JPS61174700A - Electronic apparatus - Google Patents
Electronic apparatusInfo
- Publication number
- JPS61174700A JPS61174700A JP1470485A JP1470485A JPS61174700A JP S61174700 A JPS61174700 A JP S61174700A JP 1470485 A JP1470485 A JP 1470485A JP 1470485 A JP1470485 A JP 1470485A JP S61174700 A JPS61174700 A JP S61174700A
- Authority
- JP
- Japan
- Prior art keywords
- shield
- window
- shielding
- housing
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器の冷却通風窓部に簡易な手段で効率の
良い電磁波シールドを形成する手段に係る電子装置に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic device that uses simple means to form an efficient electromagnetic shield in a cooling ventilation window of an electronic device.
近時、電子機器はＩＣ（ビ技術の進展により小形・軽量
化が進み、更にデジタル駆動による制御方式が各分野に
導入されつつある。これに伴い、電子機器の信頼性を確
保する上から例えば商用電源から入来するノイズ遮断、
あるいは外部空間に輻射する本発明に係る電磁波ＥＭＩ
（Ｅｌｅｃｔｒｏ ＭａｇｎｅｔｉｃＩｎｔｅｒｆｅ
ｒｅｎｃｅ ）の遮蔽が極めて重要な課題となっている
。尚、アメリカＦＣＣ（米連邦委員会）及び欧州諸国で
は電磁波障害に対する規制の実施。In recent years, electronic devices have become smaller and lighter due to advances in IC (IC) technology, and digitally driven control systems are being introduced in various fields. Blocking noise coming from commercial power supply,
Or electromagnetic wave EMI according to the present invention radiated to external space
(Electro Magnetic Interfe
The shielding of radio waves (rence) has become an extremely important issue. Furthermore, the US FCC (US Federal Commission) and European countries have implemented regulations regarding electromagnetic interference.
強化が叫ばれている。これに伴い国内からの電子機器の
輸出にはこれに対応して該シールドの設置は不可欠の事
項である。Strengthening is being called for. Accordingly, it is essential to install such shields when exporting electronic equipment from Japan.
〔従来の技術と発明が解決しようとする問題点〕従来、
入出力装置として例えば瞬間的な衝撃運動で印字を行う
ドツトインパクト式印字プリンタにおいては、前記のＥ
ＭＩシールド対策と、装置自体からの衝撃動作騒音に対
する遮音対策も要請されている。[Problems to be solved by conventional technology and invention] Conventionally,
For example, in a dot impact type printer that prints by instantaneous impact motion as an input/output device, the above-mentioned E
Measures for MI shielding and sound insulation against impact noise from the equipment itself are also required.
前者のＥ旧シールド（遮蔽）対策には９表面導体化処理
もしくはフィラー分散になる導体化プラスチック筺体を
採用するとか更に機器筺体の冷却用通風窓には金属メツ
シュを設ける等しているが。Measures against the former E-shield include adopting a conductorized plastic casing with 9 surface conductor treatment or dispersing filler, and installing metal mesh in the cooling ventilation window of the equipment casing.
前記のＥ旧シールド規制にたいして充分な対策となりえ
ないと云う問題がある。There is a problem in that it is not a sufficient countermeasure against the E old shield regulation mentioned above.
他方、後者の防音対策については装置筺体の内側に発泡
性ウレタン樹脂体を貼着等しているが。On the other hand, as for the latter soundproofing measure, a foamable urethane resin body is pasted on the inside of the device housing.
装置通風用冷却窓の遮音が不充分であり問題がある。There is a problem because the sound insulation of the cooling window for ventilation of the equipment is insufficient.
前記の問題点は、装置筺体の通風冷却用窓部に金属メッ
キした発泡樹脂体が装着されて少なくとも防音シールド
と一体的構成とされた電磁波シールドが形成された本発
明による電子装置として解決することが出来る。The above problem can be solved by an electronic device according to the present invention, in which a metal-plated foamed resin body is attached to the ventilation cooling window of the device housing to form an electromagnetic shield that is integrated with at least a soundproof shield. I can do it.
本発明の発泡成形になる樹脂体９例えばモルトプレーン
等が備える吸音機能と該モルトプレーンを金属メッキ手
段により導体化処理したものは。The resin body 9 to be foam-molded according to the present invention has a sound absorbing function, for example, Moltoplane, and is made into a conductor by metal plating means.
