JPS6114946A - Gold group laminated substrate - Google Patents
Gold group laminated substrateInfo
- Publication number
- JPS6114946A JPS6114946A JP13692784A JP13692784A JPS6114946A JP S6114946 A JPS6114946 A JP S6114946A JP 13692784 A JP13692784 A JP 13692784A JP 13692784 A JP13692784 A JP 13692784A JP S6114946 A JPS6114946 A JP S6114946A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- substrate
- based laminate
- adhesive
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は合成樹脂製基板に、金または金合金によって形
成された箔を積層して一体としだ金系ラミネート基板に
関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a metal laminated substrate in which a synthetic resin substrate is integrally laminated with a foil made of gold or a gold alloy.
上記金系ラミネート基板は電気的部材として用いられて
いるが、当該従来製品は単に金または金合金による金系
箔を、フェノール樹脂やエポキシ樹脂などＫよる基板に
接着剤にて接着するだけのものであった。The above-mentioned gold-based laminate substrates are used as electrical components, but the conventional products involved simply adhere gold-based foil made of gold or gold alloy to a K-based substrate such as phenol resin or epoxy resin with an adhesive. Met.
ところで、既知の如く金または金合金は耐食性に優れて
いることから、圧延加工などによｐ得られる上記の金系
箔は、その表面が鏡面の如き状態となり、従って仁れを
、そのまま接着剤により接着しようとしても、接着しな
いか、極めて不本意な接着状態しか得られない。By the way, as is known, gold or gold alloys have excellent corrosion resistance, so the above-mentioned gold-based foil obtained by rolling etc. has a mirror-like surface, and therefore the burrs can be applied directly to the adhesive. Even if an attempt is made to adhere the two, either the adhesive will not adhere or only an extremely undesirable adhesive state will be obtained.
このため、当該金系箔に前処理として、その接着面に機
械的研削手段を施したり、また同面に王水などの薬品を
付与することで、当該接着面を粗面にすることが行なわ
れている。For this reason, as a pretreatment of the gold-based foil, the adhesion surface is roughened by subjecting the adhesion surface to mechanical grinding or by applying chemicals such as aqua regia to the same surface. It is.
しかし上記研削手段は薄箔の片面にのみ施すこととなる
から、当該加工面とその反面である非加工面とに歪が生
じて、金系箔の平坦度が阻害されるととＫなシ、これが
接着性に悪影響を与えたシ、製品表面の不平滑を生来し
てしまうことになるといった欠陥がある。However, since the above-mentioned grinding means is applied only to one side of the thin foil, distortion occurs between the processed surface and the opposite non-processed surface, which may impede the flatness of the gold-based foil. This has disadvantages in that it has an adverse effect on adhesion and causes the surface of the product to become uneven.
また上記薬品処理によるときは、接着面だけの処理工程
が非常に複雑なものとなってしまうだけでなく、当該薬
品の特性上特殊な設備が必要となって、量産性にも大き
な問題を含んでいる。Furthermore, when using the above-mentioned chemical treatment, not only is the treatment process for only the adhesive surface extremely complicated, but also special equipment is required due to the characteristics of the chemical, which poses a major problem in mass production. I'm here.
さらに上記例れの手段を採るにしても、当該処理が可能
であること、そして処理済の金系筒を接着するに際し接
着時の拘束力あるいは圧縮応力に耐えるだけの強度が必
要となることから、金系筒にはそれ相当の厚さが要求さ
れることとなり、この結果どうしても高価なＡｕの節約
ができなくなってしまうと共に、最大限の注意を払って
製作したものでも、その接着強度は一般金属によるラミ
ネート基板に比し不充分であり、使用条件によっては、
屡々剥離等の事故が発生するといった欠陥を内包してい
る。Furthermore, even if the above-mentioned methods are used, the treatment is possible, and when bonding treated metal tubes, it is necessary to have sufficient strength to withstand the binding force or compressive stress during bonding. , the metal cylinder is required to have a corresponding thickness, and as a result, it is impossible to save on expensive Au, and even if it is manufactured with the utmost care, its adhesive strength is inferior to that of ordinary people. It is insufficient compared to metal laminated boards, and depending on the usage conditions,
It contains defects that often cause accidents such as peeling.
