JPS6116677Y2 - - Google Patents
Info
- Publication number
- JPS6116677Y2 JPS6116677Y2 JP1976169465U JP16946576U JPS6116677Y2 JP S6116677 Y2 JPS6116677 Y2 JP S6116677Y2 JP 1976169465 U JP1976169465 U JP 1976169465U JP 16946576 U JP16946576 U JP 16946576U JP S6116677 Y2 JPS6116677 Y2 JP S6116677Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- mounting
- shield case
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 238000005476 soldering Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
本案は貫通型コンデンサとシールドケースの組
合せ構造の係り、簡単な構成で印刷配線に対して
容易にかつ確実の取付けられる優れた組合せ構造
を提供することを目的とするものである。[Detailed description of the invention] This invention relates to a combination structure of a feed-through capacitor and a shield case, and aims to provide an excellent combination structure that has a simple structure and can be easily and reliably attached to printed wiring. It is.
一般に貫通型コンデンサは第１図に示すように
内面、外面にそれぞれ電極を形成した円筒状の誘
電体１と、この誘電体１の外周に嵌合されたリン
グ状の外側電極板２と、上記誘電体１の中心孔に
挿入されたリード線３によつて構成されている。
したがつて、貫通型コンデンサを取付ける場合に
は第２図に示すように、シールドケース４等に誘
電体１が挿入される透孔５を形成し、ここに誘電
体１を挿入し外側電極板２をシールドケース４に
半田付けして取付けるようにしている。そして、
シールドケース４内の各種電気部品とシールドケ
ース４の外の各種電気部品を互に接続する場合に
はそれぞれ別にリード線６，７を使用し、これら
を誘電体１の中心孔に挿入されたリード線３の両
端にそれぞれ半田付けして接続するようにしてい
る。しかしながら、この種のものでは外側電極板
２をシールドケース４に半田付けするときは勿論
リード線６，７をリード線３に半田付けするとき
でもいずれも手作業によらなければならず、まま
た、別個に多くのリード線を必要とするなどきわ
めて不都合なものであつた。 Generally, as shown in FIG. 1, a feedthrough capacitor includes a cylindrical dielectric body 1 with electrodes formed on its inner and outer surfaces, a ring-shaped outer electrode plate 2 fitted around the outer circumference of this dielectric body 1, and It is composed of a lead wire 3 inserted into a center hole of a dielectric 1.
Therefore, when installing a feedthrough capacitor, as shown in FIG. 2, a through hole 5 into which the dielectric 1 is inserted is formed in the shield case 4, etc., and the dielectric 1 is inserted into the hole 5 and the outer electrode plate 2 is attached to the shield case 4 by soldering. and,
When connecting various electrical components inside the shield case 4 and various electrical components outside the shield case 4, separate lead wires 6 and 7 are used, and these are connected to the leads inserted into the center hole of the dielectric 1. Both ends of the wire 3 are soldered and connected. However, with this type of device, soldering the outer electrode plate 2 to the shield case 4 as well as soldering the lead wires 6 and 7 to the lead wire 3 must be done manually, and , which was extremely inconvenient as it required many separate lead wires.
本案は以上のような従来の欠点を除去するもの
であり、貫通型コンデンサおよびシールドケース
に改良を加え、その取付けを著しく簡単にしたも
のである。 The present invention eliminates the above-mentioned conventional drawbacks, improves the feedthrough capacitor and shield case, and significantly simplifies installation.
以下、本案の貫通型コンデンサとシールドケー
スの組合せ構造について一実施例の図面とともに
説明する。図において、８は印刷配線板であり、
その裏面にはそれぞれ所要の導体層９，９が形成
されている。１０は印刷配線板８に装着されたシ
ールドケースであり、このシールドケース１０に
は印刷配線板８と接する側に任意の大きさの切欠
き１１が形成されている。１２は切欠き１１を通
して両端がシールドケース１０の内外に位置する
ように配置された円筒状誘電体であり、この誘電
体１２の内面、外面にはそれぞれ電極１３，１４
が形成されている。１５は誘電体１２の外周に嵌
合され電極１４に電気的に接続された外側電極板
であり、この電極板１５の外周には取付脚１６が
一体に形成されている。そして、この取付脚１６
は印刷配線板８に形成した取付孔１７に挿入され
導体層９に半田付けされている。１８は誘電体１
２の中心孔に挿入され電極１３に電気的に接続さ
れたリード線であり、このリード線１８の両端は
共に取付脚１６と同方向に折曲され印刷配線板８
に形成した透孔１９，１９にそれぞれ挿入され導
体層９に半田付けされている。 The combined structure of the feedthrough capacitor and shield case of the present invention will be described below with reference to drawings of one embodiment. In the figure, 8 is a printed wiring board;
Required conductor layers 9, 9 are formed on the back surface thereof, respectively. A shield case 10 is attached to the printed wiring board 8, and a notch 11 of an arbitrary size is formed in the shield case 10 on the side that comes into contact with the printed wiring board 8. Reference numeral 12 denotes a cylindrical dielectric body which is disposed through the notch 11 so that both ends are located inside and outside the shield case 10, and electrodes 13 and 14 are provided on the inner and outer surfaces of the dielectric body 12, respectively.
