JPS61137390A - Ceramic circuit board - Google Patents
Ceramic circuit boardInfo
- Publication number
- JPS61137390A JPS61137390A JP26027684A JP26027684A JPS61137390A JP S61137390 A JPS61137390 A JP S61137390A JP 26027684 A JP26027684 A JP 26027684A JP 26027684 A JP26027684 A JP 26027684A JP S61137390 A JPS61137390 A JP S61137390A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- dividing
- face
- circuit board
- ceramic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は厚膜ＩＣ用のセラミック基板に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to ceramic substrates for thick film ICs.
従来の技術
従来、厚膜ＩＣ等の基板として用いられるセラミック基
板は、生産性を上げるためにセラ４’）り基板を大型化
し、その中へ多数個の独立した回路を並べ、回路形成・
部品実装をした後分割し、個々の独立した回路基板とす
る工法がとられている。Conventional technology Conventionally, in order to increase productivity, ceramic substrates used as substrates for thick-film ICs, etc. have been made larger by ceramic substrates, in which many independent circuits are lined up, and circuit formation/
The method used is to mount components and then divide them into individual circuit boards.
この工程中、セラミック基板を分割するために、セラミ
ック基板の一面に分割の案内となる分割溝を加ニレ、セ
ラミック基板に曲げ応力を加えた時分割溝にそって発生
する応力集中を利用して、正しく分割することをねらっ
ている。この分割溝はセラミック基板の端面かも対向す
る端面まで直線的な一様の深さをもって加工されていた
。During this process, in order to divide the ceramic substrate, a dividing groove is created on one side of the ceramic substrate to guide the dividing process, and the stress concentration generated along the time-dividing groove when bending stress is applied to the ceramic substrate is used. , aims to divide correctly. The dividing grooves were machined to have a uniform depth in a straight line up to the end face of the ceramic substrate or to the opposite end face.
以下図面を参照しながら、上述した従来のセラミック基
板の一例について説明をする。An example of the conventional ceramic substrate mentioned above will be described below with reference to the drawings.
第１図は従来のセラミック基板で、直交する２本の分割
溝を有し、４個の回路へ分割する場合の外観図である。FIG. 1 is an external view of a conventional ceramic substrate that has two orthogonal dividing grooves and is divided into four circuits.
図中１及２は分割溝であり、３は分割後に独立した回路
となる部分の一つである。In the figure, 1 and 2 are dividing grooves, and 3 is one of the parts that will become an independent circuit after division.
分割溝１は基板端面４から、対向する端面６まで直線的
に一様な深さで加工されている。The dividing groove 1 is linearly machined to have a uniform depth from the substrate end surface 4 to the opposing end surface 6.
発明が解決しようとする問題点
しかしながら上記のようなセラミック基板では、分割を
正しく行なう為には分割溝をできるだけ深くすることが
必要である。反面、分割溝を深くシた場合には、回路を
印刷焼成したり、部品を実装したりする時にセラミック
基板に加える外力によって割れてしまう可能性も高くな
るという問題点を有していた。Problems to be Solved by the Invention However, in the above-mentioned ceramic substrate, in order to properly divide the substrate, it is necessary to make the dividing grooves as deep as possible. On the other hand, when the dividing grooves are deep, there is a problem in that there is a high possibility that the ceramic substrate will break due to external force applied to it when printing and firing circuits or mounting components.
本発明は上記問題点に鑑み、回路印刷・焼成や部品実装
時の外カアは割れに＜＜、分割時に正しく割れやすいと
いう性質のセラミック基板を提供するものである。In view of the above-mentioned problems, the present invention provides a ceramic substrate which has a property that the outer surface is not susceptible to cracking during circuit printing/firing or component mounting, and is easily cracked when divided.
問題点を解決するための手段
上記問題点を解決するために本発明のセラミック基板は
、分割溝の深さを基板端面付近で浅く、それ以外の部分
では深くするという特徴を与えた。Means for Solving the Problems In order to solve the above problems, the ceramic substrate of the present invention is characterized in that the depth of the dividing grooves is shallow near the end face of the substrate and deep in other parts.
作 用 本発明は上記の特徴により、次のような利点を得る。For production The present invention obtains the following advantages due to the above characteristics.