〔発明が解決しようとする問題点〕
本発明は上記従来の金系ラミネート基板がもつ難点に鑑
み、金または金合金による金系ラミネートをそのまま合
成樹脂製の基板に接着することなく、特異金属による中
間層材と金系ラミネートとのクラッド材を、上記基板に
接着した積層構成とすることＫよって、充分な接着強度
をもった製品を、容易に蓋産可能となし、しかも金の消
費を大幅に削減した安価な製品を提供しようとするのが
、その目的である。[Problems to be Solved by the Invention] In view of the above-mentioned drawbacks of the conventional gold-based laminate substrate, the present invention has been developed to create a gold-based laminate made of gold or a gold alloy without directly adhering it to a synthetic resin substrate. By creating a laminated structure in which the cladding material consisting of the intermediate layer material and the gold-based laminate is bonded to the above-mentioned substrate, it is possible to easily produce a product with sufficient adhesive strength, and the consumption of gold can be greatly reduced. The aim is to provide products at lower prices with reduced costs.
本発明は上記の目的を達成するため、金または金合金に
よる金系ラミネートと、銅、鉄、ニッケル、コバルト、
錫、亜鉛、パラジウム、銀またはこれらの合金である一
層以上の中間層材とによるクラッド材と、フェノール樹
脂、エポキシ樹脂等による合成樹脂製の基板とを、上記
中間層材と同上基板との間に介装の接着剤にて接合した
構成を具有するものである。In order to achieve the above object, the present invention uses a gold-based laminate made of gold or a gold alloy, copper, iron, nickel, cobalt,
A cladding material made of one or more intermediate layer materials made of tin, zinc, palladium, silver, or an alloy thereof, and a synthetic resin substrate made of phenol resin, epoxy resin, etc. are placed between the intermediate layer material and the same substrate. It has a structure in which it is joined with an intervening adhesive.
本発明を図面に示す実施例によって詳記すれば、第１図
に示す通り上面より順次金または金合金による金系ラミ
ネート１、銅、鉄、ニッケル、コバルト、錫、亜鉛、パ
ラジウム、釧マタはこれらの合金による中間層材２、接
着剤３そしてフェノール樹脂、エポキシ樹脂等による合
成樹脂製の基板４が積層されて一体となっている。The present invention will be described in detail with reference to the embodiments shown in the drawings.As shown in FIG. An intermediate layer material 2 made of these alloys, an adhesive 3, and a substrate 4 made of synthetic resin such as phenol resin or epoxy resin are laminated and integrated.
こむで当該製品を得るには、先ず第２図に示す如く金ま
たは金合金による金系ラミネート素材１′と、中間層材
２の素材２′とを重ねて熱間圧着し、これを所定厚さと
なるまで冷間圧延して第３図の如きクラッド材６を得、
これを所要寸法に切断し、当該フッド材６を、中間層材
２または基板４、もしくは両者６．４に付した接着剤３
によって、前記第１図の如く基板４に接着するのである
。To obtain this product, first, as shown in Fig. 2, a gold-based laminate material 1' made of gold or a gold alloy and a material 2' of the intermediate layer material 2 are overlapped and hot-pressed, and then they are bonded to a predetermined thickness. The cladding material 6 as shown in FIG. 3 is obtained by cold rolling until it becomes solid.
This was cut into required dimensions, and the hood material 6 was attached to the intermediate layer material 2 or the substrate 4, or both 6.4 with an adhesive 3.
As a result, it is bonded to the substrate 4 as shown in FIG. 1.
ここで本発明に係る金系ラミネート基板の具 １体例
を示せば以下の通りである。Here, one example of the gold-based laminate substrate according to the present invention is as follows.
ｌａ 厚さ０．５■、巾３０■、長さｌ ＯＯｗｍノ
Ａｕと、厚さ９−５１１１ ｓ 中３０ｍ５ 長さ１０
０＋ａ＋ｏ ｔＣｕ板を重ね合せて熱間圧着し、こ
れを０１籠の厚さとなるまで冷間圧延し、さらに当該ク
ラッド材を巾１０■、長さ１５０ｗ１ｃ裁断した、因に
同材のクラッド比はＡｕ５μ：Ｃｕ ９．５μである。la thickness 0.5cm, width 30cm, length l OOwm Au, thickness 9-5111s medium 30m5 length 10
0+a+o tCu plates were superimposed and hot-pressed, then cold-rolled to the thickness of 01 cage, and the cladding material was cut to a width of 10cm and a length of 150w1c.Incidentally, the cladding ratio of the same material was Au5μ. :Cu 9.5μ.
