JPS61180464A - Heat sink - Google Patents
Heat sinkInfo
- Publication number
- JPS61180464A JPS61180464A JP2150685A JP2150685A JPS61180464A JP S61180464 A JPS61180464 A JP S61180464A JP 2150685 A JP2150685 A JP 2150685A JP 2150685 A JP2150685 A JP 2150685A JP S61180464 A JPS61180464 A JP S61180464A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- lead
- circuit board
- type diode
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、０ＡＴ１１器用スイツチングレギユレータ等
に使用されるリードタイプ形ダイオードの熱を放熱する
放熱板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a heat sink for dissipating heat from a lead type diode used in an 0AT11 switching regulator or the like.
従来の技術
第５図〜第６図に、リードタイプダイオードを従来の放
熱板に取り付け、プリント基板に実装、固定する場合の
例を示す。すなわち、リードタイプダイオード４のリー
ド部１を従来の放熱板２にあらかじめ熱的及び電気的に
ハンダ付けしておき、プリント基板３に実装して、リー
ドタイプダイオード４及び放熱板２をハンダデツプによ
ってプリント基板３に固定している。リードタイプダイ
オード４より発熱する熱は、このリードタイプダイオー
ド４のリード部１を前述のようにあらかじめ放熱板２に
ハンダ付けすることによって、この放熱板２に伝導して
いる。BACKGROUND ART FIGS. 5 and 6 show an example of a case where a lead type diode is attached to a conventional heat sink and mounted and fixed on a printed circuit board. That is, the lead part 1 of the lead type diode 4 is thermally and electrically soldered to the conventional heat sink 2 in advance, mounted on the printed circuit board 3, and the lead type diode 4 and the heat sink 2 are printed with solder depth. It is fixed to the board 3. Heat generated by the lead type diode 4 is conducted to the heat sink 2 by soldering the lead portion 1 of the lead type diode 4 to the heat sink 2 in advance as described above.
発明が解決しようとする問題点
ところが、リードタイプダイオード４を従来の放熱板に
取り付け、プリント基板に実装固定する場合は、リード
タイプダイオード４のリード部１を放熱板２に電気的及
び熱的にハンダ付けする作業と、放熱板２及びリードタ
イプダイオード４をハンダディップによってプリント基
板３に固定する作業との２回の作業が必要となってくる
という問題がある。Problems to be Solved by the Invention However, when the lead type diode 4 is attached to a conventional heat sink and mounted and fixed on a printed circuit board, the lead portion 1 of the lead type diode 4 is electrically and thermally attached to the heat sink 2. There is a problem in that two operations are required: soldering and fixing the heat sink 2 and lead type diode 4 to the printed circuit board 3 by soldering dip.
そこで本発明はこのような問題点を解消し、ハンダ付け
作業回数の低減化を図ることを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to solve these problems and reduce the number of soldering operations.
問題点を解決するための手段
Ｆ２目的を達成するため本発明の放熱板は、放熱板本体
に、プリント基板へ挿入可能であるとともにリードタイ
プダイオードのリード部が挿入可能で、かつ前記プリン
ト基板のディップハンダ付け時に、前記プリント基板へ
のハンダ付け及び前記リード部とのハンダ付けが同時に
行なわれる円筒状の端子部を形成したものである。Means for Solving Problems F2 In order to achieve the object, the heat sink of the present invention is capable of being inserted into a printed circuit board and a lead portion of a lead type diode is inserted into the heat sink main body, and the heat sink of the present invention is capable of inserting a lead portion of a lead type diode into the main body of the heat sink. A cylindrical terminal portion is formed in which soldering to the printed circuit board and soldering to the lead portion are performed simultaneously during dip soldering.
作用
このようなものであると、リードタイプダイオードを放
熱板と電気的及び熱的に接続し、かつこれらリードタイ
プダイオードおよ放熱板をプリント基板に実装固定する
工程が、１回のハンダディップ作業によって実現できる
。Function: With such a device, the process of electrically and thermally connecting the lead type diode to the heat sink and mounting and fixing the lead type diode and heat sink to the printed circuit board is a single soldering dip operation. This can be achieved by
実施例
第１図に本発明の放熱板の一実施例の斜視図を示す。放
熱板本体６には円筒状の端子部５が加工されており、リ
ードタイプダイオードのリード部分が挿入されるように
なっている。この円筒状の端子部５は、図示のように放
熱板本体６と一体加工してもよいし、または、別に円筒
状の端子部を作り放熱板本体６に溶接等で接着すること
によっても実現できる。Embodiment FIG. 1 shows a perspective view of an embodiment of the heat sink of the present invention. A cylindrical terminal portion 5 is machined into the heat sink body 6, into which a lead portion of a lead type diode is inserted. This cylindrical terminal portion 5 may be formed integrally with the heat sink body 6 as shown in the figure, or it may be realized by making a separate cylindrical terminal portion and bonding it to the heat sink body 6 by welding or the like. can.