すなわち、セラミック基板は一般に非常に硬く、かつ脆
いため、破断は通常端面より始まり、中央部への進む性
質がある。従って端面付近の分割溝を浅くすることによ
り、この周囲の応力集中を低くすることができ、結果と
して破断を発生しにくくする。分割時には、分割溝の極
く近くに、集中的に力を加えることによυ分割を行なう
ことができる。That is, since ceramic substrates are generally very hard and brittle, fracture usually begins at the end face and progresses toward the center. Therefore, by making the dividing groove shallow near the end face, stress concentration around this can be reduced, and as a result, breakage is less likely to occur. When dividing, υ division can be performed by applying concentrated force very close to the dividing groove.
また仮に、分割前にセラミック基板中央部に分割溝にそ
ったクラックが入った場合でも、そのクラックの進行は
端面付近の分割溝が浅くなった部分で止まり、基板の一
部が欠落することを防ぐことができる。Furthermore, even if a crack forms along the dividing groove in the center of the ceramic substrate before dividing, the crack will stop at the shallow part of the dividing groove near the end face, and a part of the substrate will not be lost. It can be prevented.
実施例
以下本発明の一実施例のセラミック基板について、図面
を参照しながら説明する。EXAMPLE Hereinafter, a ceramic substrate according to an example of the present invention will be described with reference to the drawings.
第２図は本発明の一実施例におけるセラミック基板の外
観を示すものである。第１図において、６、了は分割溝
であり、それぞれ基板端面付近の区間６ａ、７ａにおい
て深さが浅く、それ以外の区間６ｂ、７ｂでは相対的に
深くなっている。FIG. 2 shows the appearance of a ceramic substrate in one embodiment of the present invention. In FIG. 1, reference numeral 6 indicates a dividing groove, which is shallow in sections 6a and 7a near the end face of the substrate, and relatively deep in other sections 6b and 7b.
上記構成において、通常の取り扱い状態においては、分
割溝６，７の区間６ａ、７ａの溝浅のなめ、簡単に分割
されてしまうということはなく、また逆に分割する際に
は、区間６ａ 、７ａの部分のみ、強く力を入れれば簡
単に分割することができる。In the above configuration, under normal handling conditions, the sections 6a and 7a of the dividing grooves 6 and 7 will not be easily divided due to shallow grooves, and conversely, when dividing, the sections 6a and 7a will not be easily divided. Only part 7a can be easily divided by applying strong force.
発明の効果
本発明は、セラミック基板の分割溝の深さを適当に設定
することにより、通常取り扱い時における割れの排除と
、分割時における容易さの両方を同時に満足させるもの
でその効果はきわめて大である。Effects of the Invention The present invention satisfies both the elimination of cracking during normal handling and the ease of dividing by setting the depth of the dividing grooves of the ceramic substrate appropriately, and its effects are extremely large. It is.
第１図は従来例におけるセラミック基板の斜視図、第２
図は本発明の一実施例におけるセラミック基板の斜視図
である。
６．７・・・・・・分割溝。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図Figure 1 is a perspective view of a conventional ceramic substrate, Figure 2 is a perspective view of a ceramic substrate in a conventional example;
The figure is a perspective view of a ceramic substrate in one embodiment of the present invention. 6.7... Division groove. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2
Claims (1)
する端面まで加工されたセラミック基板において、この
分割溝がセラミック基板端面付近で浅く、それ以外では
相対的に深いという、不均一な深くしたことを特徴とす
るセラミック基板。In a ceramic substrate in which a dividing groove that serves as a guide for dividing is machined from one end face to the opposite end face, the dividing groove is shallow near the end face of the ceramic substrate and relatively deep elsewhere. A ceramic substrate characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26027684A JPS61137390A (en) | 1984-12-10 | 1984-12-10 | Ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26027684A JPS61137390A (en) | 1984-12-10 | 1984-12-10 | Ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61137390A true JPS61137390A (en) | 1986-06-25 |
Family
ID=17345802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26027684A Pending JPS61137390A (en) | 1984-12-10 | 1984-12-10 | Ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61137390A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6787861B2 (en) | 2000-06-26 | 2004-09-07 | North Carolina State University | Non-crystalline oxides for use in microelectronic, optical, and other applications |
| JP2008016587A (en) * | 2006-07-05 | 2008-01-24 | Denso Corp | Method of manufacturing ceramic laminated layer substrate |
-
1984
- 1984-12-10 JP JP26027684A patent/JPS61137390A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6787861B2 (en) | 2000-06-26 | 2004-09-07 | North Carolina State University | Non-crystalline oxides for use in microelectronic, optical, and other applications |
| JP2008016587A (en) * | 2006-07-05 | 2008-01-24 | Denso Corp | Method of manufacturing ceramic laminated layer substrate |
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