（ロ） ８０Ａｕ−Ａｇ板と６５Ｃｕ−１５２ｎ−８ｎ
板を、上記１（＋と同寸法、同加工によりクラッド材を
得た。(b) 80Au-Ag plate and 65Cu-152n-8n
A cladding material was obtained from the plate by the same dimensions and processing as in 1(+) above.
ＨＡｕ板と４７Ｎｉ−Ｆｅ板を、前記（イＪと同寸法、
同加工によりクラッド材を得た。The HAu plate and 47Ni-Fe plate were
A clad material was obtained through the same process.
（、＝ｑ ７０Ａｕ−Ｐｄ板とＴｉ−Ｃｕ板を、前記
ｆ（Ｊと同寸法、同加工によりクラッド材を得た。(,=q 70A cladding material was obtained from an Au-Pd plate and a Ti-Cu plate with the same dimensions and processing as f(J).
１−１１８０Ａｕ−１０Ａｇ−５Ｃｕ−Ｎｉ板と、３０
Ｃｏ −２５Ｎ ｉ −０，７Ｍ ｎ −Ｆ ｅ板を
、前記ｔ−（Ｊと同寸法、同加工によりクラッド材を得
た。1-1180Au-10Ag-5Cu-Ni plate and 30
A cladding material was obtained from a Co-25N i -0,7M n -F e plate having the same dimensions and the same processing as the t-(J).
Ｎ ７５Ａｕ−２０Ａｇ−Ｎｉ板とＦｅ板を、前記（
イ〕と同寸法、同加工によりクラッド材を得た。N75Au-20Ag-Ni plate and Fe plate were
A cladding material was obtained using the same dimensions and processing as in A].
’Ｊ−１７０Ａ ｕ −Ｐ ｄ板と６５Ｃｕ−Ｚｎ板を
、前記（イ］と同寸法、同加工によシフラッド材を得た
。'J-170A u-P d board and 65Cu-Zn board were made to have the same dimensions and the same processing as in (A) above to obtain Shifrad materials.
チ 厚さ０．５−１巾３０閣、長さ１００．Ｃ１７５Ｃ
１７５Ａｕ−２０Ａ板と、厚さ１．５鴎、巾３０ｗ１長
さｌｏｏｗ＋の６０Ｐｄ−Ａｇ板と、厚さ８１１Ｉ１１
巾３０１１１１％ 長さ１００＋ｅ＋（Ｄ７０Ｃｕ−
Ｎｉ板との３層を重ね合せて熱間圧着した後、前記１（
Ｊと同じ寸法、同加工によりクラッド材を得た。Chi Thickness 0.5-1 Width 30mm, Length 100mm. C175C
175Au-20A plate, 60Pd-Ag plate with thickness 1.5mm, width 30w1 length low+, and thickness 811I11
Width 301111% Length 100+e+(D70Cu-
After overlapping and hot-pressing the three layers with the Ni plate, the above 1 (
A cladding material was obtained with the same dimensions and processing as J.
次に上記イ）〜例に示した８種のクラッド材を、厚さ１
．５閣のエポキシ樹脂による基板に、ニトリルゴム系接
着剤により、併列状Ｋｇ着し１５０℃にて１時間加圧し
て接着した。Next, the 8 types of cladding materials shown in the above examples
．． A nitrile rubber-based adhesive was used to adhere Kg in parallel to a board made of a five-layer epoxy resin, and the adhesive was bonded by applying pressure at 150° C. for 1 hour.
さらに上記本発明によるものと比較するため、上記基板
に同じ接着条件によって、以下の金系ラミネートを接着
した。Further, for comparison with the above-mentioned one according to the present invention, the following gold-based laminate was bonded to the above-mentioned substrate under the same bonding conditions.
（す」 厚さ０． ｌ ｍｓ 巾１０ｍ５長さ１５０ｍ
ｃ）Ａｕ箔
懐） 同寸法の８０Ａｕ−Ａｇ箔
（４）同寸法の７０Ａｕ−Ｐｄ箔
（７１同寸法の７５Ａｕ−２０Ａｇ−Ｎｉ箔次に上記上
）〜し）につき、その引き剥し強度を測定した結果、１
表の如く本発明による場合には、ｌすｌ −Ｆ）の従来
例に比し、何れも２倍以上の接着強度が得ら扛ることを
、確認することができた。(S) Thickness 0.l ms Width 10m 5 Length 150m
c) Au foil foil) Measure the peel strength of 80Au-Ag foil of the same size (4) 70Au-Pd foil of the same size (71 75Au-20Ag-Ni foil of the same size) As a result, 1
As shown in the table, it was confirmed that the adhesive strength according to the present invention was more than twice that of the conventional example (I-F).
