JPS6116079Y2 - - Google Patents
Info
- Publication number
- JPS6116079Y2 JPS6116079Y2 JP9778580U JP9778580U JPS6116079Y2 JP S6116079 Y2 JPS6116079 Y2 JP S6116079Y2 JP 9778580 U JP9778580 U JP 9778580U JP 9778580 U JP9778580 U JP 9778580U JP S6116079 Y2 JPS6116079 Y2 JP S6116079Y2
- Authority
- JP
- Japan
- Prior art keywords
- needle
- blade cutter
- thin material
- cutting
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 32
- 238000005520 cutting process Methods 0.000 claims description 23
- 238000003466 welding Methods 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005219 brazing Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shearing Machines (AREA)
- Accessories And Tools For Shearing Machines (AREA)
- Die Bonding (AREA)
- Details Of Cutting Devices (AREA)
- Nonmetal Cutting Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9778580U JPS6116079Y2 (de) | 1980-07-10 | 1980-07-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9778580U JPS6116079Y2 (de) | 1980-07-10 | 1980-07-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5723926U JPS5723926U (de) | 1982-02-06 |
JPS6116079Y2 true JPS6116079Y2 (de) | 1986-05-17 |
Family
ID=29459543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9778580U Expired JPS6116079Y2 (de) | 1980-07-10 | 1980-07-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6116079Y2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2666391B2 (ja) * | 1988-07-14 | 1997-10-22 | 日本電気株式会社 | 遅延線路 |
DE102006051349A1 (de) * | 2006-10-31 | 2008-05-08 | Sms Demag Ag | Verfahren und Vorrichtung zum Teilen von Metallband |
-
1980
- 1980-07-10 JP JP9778580U patent/JPS6116079Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5723926U (de) | 1982-02-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3650454A (en) | Device for bonding with a compliant medium | |
US3533155A (en) | Bonding with a compliant medium | |
KR19980070182A (ko) | 범프 형성방법 | |
JP3005786B2 (ja) | チップボンデイング方法及び装置 | |
US3563443A (en) | Pneumatic force-exerting system | |
JPS5937913A (ja) | 調理器具およびその製造方法 | |
JPS6116079Y2 (de) | ||
US2492162A (en) | Method and apparatus for sealing electrodes in envelopes of electron discharge tubes | |
JPH0793305B2 (ja) | バンプ形成方法およびバンプ形成装置 | |
US3657789A (en) | Apparatus for preparing a microelement for soldering | |
US5799771A (en) | Contact with a silver contact base and process for making the same | |
JPH054597U (ja) | リード成形装置 | |
JPS58209429A (ja) | プレス型 | |
US4152172A (en) | Method for cleaning raised terminal pads of semiconductor elements | |
JPS6320118Y2 (de) | ||
JP2014147945A (ja) | ろう材供給装置 | |
JPH0126174B2 (de) | ||
US3911569A (en) | Method and apparatus for bonding miniature semiconductor pill-type components to a circuit board | |
JPS6136378B2 (de) | ||
JPH05123804A (ja) | リードの切断方法 | |
JPS586633Y2 (ja) | プロジエクシヨン溶接用溶接片 | |
JPS638639B2 (de) | ||
DE102022209769A1 (de) | Computerimplementiertes verfahren zur aktualisierung von software in einer vorrichtung zur mitigation von softwaremanipulation | |
JPS6348126Y2 (de) | ||
JPH04350950A (ja) | チップの位置決め装置 |