JPS6115968A - Vacuum deposition apparatus - Google Patents

Vacuum deposition apparatus

Info

Publication number
JPS6115968A
JPS6115968A JP13539184A JP13539184A JPS6115968A JP S6115968 A JPS6115968 A JP S6115968A JP 13539184 A JP13539184 A JP 13539184A JP 13539184 A JP13539184 A JP 13539184A JP S6115968 A JPS6115968 A JP S6115968A
Authority
JP
Japan
Prior art keywords
vacuum
substrate
holding jig
axis
heating source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13539184A
Other languages
Japanese (ja)
Inventor
Tetsushi Ishida
哲史 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13539184A priority Critical patent/JPS6115968A/en
Publication of JPS6115968A publication Critical patent/JPS6115968A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To enable the continuous vacuum deposition without making the atmosphere of the inside of a vessel by providing a horizontal axis to the upper part of a heating source to fit a holding jig for a substrate and providing a means by which the axis is rotated from an outside part. CONSTITUTION:A rotation introducing mechanism 8 is fitted to the side face of a cylindrical part of a pedestal 2 for a vacuum vessel to transfer the rotation to a holding jig 4 for a substrate fitted to an axis 11 from an outside part of the vessel. A rotaty supporting stand 9 is provided to the opposite side of the mechanism 8 to support the axis 11 horizontally and the axis 11 is joined to the mechanism 8. The holding jig 4 is provided with holes for exaposing the back surface of a substrate 5 and both the surfaces of the base plate 5 are directed to a heating source 6 by the rotation of the holding jig 4. Also, the metal 7 for a vapor deposition source is mounted on the heating source 6. By this structure, the holding jig 4 can be freely rotated while maintaining the inside of the vacuum vessel in the vacuum state.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、真空蒸着装置に関する。特に、真空蒸着装置
内の基板保持具の改善に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vacuum evaporation apparatus. In particular, the present invention relates to improvements in substrate holders within vacuum deposition apparatuses.

〔従来の技術〕[Conventional technology]

第３図は、従来例の真空蒸着装置における真空容器の断
面図を示す図である。FIG. 3 is a diagram showing a cross-sectional view of a vacuum container in a conventional vacuum evaporation apparatus.

真空容器３１と台座３２の接触部に０リング３３を挟み
込み、排気口３８より空気を外部に排気することにより
、真空容器３１内は真空状態に保持される。The interior of the vacuum container 31 is maintained in a vacuum state by inserting an O-ring 33 between the contact portion of the vacuum container 31 and the pedestal 32 and exhausting air to the outside from the exhaust port 38.

真空容器３１の中には基板保持具３４が取り付けられ、
基板保持具３４の下面に、着膜される基板３５が取り付
けられる。加熱源３６には蒸着しようとする蒸着源金属
３７が載置される。　　　　　　　　　′このような真
空装置では、基板３５の両面に真空蒸着するためには、
一方の面に真空蒸着した後に、真空容器３１を大気に戻
してから真空容器３１を開蓋し、基板保持具３４が保持
している基板３５を裏返し、再び真空状態に戻した後に
真空蒸着を行う必要がある。A substrate holder 34 is installed inside the vacuum container 31,
A substrate 35 to be coated with a film is attached to the lower surface of the substrate holder 34. A vapor deposition source metal 37 to be vapor-deposited is placed on the heating source 36 . 'In such a vacuum apparatus, in order to perform vacuum deposition on both sides of the substrate 35,
After performing vacuum evaporation on one surface, the vacuum container 31 is returned to the atmosphere, the lid of the vacuum container 31 is opened, the substrate 35 held by the substrate holder 34 is turned over, and the vacuum state is returned to the vacuum state again, and then the vacuum evaporation is performed. There is a need to do.

真空条件としては、１０−’　（Ｔｏｒｒ）以下の真空
にする必要がある。また、真空蒸着に先立って、加熱源
３６、蒸着源金属３７、真空容器３１、基板保持具３４
等のアウトガスを行う必要がある。さらに、真空蒸着後
には、真空内で加熱源３６、蒸着源金属３７、基板保持
具３４および基板３５を冷却する必要がある。The vacuum condition needs to be 10-' (Torr) or less. In addition, prior to vacuum deposition, a heating source 36, a deposition source metal 37, a vacuum container 31, a substrate holder 34
It is necessary to perform outgassing such as. Furthermore, after vacuum deposition, it is necessary to cool the heating source 36, the deposition source metal 37, the substrate holder 34, and the substrate 35 in a vacuum.