第２図〜第３図は、リードタイプダイオード４を本発明
の放熱板に縦向きに取り付け、プリント基板３に実装固
定した例を示す。ここでリードタイプダイオード４のリ
ード部１は放熱板２の端子部５に挿入され、プリント基
板３に実装される。2 and 3 show an example in which a lead type diode 4 is vertically attached to the heat sink of the present invention and mounted and fixed on a printed circuit board 3. Here, the lead portion 1 of the lead type diode 4 is inserted into the terminal portion 5 of the heat sink 2 and mounted on the printed circuit board 3.
７はプリント基板３に挿入される方のリード部である。7 is a lead portion inserted into the printed circuit board 3.
このような構成であると、プリント基板３がハンダディ
ップされるときに端子部５にもハンダが吸い上げられ、
リードタイプダイオード４及び放熱板２のプリント基板
３へのハンダ付けと同時に、リードタイプダイオード４
と放熱板２とのハンダ付けが行なわれる。With such a configuration, when the printed circuit board 3 is soldered dipped, the solder is also sucked up into the terminal portion 5,
At the same time as soldering the lead type diode 4 and the heat sink 2 to the printed circuit board 3, the lead type diode 4
and the heat sink plate 2 are soldered together.
第４図は本発明の放熱板２にリードタイプダイオード４
を横向きに取り付けた場合の例を示す。Figure 4 shows a lead type diode 4 on the heat sink 2 of the present invention.
An example is shown when the is installed horizontally.
このようなものであると、第２図〜第３図のようにリー
ドタイプダイオード４を縦向きに取り付けた場合と比較
して、す＼−ド部７を短くできる利点がある。This arrangement has the advantage that the wire portion 7 can be made shorter than the case where the lead type diode 4 is mounted vertically as shown in FIGS. 2 and 3.
発明の効果
以上述べたように本発明によると、１回のハンダディッ
プ作業だけで、リードタイプダイオード及び放熱板のプ
リント基板へのハンダ付けのみならず、リードタイプダ
イオードと放熱板とのハンダ付けを行なうことができる
ため、従来に比ベハンダ付け作業回数を半減でき、その
作業性を良好なものとすることができる。Effects of the Invention As described above, according to the present invention, not only a lead type diode and a heat sink can be soldered to a printed circuit board, but also a lead type diode and a heat sink can be soldered with just one solder dipping operation. Therefore, the number of soldering operations can be halved compared to conventional methods, and the workability can be improved.
第１図は本発明の放熱板の一実施例の斜視図、第２図は
本発明の放熱板にリードタイプダイオードを縦向きに取
り付けてプリント基板に実装した状態の正面視の斜視図
、第３図はその側面図、第４図は本発明の放熱板にリー
ドタイプダイオードを横向ぎに取り付けてプリント基板
に実装した状態の側面図、第５図は従来の放熱板にリー
ドタイプダイオードを取り付けてプリント基板に実装し
た状態の正面視の斜視図、第６図はその側面図である。FIG. 1 is a perspective view of an embodiment of the heat sink of the present invention, FIG. 2 is a front perspective view of the heat sink of the present invention with lead type diodes attached vertically and mounted on a printed circuit board, and FIG. Figure 3 is a side view of the same, Figure 4 is a side view of a heat sink of the present invention with a lead type diode attached horizontally and mounted on a printed circuit board, and Figure 5 is a conventional heat sink with a lead type diode attached to it. FIG. 6 is a front perspective view of the device mounted on a printed circuit board, and FIG. 6 is a side view thereof.
Claims (1)
もにリードタイプダイオードのリード部が挿入可能で、
かつ前記プリント基板のディップハンダ付け時に、前記
プリント基板へのハンダ付け及び前記リード部とのハン
ダ付けが同時に行なわれる円筒状の端子部を形成したこ
とを特徴とする放熱板。1. The heat sink body can be inserted into a printed circuit board and the lead part of a lead type diode can be inserted.
A heat dissipation plate characterized in that a cylindrical terminal portion is formed in which soldering to the printed circuit board and soldering to the lead portion are simultaneously performed during dip soldering of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2150685A JPS61180464A (en) | 1985-02-05 | 1985-02-05 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2150685A JPS61180464A (en) | 1985-02-05 | 1985-02-05 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61180464A true JPS61180464A (en) | 1986-08-13 |
Family
ID=12056848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2150685A Pending JPS61180464A (en) | 1985-02-05 | 1985-02-05 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61180464A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0263595U (en) * | 1988-10-31 | 1990-05-11 | ||
| JP2008502114A (en) * | 2004-06-09 | 2008-01-24 | ファイゲル アンドレアス | Press-fit contact and method of manufacturing the press-fit contact |
| JP2008130757A (en) * | 2006-11-20 | 2008-06-05 | Daikin Ind Ltd | Electrical circuit device |
-
1985
- 1985-02-05 JP JP2150685A patent/JPS61180464A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0263595U (en) * | 1988-10-31 | 1990-05-11 | ||
| JP2008502114A (en) * | 2004-06-09 | 2008-01-24 | ファイゲル アンドレアス | Press-fit contact and method of manufacturing the press-fit contact |
| JP2008130757A (en) * | 2006-11-20 | 2008-06-05 | Daikin Ind Ltd | Electrical circuit device |
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