JPS61164055U - - Google Patents
Info
- Publication number
- JPS61164055U JPS61164055U JP4421685U JP4421685U JPS61164055U JP S61164055 U JPS61164055 U JP S61164055U JP 4421685 U JP4421685 U JP 4421685U JP 4421685 U JP4421685 U JP 4421685U JP S61164055 U JPS61164055 U JP S61164055U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting
- receiving element
- lens surface
- receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図ａは本考案の発光・受光素子のパツケー
ジ構造を示す斜視図、第１図ｂは同側面図、第２
図は同発光・受光素子の取付を示す側面図、第３
図は従来の発光・受光素子のパツケージ構造を示
す斜視図、第４図は同発光・受光素子の取付けを
示す側面図、第５図は光学式タツチパネルを示す
概略図である。
６……チツプ、７……樹脂、８……レンズ面。
Figure 1a is a perspective view showing the package structure of the light emitting/light receiving element of the present invention, Figure 1b is a side view of the same, and Figure 1b is a side view of the same.
The figure is a side view showing the installation of the same light-emitting/light-receiving element.
FIG. 4 is a perspective view showing the package structure of a conventional light emitting/light receiving element, FIG. 4 is a side view showing the mounting of the light emitting/light receiving element, and FIG. 5 is a schematic diagram showing an optical touch panel. 6...chip, 7...resin, 8...lens surface.
Claims (1)
子において、該素子を形成するチツプの発光・受
光面に対向する面を湾曲させてレンズ面となすと
ともに、このレンズ面はその発光面正面から見て
略方形の偏平状に形成することを特徴とする発光
・受光素子のパツケージ構造。 In a light-emitting/light-receiving element sealed with a translucent resin, the surface facing the light-emitting/light-receiving surface of the chip forming the element is curved to form a lens surface, and this lens surface is located in front of the light-emitting surface. A package structure for a light-emitting/light-receiving element characterized by being formed into a substantially rectangular flat shape when viewed from above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4421685U JPS61164055U (en) | 1985-03-25 | 1985-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4421685U JPS61164055U (en) | 1985-03-25 | 1985-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61164055U true JPS61164055U (en) | 1986-10-11 |
Family
ID=30556593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4421685U Pending JPS61164055U (en) | 1985-03-25 | 1985-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61164055U (en) |
-
1985
- 1985-03-25 JP JP4421685U patent/JPS61164055U/ja active Pending