is formed. Reference numeral 15 denotes an outer electrode plate that is fitted onto the outer periphery of the dielectric 12 and electrically connected to the electrode 14, and a mounting leg 16 is integrally formed on the outer periphery of the electrode plate 15. And this mounting leg 16
is inserted into a mounting hole 17 formed in the printed wiring board 8 and soldered to the conductor layer 9. 18 is dielectric 1
The lead wire 18 is inserted into the center hole of the printed wiring board 8 and electrically connected to the electrode 13, and both ends of the lead wire 18 are bent in the same direction as the mounting legs 16.
The conductor layer 9 is inserted into through holes 19, 19, respectively, and soldered to the conductor layer 9.
上記シールドケース１０には取付足２０，２０
が形成されており、該取付足２０，２０は上記印
刷配線板８に形成した透孔２１，２１に挿入さ
れ、外側電極板１５の取付脚１６が半田付けされ
たと同一の導体層９に半田付けされている。 The above shield case 10 has mounting feet 20, 20.
The mounting legs 20, 20 are inserted into the through holes 21, 21 formed in the printed wiring board 8, and are soldered to the same conductor layer 9 to which the mounting legs 16 of the outer electrode plate 15 are soldered. It is attached.
以上のように本案によれば、印刷配線板を貫通
してその印刷配線板の導体層に半田付けされる取
付足を有すると共に上記印刷配線板と接する側に
切欠きが設けられたシールドケースと、このシー
ルドケースを貫通するように上記シールドケース
の切欠きに嵌合される貫通型コンデンサからな
り、上記貫通型コンデンサは筒状誘電体と、この
筒状誘電体の内周面に形成された内側電極板並び
に外周面に装着された外側電極板と、この外側電
極板に上記シールドケースの取付足と同方向へ延
設され、上記印刷配線板に形成した取付孔に挿入
されて上記シールドケースの取付足が半田付けさ
れる導体層と同一の導体層に半田付けされる取付
脚を有し、かつ上記筒状半田付けの中心孔に挿入
され、両端がそれぞれ上記取付足及び取付脚と同
方向に折曲され上記印刷配線板に形成した透孔に
挿入されて上記印刷配線板の導体層に半田付けさ
れるリード線を有するものであるため、印刷配線
板に対し貫通型コンデンサを構成する筒状誘電体
の取付脚を挿入してシールドケースの取付足を挿
入するという挿入作業を同方向より行なうことが
でき、もつて簡単な手段でその装着を行なうこと
ができ、その後これらの半田付けは他の電気部品
と同様半田デイツプ法によつて同時にかつ容易に
行なうことができ、印刷配線板に対する貫通型コ
ンデンサおよびシールドケースの取付けが著しく
簡単になるものである。そして、本案によれば更
にリード線の両端を取付脚、取付足と同方向に折
曲し印刷配線板の導体層に半田付けしているため
別個に多くのリード線を必要とせず、全体として
構成を簡略化できると共にコストを著しく低減さ
せることができるなどその実用的価値はきわめて
大きいものである。 As described above, according to the present invention, the shield case has mounting legs that penetrate through a printed wiring board and are soldered to the conductor layer of the printed wiring board, and a notch is provided on the side in contact with the printed wiring board. , a feed-through capacitor is fitted into a notch in the shield case so as to penetrate through the shield case, and the feed-through capacitor includes a cylindrical dielectric and an inner peripheral surface of the cylindrical dielectric. An inner electrode plate, an outer electrode plate attached to the outer peripheral surface, and an outer electrode plate extending in the same direction as the mounting feet of the shield case, and inserted into the mounting holes formed in the printed wiring board to attach the shield case to the outer electrode plate. The mounting leg has a mounting leg that is soldered to the same conductor layer as the conductive layer to which the mounting leg is soldered, and is inserted into the center hole of the cylindrical solder, and both ends are the same as the mounting leg and the mounting leg, respectively. It has a lead wire that is bent in a direction, inserted into a through hole formed in the printed wiring board, and soldered to the conductor layer of the printed wiring board, so that it forms a feedthrough capacitor for the printed wiring board. The insertion work of inserting the cylindrical dielectric mounting leg and the shielding case mounting leg can be performed from the same direction, making it possible to attach them by a simple method, and then soldering them. This can be done simultaneously and easily by the solder dip method in the same way as other electrical parts, and the attachment of the feedthrough capacitor and the shield case to the printed wiring board becomes extremely simple. Furthermore, according to this proposal, both ends of the lead wire are bent in the same direction as the mounting leg and the mounting foot, and are soldered to the conductor layer of the printed wiring board, so there is no need for many separate lead wires, and the overall Its practical value is extremely great, as it can simplify the configuration and significantly reduce costs.