このために、真空蒸着に約３０分かかるのに対して、排
気から真空蒸着まで約２時間かかり、蒸着完了から取り
出しまで１．５時間かかる。For this reason, while vacuum deposition takes about 30 minutes, it takes about 2 hours from evacuation to vacuum deposition, and 1.5 hours from completion of vapor deposition to removal.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

このように、従来の真空蒸着装置は、生産性が悪い欠点
があった。As described above, the conventional vacuum evaporation apparatus has the disadvantage of poor productivity.

本発明は、この欠点を解決し、真空容器内を大気に戻す
ことなく連続した真空蒸着が可能な真空蒸着装置を提供
することを目的とする。An object of the present invention is to solve this drawback and provide a vacuum evaporation apparatus that can perform continuous vacuum evaporation without returning the inside of the vacuum container to the atmosphere.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の真空蒸着装置は、真空領域を形成する真空容器
と、この真空容器の内部で基板を保持する基板保持具と
、この真空容器の内部で金属を加熱して蒸発させる加熱
源とを備えた真空蒸着装置において、上記加熱源の上方
に配置されたほぼ水平な軸を備え、この軸に上記基板保
持具が取り付けられ、この軸を上記真空容器の外部から
回転させる手段を備えたことを特徴とする。The vacuum evaporation apparatus of the present invention includes a vacuum container that forms a vacuum region, a substrate holder that holds a substrate inside the vacuum container, and a heat source that heats and evaporates metal inside the vacuum container. A vacuum evaporation apparatus according to the present invention includes a substantially horizontal shaft disposed above the heating source, the substrate holder is attached to the shaft, and means for rotating the shaft from outside the vacuum container is provided. Features.

〔作用〕[Effect]

□　本発明の真空蒸着装置は、真空容器を大気に戻すこ
となしに基板を反転させることが可能である。□ The vacuum evaporation apparatus of the present invention can invert the substrate without returning the vacuum container to the atmosphere.

これにより、基板の両面に連続して真空蒸着することが
できる。This allows continuous vacuum deposition on both sides of the substrate.

Ｃ実施例〕 第１図と第２図とは、本発明実施例真空蒸着装置を示す
図である。第１図は真空容器部分の断面図であり、第２
図は蓋を取った状態の上面図である。Embodiment C] FIGS. 1 and 2 are diagrams showing a vacuum evaporation apparatus according to an embodiment of the present invention. Figure 1 is a sectional view of the vacuum container part, and
The figure is a top view with the lid removed.

台座２の円筒部の上面には、０リング３を埋め込むため
の溝が設けられている。蓋Ｉは、Ｏリング３を挟んで台
座２の上に載置される。排気口１０から空気を排気する
ことにより、蓋１および台座２で囲まれた部分を真空に
することができる。A groove for embedding the O-ring 3 is provided on the upper surface of the cylindrical portion of the base 2. The lid I is placed on the pedestal 2 with the O-ring 3 in between. By exhausting air from the exhaust port 10, the area surrounded by the lid 1 and the pedestal 2 can be evacuated.

台座２０円筒部側面には、回転導入機構８が取り付けら
れ、真空容器外部から、基板保持具４に回転を伝達する
ことができる。台座２の円筒部側面の回転導入機構８と
反対側には、回転支持台９が設けられており、基板保持
具４を回転させるための軸１１は、回転導入機構８に連
結され、回転支持台９によりほぼ水平に支えられている
。A rotation introduction mechanism 8 is attached to the side surface of the cylindrical portion of the pedestal 20, and can transmit rotation to the substrate holder 4 from outside the vacuum container. A rotation support base 9 is provided on the side of the cylindrical portion of the base 2 opposite to the rotation introduction mechanism 8. A shaft 11 for rotating the substrate holder 4 is connected to the rotation introduction mechanism 8, and a rotation support base 9 is provided on the side opposite to the rotation introduction mechanism 8 on the side surface of the cylindrical portion of the base 2. It is supported almost horizontally by a stand 9.

基板保持具４と蓋１との距離および基板保持具４と加熱
源６との距離は、基板保持具４示回転可能な長さに設定
されている。The distance between the substrate holder 4 and the lid 1 and the distance between the substrate holder 4 and the heat source 6 are set to a length that allows the substrate holder 4 to rotate.

基板保持具４には、基板５の裏面を露出するための穴（
例えば矩形の穴）を有し、基板保持具４を回転させるこ
とにより、基板５の両面を加熱源６に向けることができ
る。また、加熱源６の上には蒸着する蒸着源金属７が載
置される。The substrate holder 4 has a hole (
For example, by rotating the substrate holder 4, both sides of the substrate 5 can be directed toward the heating source 6. Further, a vapor deposition source metal 7 to be vapor-deposited is placed on the heat source 6 .