吸音機能と同時に電磁波シールド機能かえられることか
ら、これを電子装置に適用すれば、係る電子装置の防音
ならびに電磁波シールド効果が取得されることになる。Since the electromagnetic wave shielding function can be changed at the same time as the sound absorption function, if this is applied to an electronic device, soundproofing and electromagnetic wave shielding effects can be obtained for the electronic device.
金属メッキにより導体化されたモルトプレーンの通気性
は、メッキ前と何等かわらず、従ってこれを例えばプリ
ンタ装置筺体の通風窓に装着すれば、ＥＭＩシールドと
防音シールドの両者機能が簡易な構成で実現される。The breathability of Moltoprane, which has been made into a conductor by metal plating, is no different from that before plating. Therefore, by attaching it to the ventilation window of a printer housing, for example, it can achieve both EMI shielding and soundproof shielding functions with a simple configuration. be done.
以下示す実施例図は、騒音ならびに電磁波シールドが要
請されるドツトプリンタ装置を例示して本発明の詳細な
説明する。The embodiment diagrams shown below will explain the present invention in detail by exemplifying a dot printer device that requires noise and electromagnetic shielding.
第１図はプリンタ装置筺体構成を示す斜視図。FIG. 1 is a perspective view showing the configuration of a printer device housing.
また第２図は第１図中、筺体の通風窓部Ａの拡大斜視図
である。Moreover, FIG. 2 is an enlarged perspective view of the ventilation window portion A of the housing in FIG. 1.
第１図斜視図において、プラスチックモールド成形され
た筺体１はその内面２には導電性塗料が被着される。又
、プラスチック筺体ｌの４個所の通風冷却用窓３部には
、従来貼着の金属メツシュにかわって例えばポリウレタ
ン樹脂の発泡成形体。In the perspective view of FIG. 1, a plastic molded housing 1 has an inner surface 2 coated with a conductive paint. In addition, the three ventilation cooling windows in the four locations of the plastic casing 1 are made of foamed moldings of polyurethane resin, for example, instead of the conventionally pasted metal mesh.
所謂モルトプレーンと呼ばれる平板状の発泡体を導体化
する金属メッキしたプレーンを導電性接着剤や両面粘着
テープにより貼着して、Ｅｌ’ｌＩシールド４が形成さ
れる。 −
前記筺体内面に貼合されたＥＭＩシールド４は第２図の
窓部Ａの拡大斜視図に明示される。The El'lI shield 4 is formed by attaching a metal-plated plane, which is a so-called moltoplane, which is a flat foam and is made into a conductor, using a conductive adhesive or double-sided adhesive tape. - The EMI shield 4 bonded to the inner surface of the housing is clearly shown in the enlarged perspective view of window A in FIG.
発泡樹脂体は、メッキ前処理として感受性化処理（セン
シタイジング）並びに活性化のための有機溶媒処理をな
した後、無電解銅メッキまたは無電解ニッケルメッキに
よりメッキ導体化発泡成形体４が形成される。The foamed resin body is subjected to sensitizing treatment (sensitizing) as a pre-plating treatment and organic solvent treatment for activation, and then a plated conductive foam molded body 4 is formed by electroless copper plating or electroless nickel plating. be done.
析出の例えばニッケル金属メッキ膜は、少なくとも０．
４μｍ程度を被着すればプレーン全面に連続的導電性か
えられる。また０、４μｍの膜厚からは膜厚に比例して
、ＥＭＩシールド効果が増加する。For example, the deposited nickel metal plating film has a thickness of at least 0.
By depositing a layer of about 4 μm, continuous conductivity can be achieved over the entire surface of the plane. Further, from a film thickness of 0.4 μm, the EMI shielding effect increases in proportion to the film thickness.
このため被着ニッケル膜厚を１例えば１μｍ被着すれば
実用的に充分である。併し、［！ＭＩシールドは発泡樹
脂体素材の厚さによりシールド層としての機能が大幅に
変ること云うまでもない。For this reason, it is practically sufficient to deposit the nickel film with a thickness of 1 μm, for example. However, [! Needless to say, the function of the MI shield as a shield layer varies greatly depending on the thickness of the foamed resin material.
前記ニッケルメッキ膜厚１μｍが被着された厘さ１０ｍ
ｍの発泡成形体４が貼着された窓部３をＥＭＩシールド
窓としこれと従来金属メツシュの筺体窓とについて、シ
ールドルーム内でプリンタ内部からの電磁波輻射強度の
比較実験したところ相対的に１０ｄＢ減のシールド効果
が確認されている。The thickness of the nickel plating film of 1 μm is 10 m.
