相手のフレキシブルプリント板とをはんだ付
けによつて接続する状態を示す図、同図ロはその
はんだ付け後の状態を示す図、第3図イはフレキ
シブルプリント板とリジツドプリント板とをはん
だ付けによつて接続する状態を示す図、同図ロは
そのはんだ付け後の状態を示す図、第4図はフレ
キシブルプリント板同士を電気はんだこてによつ
てはんだ付けする状態を示す図、第1図イ,ロは
本考案のフレキシブルプリント板の実施例を示す
図、第5図は本考案のフレキシブルプリント板と
リジツトプリント板に取付けた他フレキシブルプ
リント板とをはんだ付け接続した状態を示す図で
ある。
1,1′:フレキシブルプリント板、2,5:
プリント板上の導体、3,6:プリント板の導体
接続部、4:リジツドプリント板、7:はんだ付
け接続後の相手導体接続部と重ならない露出部、
8:絶縁層、9:導体接続部に設けた貫通孔、1
0:ソルダーレジスト膜、11:はんだめつき膜
、12:印刷後のはんだペースト、13:細い棒
状はんだ、14:溶融後のはんだ、21:熱圧着
機加熱部、22:電気はんだこて。
2 to 4 show conventional examples, and FIG. Figure 3 shows the state after soldering, Figure 3 A shows the state in which a flexible printed board and a rigid printed board are connected by soldering, and Figure 3 B shows the state after soldering. Figure 4 shows how flexible printed boards are soldered together using an electric soldering iron, Figures 1A and 2B show an embodiment of the flexible printed board of the present invention, and Figure 5 shows how flexible printed boards are soldered together using an electric soldering iron. FIG. 2 is a diagram showing a state in which the flexible printed board of the present invention and another flexible printed board attached to a rigid printed board are connected by soldering. 1, 1': Flexible printed board, 2, 5:
Conductor on printed board, 3, 6: Conductor connection part of printed board, 4: Rigid printed board, 7: Exposed part that does not overlap with the mating conductor connection part after soldering connection,
8: Insulating layer, 9: Through hole provided in conductor connection part, 1
0: Solder resist film, 11: Solder plating film, 12: Solder paste after printing, 13: Thin rod-shaped solder, 14: Solder after melting, 21: Heating section of thermocompression bonding machine, 22: Electric soldering iron.
Claims (1)
ブルプリント板の導体の接続、またはフレキシブ
ルプリント板の導体とリジツドプリント板の導体
の接続を、双方のプリント板の導体にあらかじめ
付着させたはんだを加熱溶融することにより、所
要の接続箇所をはんだ付け接続するフレキシブル
プリント板において、上側に位置する前記フレキ
シブルプリント板の前記導体接続部に貫通孔を設
けたことを特徴とするフレキシブルプリント板。 To connect a conductor of a flexible printed board to a conductor of another flexible printed board, or to connect a conductor of a flexible printed board to a conductor of a rigid printed board, heat and melt the solder that has been previously attached to the conductors of both printed boards. A flexible printed board in which required connection points are connected by soldering, characterized in that a through hole is provided in the conductor connection portion of the flexible printed board located on the upper side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7496085U JPS61192476U (en) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7496085U JPS61192476U (en) | 1985-05-22 | 1985-05-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61192476U true JPS61192476U (en) | 1986-11-29 |
Family
ID=30615735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7496085U Pending JPS61192476U (en) | 1985-05-22 | 1985-05-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61192476U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63149565U (en) * | 1987-03-23 | 1988-10-03 | ||
JP2014090155A (en) * | 2012-10-30 | 2014-05-15 | Samsung Sdi Co Ltd | Battery pack, circuit board and coupling method for circuit boards |
JPWO2016203774A1 (en) * | 2015-06-19 | 2017-10-12 | 日本電信電話株式会社 | Solder joint structure of flexible printed circuit board |
JP2019033160A (en) * | 2017-08-07 | 2019-02-28 | 株式会社小糸製作所 | Circuit board and lighting fixture for vehicle |
-
1985
- 1985-05-22 JP JP7496085U patent/JPS61192476U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63149565U (en) * | 1987-03-23 | 1988-10-03 | ||
JP2014090155A (en) * | 2012-10-30 | 2014-05-15 | Samsung Sdi Co Ltd | Battery pack, circuit board and coupling method for circuit boards |
JPWO2016203774A1 (en) * | 2015-06-19 | 2017-10-12 | 日本電信電話株式会社 | Solder joint structure of flexible printed circuit board |
JP2019033160A (en) * | 2017-08-07 | 2019-02-28 | 株式会社小糸製作所 | Circuit board and lighting fixture for vehicle |
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