第１図は通常使用されている貫通型コンデンサ
の斜視図、第２図は同コンデンサの取付状態を示
す斜視図、第３図は本案の貫通型コンデンサの取
付装置における一実施例の斜視図、第４図は同実
施例の断面図、第５図は同実施例に使用する貫通
型コンデンサの斜視図である。
８……印刷配線板、９……導体層、１０……シ
ールドケース、１１……切欠、１２…筒状誘電
体、１３，１４……電極、１５……外側電極板、
１６……取付脚、１７……取付孔、１８……リー
ド線、１９……透孔、２０……取付足、２１……
透孔。
FIG. 1 is a perspective view of a commonly used feedthrough capacitor, FIG. 2 is a perspective view showing how the capacitor is installed, and FIG. 3 is a perspective view of an embodiment of the feedthrough capacitor mounting device of the present invention. FIG. 4 is a sectional view of the same embodiment, and FIG. 5 is a perspective view of a feedthrough capacitor used in the same embodiment. 8... Printed wiring board, 9... Conductor layer, 10... Shield case, 11... Notch, 12... Cylindrical dielectric, 13, 14... Electrode, 15... Outer electrode plate,
16...Mounting leg, 17...Mounting hole, 18...Lead wire, 19...Through hole, 20...Mounting foot, 21...
Through hole.
Claims (1)
に半田付けされる取付足を有すると共に上記印刷
配線板と接する側に切欠きが設けられたシールド
ケースと、このシールドケースを貫通するように
上記シールドケースの切欠きに嵌合される貫通型
コンデンサからなり、上記貫通型コンデンサは、
筒状誘電体とこの筒状誘電体の内周面に形成され
た内側電極板並びに外周面に装着された外側電極
板と、この外側電極板に上記シールドケースの取
付足と同方向へ延設され、上記印刷配線板に形成
した取付孔に挿入されて上記シールドケースの取
付足が半田付けされる導体層と同一の導体層に半
田付けされる取付脚を有し、かつ上記筒状誘電体
の中心孔に挿入され、両端がそれぞれ上記取付足
及び取付脚と同方向に折曲され上記印刷配線板に
形成した透孔に挿入されて上記印刷配線板の導体
層に半田付けされるリード線を有してなる、印刷
配線板へ取付けるための貫通型コンデンサとシー
ルドケースの組合せ構造。 A shield case having mounting legs that penetrate the printed wiring board and are soldered to the conductor layer of the printed wiring board, and a notch provided on the side in contact with the printed wiring board; It consists of a feed-through capacitor that is fitted into the notch of the shield case, and the feed-through capacitor is
A cylindrical dielectric body, an inner electrode plate formed on the inner circumferential surface of the cylindrical dielectric body, an outer electrode plate attached to the outer circumferential surface, and a structure extending from the outer electrode plate in the same direction as the mounting foot of the shield case. and has a mounting leg that is inserted into a mounting hole formed in the printed wiring board and is soldered to the same conductor layer as a conductor layer to which the mounting leg of the shield case is soldered, and the cylindrical dielectric body A lead wire that is inserted into the center hole of the printed wiring board, has both ends bent in the same direction as the mounting foot and the mounting leg, and is inserted into a through hole formed in the printed wiring board and soldered to the conductor layer of the printed wiring board. A combination structure of a feed-through capacitor and a shield case for mounting on a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976169465U JPS6116677Y2 (en) | 1976-12-17 | 1976-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976169465U JPS6116677Y2 (en) | 1976-12-17 | 1976-12-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5386344U JPS5386344U (en) | 1978-07-15 |
| JPS6116677Y2 true JPS6116677Y2 (en) | 1986-05-22 |
Family
ID=28777058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976169465U Expired JPS6116677Y2 (en) | 1976-12-17 | 1976-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116677Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5344343Y2 (en) * | 1972-04-15 | 1978-10-24 |
-
1976
- 1976-12-17 JP JP1976169465U patent/JPS6116677Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5386344U (en) | 1978-07-15 |
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