JPS611837U

JPS611837U - Chip type electronic components

Info

Publication number: JPS611837U
Application number: JP8710884U
Authority: JP
Inventors: 義正北島
Original assignee: 日本電気株式会社
Priority date: 1984-06-12
Filing date: 1984-06-12
Publication date: 1986-01-08

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１［ｆｆｌａ，ｂは従来のチップ型固体電解コンデン
サンサの断面図および斜視図。第２図は本考案のチップ型固体電解コンデンサの端子部
と素子の位置関係を示す斜視図。第３図ａ，ｂは本考案のチップ型固体電解コンデンサ
の断面図および斜視図。１・・・陽極体、２・・・リード線、３・・・陰極層、
４・・・陽極端子、５・・・陰極端子、４ａ，４ｂ，５
ａ，５ｂ・・・陽陰極端子の表裏、７・・・絶縁外装部
、８・・・導電性ペースト、９・・・コンデンサ、１０
・・・コンデンサ素子。The first [ffla,b is a cross-sectional view and a perspective view of a conventional chip-type solid electrolytic capacitor. FIG. 2 is a perspective view showing the positional relationship between the terminal portion and the element of the chip type solid electrolytic capacitor of the present invention. FIGS. 3a and 3b are a cross-sectional view and a perspective view of the chip-type solid electrolytic capacitor of the present invention. 1... Anode body, 2... Lead wire, 3... Cathode layer,
4... Anode terminal, 5... Cathode terminal, 4a, 4b, 5
a, 5b... Front and back of anode and cathode terminals, 7... Insulating exterior part, 8... Conductive paste, 9... Capacitor, 10
...Capacitor element.

Claims

【実用新案登録請求の範囲】[Scope of utility model registration request]

（１）一方の面に導電層を施した平板状またはアングル
状の導電材の一対を互いに対向するように配置して構成
した電極端子の間に電子部品素子が配置され、前記電極
端子の導電層の面側か前記電子部品素子と電極端子の接
合しない面に位置して配置され、かつ前記一対の電極端
子間を絶縁性樹脂で封止することを特徴とするチップ型
電子部品。(1) An electronic component element is placed between electrode terminals configured by arranging a pair of flat or angled conductive materials facing each other with a conductive layer on one surface, and the conductive material of the electrode terminal is A chip-type electronic component, characterized in that the chip-type electronic component is disposed on a surface side of a layer or a surface where the electronic component element and the electrode terminal are not bonded, and the gap between the pair of electrode terminals is sealed with an insulating resin.

（２）前記電子部品素子が固体電解コンデンサであこと
を特徴とする実用新案登録請求の範囲第１項記載のチッ
プ型電子部品。(2) The chip-type electronic component according to claim 1, wherein the electronic component element is a solid electrolytic capacitor.

（３）前記導電層がはんだ又は錫メッキ層であり、その
厚さが１．５〜６μｍの範囲であることを特徴とする実
用新案登録請求の範囲第１項記載のチップ型電子部品。(3) The chip-type electronic component according to claim 1, wherein the conductive layer is a solder or tin-plated layer and has a thickness in the range of 1.5 to 6 μm.

（４）前記はんだ又は錫メッキ層の下地もしくは反対面
に銅またはニッケル層を施したことを特徴とする実用新
案登録請求の範囲第３項記載のチップ型電子部品。(4) The chip-type electronic component according to claim 3, which is a registered utility model, characterized in that a copper or nickel layer is provided on the base or opposite surface of the solder or tin plating layer.