表
〔発明の効果〕
本発明は前記のようＫして構成したものである丸め、金
系ラミネートに対する機械的または化学的粗面処理工程
が不要となり、クラッド材の製造と接着作業だけですむ
から、量産性が大巾に改善でき、金系ラミネートはクラ
ッド材の製造工程にて、充分に薄くすることが支障な〈
実施できるので、金の節約ができ安価な製品を提供でき
ると共に、基板に対する接着強度が２倍以上となシ、ど
のような使用条件下でも実用上問題のない金系ラミネー
ト基板が得られる。Table [Effects of the Invention] The present invention eliminates the need for mechanical or chemical surface roughening processes for rounding and gold-based laminates constructed with K as described above, and only requires the production and bonding of the cladding material. , mass productivity can be greatly improved, and gold-based laminates do not have to be made sufficiently thin during the cladding material manufacturing process.
Since it can be carried out, it is possible to save money and provide an inexpensive product, and at the same time, it is possible to obtain a gold-based laminate substrate that has more than double the adhesive strength to the substrate and has no practical problems under any usage conditions.
第１図は本発明に係る金系ラミネート基板の正面説明図
、第２図は同基板の素材となるクラッド材につきその製
造途上状態を示した正面説明図、第３図は同クラッド材
の正面説明図である。
１・・・・・金系ラミネート
２・・・・・中間層材
３・・・・・接着剤
４・・・・・基 板
６拳−・ｅ・クラッド材Fig. 1 is an explanatory front view of a gold-based laminate substrate according to the present invention, Fig. 2 is an explanatory front view showing the clad material that is the material of the substrate, and the state in which it is being manufactured, and Fig. 3 is a front view of the clad material. It is an explanatory diagram. 1...Gold-based laminate 2...Intermediate layer material 3...Adhesive 4...Substrate 6--e-clad material
Claims (2)
、ニッケル、コバルト、錫、亜鉛、パラジウム、銀また
はこれらの合金である一層以上の中間層材とによるクラ
ッド材と、フェノール樹脂、エポキシ樹脂等による合成
樹脂製の基板とを、上記中間層材と同上基板との間に介
装の接着剤にて接合してなることを特徴とする金系ラミ
ネート基板。(1) A cladding material consisting of a gold-based laminate made of gold or a gold alloy, one or more interlayer materials made of copper, iron, nickel, cobalt, tin, zinc, palladium, silver or an alloy thereof, and a phenolic resin or epoxy. 1. A gold-based laminate substrate, characterized in that a substrate made of a synthetic resin such as resin is bonded between the intermediate layer material and the substrate using an intervening adhesive.
ね合せて熱間圧着したものを、冷間圧延してなるもので
ある特許請求の範囲第１項記載の金系ラミネート基板。(2) The gold-based laminate substrate according to claim 1, wherein the cladding material is obtained by cold rolling a gold-based laminate and an intermediate layer material that are superimposed and hot-pressed together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13692784A JPS6114946A (en) | 1984-07-02 | 1984-07-02 | Gold group laminated substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13692784A JPS6114946A (en) | 1984-07-02 | 1984-07-02 | Gold group laminated substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6114946A true JPS6114946A (en) | 1986-01-23 |
Family
ID=15186815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13692784A Pending JPS6114946A (en) | 1984-07-02 | 1984-07-02 | Gold group laminated substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6114946A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5225868A (en) * | 1975-08-20 | 1977-02-26 | Sekisui Chemical Co Ltd | Method of producing thermoplastic resin bend |
| JPS5831743A (en) * | 1981-08-20 | 1983-02-24 | 株式会社 麗光 | Au evaporated film |
| JPS58108131A (en) * | 1981-12-22 | 1983-06-28 | 住友ベークライト株式会社 | Metal evaporated composite body |
-
1984
- 1984-07-02 JP JP13692784A patent/JPS6114946A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5225868A (en) * | 1975-08-20 | 1977-02-26 | Sekisui Chemical Co Ltd | Method of producing thermoplastic resin bend |
| JPS5831743A (en) * | 1981-08-20 | 1983-02-24 | 株式会社 麗光 | Au evaporated film |
| JPS58108131A (en) * | 1981-12-22 | 1983-06-28 | 住友ベークライト株式会社 | Metal evaporated composite body |
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