The window 3 to which the foamed molded body 4 of 1.5 m was attached was used as an EMI shield window, and an experiment was conducted to compare the electromagnetic radiation intensity from inside the printer in a shield room between this and a conventional metal mesh housing window, and the result was a relative 10 dB. It has been confirmed that the shielding effect is reduced.
他方、プリンタ装置の動作騒音について、騒音針及びス
ペクトルアナライザを用い計測したところ厚さ１０ｍｍ
の発泡樹脂体装着になる窓部の音響吸収エネルギは２０
ｄＢ程度であることが確認された。On the other hand, the operational noise of the printer device was measured using a noise needle and a spectrum analyzer, and the thickness was 10 mm.
The acoustic absorption energy of the window section fitted with a foamed resin body is 20
It was confirmed that it was about dB.
前記実施例から明らかなように金属メッキを施した発泡
成形体によれば、電磁波シールドが極めて容易に実現さ
れ、併せて防音シールドも可能となる。かかる観点から
本発明のシールド機能を入出力装置として例えばドツト
インパクト式印字プリンタ等の電子装置に適用すればそ
の実用的価値は大きいものがある。As is clear from the above embodiments, by using a metal-plated foam molded product, electromagnetic shielding can be achieved very easily, and soundproof shielding can also be achieved. From this point of view, if the shielding function of the present invention is applied to an electronic device such as a dot impact type printer as an input/output device, it will have great practical value.
第１図はプリンタ装置の筺体構成斜視図。 第２図は第１図筺体の通風窓部Ａの拡大斜視図である。 図中、ｌは装置筺体、 ３は通風冷却窓。 及び４は金属メッキ発泡樹脂体である。 FIG. 1 is a perspective view of the housing configuration of the printer device. FIG. 2 is an enlarged perspective view of the ventilation window A of the housing shown in FIG. In the figure, l is the device housing, and 3 is the ventilation cooling window. and 4 are metal-plated foamed resin bodies.
Claims (1)
属メッキされた発泡樹脂体からなる電磁波シールド層が
形成されてなることを特徴とする電子装置。An electronic device characterized in that an electromagnetic wave shielding layer made of a metal-plated foamed resin material, which also serves as a soundproof shield, is formed on a cooling ventilation window of a device housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1470485A JPS61174700A (en) | 1985-01-29 | 1985-01-29 | Electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1470485A JPS61174700A (en) | 1985-01-29 | 1985-01-29 | Electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61174700A true JPS61174700A (en) | 1986-08-06 |
Family
ID=11868561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1470485A Pending JPS61174700A (en) | 1985-01-29 | 1985-01-29 | Electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61174700A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5904978A (en) * | 1995-12-15 | 1999-05-18 | W. L. Gore & Associates, Inc. | Electrically conductive polytetrafluoroethylene article |
| US5945217A (en) * | 1997-10-14 | 1999-08-31 | Gore Enterprise Holdings, Inc. | Thermally conductive polytrafluoroethylene article |
| US6210789B1 (en) | 1997-02-20 | 2001-04-03 | W. L. Gore & Associates, Inc. | Electrically conductive composite article |
| US6255581B1 (en) | 1998-03-31 | 2001-07-03 | Gore Enterprise Holdings, Inc. | Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace |
| US6309742B1 (en) | 2000-01-28 | 2001-10-30 | Gore Enterprise Holdings, Inc. | EMI/RFI shielding gasket |
-
1985
- 1985-01-29 JP JP1470485A patent/JPS61174700A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5904978A (en) * | 1995-12-15 | 1999-05-18 | W. L. Gore & Associates, Inc. | Electrically conductive polytetrafluoroethylene article |
| US6210789B1 (en) | 1997-02-20 | 2001-04-03 | W. L. Gore & Associates, Inc. | Electrically conductive composite article |
| US5945217A (en) * | 1997-10-14 | 1999-08-31 | Gore Enterprise Holdings, Inc. | Thermally conductive polytrafluoroethylene article |
| US6255581B1 (en) | 1998-03-31 | 2001-07-03 | Gore Enterprise Holdings, Inc. | Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace |
| US6309742B1 (en) | 2000-01-28 | 2001-10-30 | Gore Enterprise Holdings, Inc. | EMI/RFI shielding gasket |
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