JPS61149328U - - Google Patents
Info
- Publication number
- JPS61149328U JPS61149328U JP3274485U JP3274485U JPS61149328U JP S61149328 U JPS61149328 U JP S61149328U JP 3274485 U JP3274485 U JP 3274485U JP 3274485 U JP3274485 U JP 3274485U JP S61149328 U JPS61149328 U JP S61149328U
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- chemical liquid
- way valve
- coating device
- piping path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Coating Apparatus (AREA)
Description
第１図は本考案の一実施例による塗布装置の薬
液配管路の概要図、第２図は従来の塗布装置の薬
液配管路の概要図である。
１……塗布液加圧ボツクス、２……溶媒加圧ボ
ツクス、３……Ｎ２供給口、４……塗布液配管路
、５……溶媒配管路、６……塗布液用エアーバル
ブ、７……溶媒用エアーバルブ、８……エアー供
給口、９……エアー供給口、１０……３方弁、１
１……薬液ノズル。
FIG. 1 is a schematic diagram of a chemical liquid piping path of a coating device according to an embodiment of the present invention, and FIG. 2 is a schematic diagram of a chemical liquid piping path of a conventional coating device. DESCRIPTION OF SYMBOLS 1... Coating liquid pressure box, 2... Solvent pressurizing box, 3... N2 supply port, 4... Coating liquid piping path, 5... Solvent piping path, 6... Air valve for coating liquid, 7 ... Air valve for solvent, 8 ... Air supply port, 9 ... Air supply port, 10 ... 3-way valve, 1
1... Chemical liquid nozzle.
Claims (1)
媒配管路とを３方弁を介して接続し、これらの２
つの配管路を３方弁により切り換えることにより
、薬液ノズル部を溶媒によりパージできることを
特徴とした塗布装置。 The coating liquid piping path and the solvent piping path are connected to the chemical liquid nozzle part of the coating device via a three-way valve, and these two
A coating device characterized in that a chemical liquid nozzle section can be purged with a solvent by switching between two piping paths using a three-way valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3274485U JPS61149328U (en) | 1985-03-07 | 1985-03-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3274485U JPS61149328U (en) | 1985-03-07 | 1985-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61149328U true JPS61149328U (en) | 1986-09-16 |
Family
ID=30534543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3274485U Pending JPS61149328U (en) | 1985-03-07 | 1985-03-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61149328U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001239196A (en) * | 2000-02-29 | 2001-09-04 | Matsushita Electric Ind Co Ltd | Paste applying device for die bonding and paste applying method |
-
1985
- 1985-03-07 JP JP3274485U patent/JPS61149328U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001239196A (en) * | 2000-02-29 | 2001-09-04 | Matsushita Electric Ind Co Ltd | Paste applying device for die bonding and paste applying method |
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