JPS61151338U - - Google Patents

Info

Publication number
JPS61151338U
JPS61151338U JP1985033470U JP3347085U JPS61151338U JP S61151338 U JPS61151338 U JP S61151338U JP 1985033470 U JP1985033470 U JP 1985033470U JP 3347085 U JP3347085 U JP 3347085U JP S61151338 U JPS61151338 U JP S61151338U
Authority
JP
Japan
Prior art keywords
clamp piece
wire clamping
clamping surface
fulcrum
fulcrum protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985033470U
Other languages
English (en)
Other versions
JPH0219968Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985033470U priority Critical patent/JPH0219968Y2/ja
Publication of JPS61151338U publication Critical patent/JPS61151338U/ja
Application granted granted Critical
Publication of JPH0219968Y2 publication Critical patent/JPH0219968Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示すもので、クラン
プ片開の状態を示す一部断面正面図、第２図は第
１図の底面図、第３図は本考案においてクランプ
片を閉とした状態を示す一部断面正面図、第４図
は本考案の他の実施例を示す一部断面正面図、第
５図は本考案においてクランプ片を閉とした時の
両ワイヤー挾持面、支点突起部および支点突起部
支持面との位置関係の一例を示す拡大正面図、第
６図は本考案においてクランプ片を閉とした時の
両ワイヤー挾持面、支点突起部および支点突起部
支持面との位置関係の他の例を示す拡大正面図、
第７図は半導体装置のワイヤーボンデイング工程
を説明するための正面図、第８図〜第１０図は従
来のワイヤーボンダー用クランパーを示すもので
、第８図はクランプ片開の状態を示す一部断面正
面図、第９図は第８図の底面図、第１０図はクラ
ンプ片閉の状態を示す一部断面正面図である。 ３１……一方のクランプ片、３２……一方のク
ランプ片のワイヤー挾持面、３３……一方のクラ
ンプ片の支点突起部、３４……他方のクランプ片
、３５……他方のクランプ片のワイヤー挾持面、
３６……他方のクランプ片の支点突起部支持面。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一方のクランプ片３１と他方のクランプ片３４
    とを備え、一方のクランプ片３１にはワイヤー挾
    持面３２および支点突起部３３を設け、他方のク
    ランプ片３４には前記一方のクランプ片３１のワ
    イヤー挾持面３２に対向するワイヤー挾持面３５
    および前記支点突起部３３を支持する支点突起部
    支持面３６を設け、前記支点突起部３３を支点と
    して一方のクランプ片３１のワイヤー挾持面３２
    を他方のクランプ片３４のワイヤー挾持面３５方
    向に閉じるようにしたことを特徴とするワイヤー
    ボンダー用クランパー。
JP1985033470U 1985-03-11 1985-03-11 Expired JPH0219968Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985033470U JPH0219968Y2 (ja) 1985-03-11 1985-03-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985033470U JPH0219968Y2 (ja) 1985-03-11 1985-03-11

Publications (2)

Publication Number Publication Date
JPS61151338U true JPS61151338U (ja) 1986-09-18
JPH0219968Y2 JPH0219968Y2 (ja) 1990-05-31

Family

ID=30535952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985033470U Expired JPH0219968Y2 (ja) 1985-03-11 1985-03-11

Country Status (1)

Country Link
JP (1) JPH0219968Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268942A (ja) * 1988-09-02 1990-03-08 Matsushita Electric Ind Co Ltd ワイヤクランプ方法及び装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268942A (ja) * 1988-09-02 1990-03-08 Matsushita Electric Ind Co Ltd ワイヤクランプ方法及び装置

Also Published As

Publication number Publication date
JPH0219968Y2 (ja) 1990-05-31

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