このような構造により、真空容器内を真空状態に保持し
たままで、基板保持具４を自由に回転させることができ
る。With such a structure, the substrate holder 4 can be freely rotated while the inside of the vacuum container is maintained in a vacuum state.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明の真空蒸着装置により、連
続して基板の両面に蒸着することが可能になる。このた
め、従来例の装置では基板の片面に約４時間、基板両面
では８時間かかっていた真空蒸着が、本発明の真空蒸着
装置では、基板両面の真空蒸着が約４．５時間で完了す
る。これにより、約７８％の生産性を向上させる効果が
ある。As described above, the vacuum evaporation apparatus of the present invention enables continuous evaporation on both sides of a substrate. Therefore, with the vacuum evaporation apparatus of the present invention, vacuum evaporation on both sides of the substrate can be completed in about 4.5 hours, whereas it took about 4 hours for one side of the substrate and 8 hours for both sides of the substrate with the conventional apparatus. . This has the effect of improving productivity by about 78%.

また、基板の片面だけに真空蒸着する場合には、基板保
持具の両面に基板を取りつけることにより、同等の生産
性向上が可能である。Furthermore, when vacuum deposition is performed on only one side of the substrate, the same productivity can be improved by attaching the substrate to both sides of the substrate holder.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明実施例真空蒸着装置の真空容器部分の断
面図。 第２図は本発明実施例真空蒸着装置の蓋を取った状態の
上面図。 第３図は従来例真空蒸着装置の真空容器の断面図。 １・・・蓋、２・・・台座、３・・・Ｏリング、４・・
・基板保持具、５・・・基板、６・・・加熱源、７・・
・蒸着源金属、８・・・回転導入機構、９・・・回転支
持台、１ｏ・・・排気口、１１・・・軸、３１・・・真
空容器、３２・・・台座、３３・・・０リング、３４・
・・基板保持具、３５・・・基板、３６・・・加熱源、
３７・・・蒸着源金属、３８・・・排気口。FIG. 1 is a sectional view of a vacuum container portion of a vacuum evaporation apparatus according to an embodiment of the present invention. FIG. 2 is a top view of the vacuum evaporation apparatus according to the present invention with the lid removed. FIG. 3 is a sectional view of a vacuum container of a conventional vacuum evaporation apparatus. 1... Lid, 2... Pedestal, 3... O-ring, 4...
・Substrate holder, 5...Substrate, 6...Heating source, 7...
- Vapor deposition source metal, 8... Rotation introduction mechanism, 9... Rotation support stand, 1o... Exhaust port, 11... Shaft, 31... Vacuum vessel, 32... Pedestal, 33...・0 ring, 34・
...Substrate holder, 35...Substrate, 36...Heat source,
37... Vapor deposition source metal, 38... Exhaust port.

Claims (1)

【特許請求の範囲】[Claims] （１）真空領域を形成する真空容器と、 この真空容器の内部で基板を保持する基板保持具と、 この真空容器の内部で金属を加熱して蒸発させる加熱源
と を備えた真空蒸着装置において、 上記加熱源の上方に配置されたほぼ水平な軸を備え、 この軸に上記基板保持具が取り付けられ、 この軸を上記真空容器の外部から回転させる手段を備え
た ことを特徴とする真空蒸着装置。(1) In a vacuum evaporation apparatus equipped with a vacuum container that forms a vacuum region, a substrate holder that holds a substrate inside this vacuum container, and a heat source that heats and evaporates metal inside this vacuum container. , a vacuum evaporation method comprising: a substantially horizontal shaft disposed above the heating source; the substrate holder is attached to the shaft; and means for rotating the shaft from outside the vacuum container. Device.
JP13539184A 1984-06-29 1984-06-29 Vacuum deposition apparatus Pending JPS6115968A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13539184A JPS6115968A (en) 1984-06-29 1984-06-29 Vacuum deposition apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13539184A JPS6115968A (en) 1984-06-29 1984-06-29 Vacuum deposition apparatus

Publications (1)

Publication Number Publication Date
JPS6115968A true JPS6115968A (en) 1986-01-24

Family

ID=15150610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13539184A Pending JPS6115968A (en) 1984-06-29 1984-06-29 Vacuum deposition apparatus

Country Status (1)

Country Link
JP (1) JPS6115968A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724076A (en) * 1985-08-02 1988-02-09 Sasakura Engineering Co., Ltd. Centrifugal separator for separating sludge in waste water

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724076A (en) * 1985-08-02 1988-02-09 Sasakura Engineering Co., Ltd. Centrifugal separator for separating sludge in waste water

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