JPS61136695A - Plating method - Google Patents

Abstract

PURPOSE:To form a noble metal plating layer having excellent adhesiveness with a simple plating operation by disposing auxiliary cathodes on the outside of materials to be plated, dipping the materials into a plating bath by means of a hook, to subject the materials to substratum plating then removing the auxiliary cathodes and dipping the materials in an Au or Ag plating bath. CONSTITUTION:The metallic parts 3 to be plated are attached in a vertically lifted state to the hook 1 and the auxiliary cathodes 2 are attached by fittings 4 to the hook 1 on the outside of the parts 3. The parts are then dipped in the substratum plating bath and electricity is conducted to the bath to form the substratum metallic plating layer on the surface of the parts 3 to a uniform thickness. Only the cathodes 2 are thereafter removed and the parts are dipped into the Au or Ag plating bath to form the Au or Ag plating layer with the excellent adhesiveness on the substratum plating layer. Cu plating is executed as the substratum plating if the parts 3 are made of an Al or Mg metal and Ni plating is used as the substratum plating if said parts are of Ti, Ni, Mo metals or carbon fiber reinforced plastics.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は物品のめつき方法に関するものである。[Detailed description of the invention] [Industrial application field] This invention relates to a method for plating articles.

〔従来の技術〕[Conventional technology]

周知のように、を気機器の動向は小型化、軽量化、省電
力、高１！＃友化、多機能等の要素を総合的に追求して
おり、この動向に伴って部品数も少なくなり、形状も複
雑となってきている〇そして、物品に使用する材料も軽
量化を目的とする場合はアルミニウム又はアルミニウム
合金。As we all know, the trends in equipment are miniaturization, weight reduction, power saving, and high efficiency! #We are comprehensively pursuing elements such as friendliness and multi-functionality, and along with this trend, the number of parts is decreasing and shapes are becoming more complex〇And the materials used for products are also aimed at reducing weight. If so, aluminum or aluminum alloy.

マグネシウム又はマグネシウム合金、ＣＩＦＲＰ、、％
るい蝶特に強度が必要な場合にはチタニウム又はチタニ
ウム合金Ｓ：Ｓバール、ニッケル又はニッケル合金、あ
るいＬ特に熱膨張を最小にしたい一合忙はインバー、モ
リブデ／又はモリブデン合金等を用いている。Magnesium or magnesium alloy, CIFRP, %
When particularly strong strength is required, titanium or titanium alloys are used, or invar, molybdenum/molybdenum alloys, etc. are used when it is desired to minimize thermal expansion. .

高い導電率を必要とする物品の表面には腐食や錆によっ
て抵抗が増加するのを防止するために銀や金めつきをし
ている。The surfaces of articles that require high electrical conductivity are plated with silver or gold to prevent resistance from increasing due to corrosion or rust.

上記の物品に銀又は金めつきを行う揚合、物品の討料に
よって下地めっきの種類は異なって−・る。When silver or gold plating is applied to the above items, the type of base plating varies depending on the material used.

例えは、設置される環境によって腐食しやすい金属９例
えばアルミニウム又はアルミニウム合金。For example, metals 9, such as aluminum or aluminum alloys, are susceptible to corrosion depending on the environment in which they are installed.

マグネシウム又はマグネシウム合金には銀又は金めつき
の下地めっきとして銅めつきを用い、上記の金属以外２
例えはチタニウム又はチタニウム合金、コパール、ニッ
ケル又はニッケル合金、インバー、モリブデン又はモリ
ブデン合金には銀又は金めつきの下地めっきとしてニッ
ケルめっきを用いることが多い。Copper plating is used as a base plating for silver or gold plating for magnesium or magnesium alloys, and 2.
For example, nickel plating is often used as a base plating for silver or gold plating for titanium or titanium alloys, copal, nickel or nickel alloys, invar, molybdenum or molybdenum alloys.

銅めつぎ、特に硫酸銅めっき又はニッケルめっきは種々
めるめつき浴の中で均一電着性は低く。Copper plating, especially copper sulfate plating or nickel plating, has low uniform electrodeposition properties in various plating baths.

特に複雑な形状上した物品表面のめつき厚さの均一性は
悪くなる。In particular, the uniformity of the plating thickness on the surface of an article having a complicated shape becomes poor.

従って、物品の各部の電流分布が可能な限り同じになる
ように遮蔽板又は補助陰極又は補助陽極などを使用する
のが表面処理分野の常識となっている。Therefore, it is common knowledge in the field of surface treatment to use a shielding plate, an auxiliary cathode, an auxiliary anode, etc. so that the current distribution in each part of the article is as uniform as possible.

第２図は従来のめつき方法を示したものである０図向に
おいて、（ｌ）は引掛は具、（２１は補助陰極、（３；
は物品である。物品（３）を引掛は具（１）に引掛けた
後。Figure 2 shows the conventional plating method. In the 0 direction, (l) is the hooking tool, (21 is the auxiliary cathode, (3;
is an article. After the article (3) is hooked on the tool (1).

引掛は具（１）の外側に補助陰極（２）を固定し、物品
（３１を縦吊りの状態でめつき槽に浸漬して常法により
めっきを行って（・た。For the hook, the auxiliary cathode (2) was fixed on the outside of the tool (1), the article (31) was immersed in a plating tank in a vertically suspended state, and plating was performed by a conventional method.

物品（３）の表面に下地めっきを行なった後、物品（３
）および引掛は具（すを補助陰極（２）から取りはずし
。After performing base plating on the surface of article (3),
) and the hook from the auxiliary cathode (2).

均一電着性のよい銀又は金めつきを行ない、補助陰極（
２）に高価な銀又は金が付着しないようにしていた。The auxiliary cathode (
2) to prevent expensive silver or gold from adhering to it.

かかるｔ・つき方法では、補助陰極からの物品および引
掛は具の脱着に要する時間かがかり、しかもめつき作業
が断続するためめっき皮膜の密着不良が発生し易い。In such a T-sticking method, it takes time to attach and detach the article and the hook from the auxiliary cathode, and furthermore, the plating operation is intermittent, which tends to cause poor adhesion of the plating film.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

この発明は上記した技術的諸問題を解決するためになさ
れたものであり、その目的は比較的簡便な方法により、
物品表面のめつき膜厚分布を均一化させ、めっき皮膜を
物品素地金属と密着させ品質的に安定しためつき方法お
よび物品と引掛は具を補助陰極から容易に脱着できるめ
っき方法を提供するにある。This invention was made in order to solve the above-mentioned technical problems, and its purpose is to solve the above technical problems by a relatively simple method.
To provide a plating method that uniformizes the distribution of the plating film thickness on the surface of an article, brings the plating film into close contact with the base metal of the article, and has a stable quality, and a plating method that allows the article and the hook to be easily attached and detached from the auxiliary cathode. be.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係る物品表面のめつき方法は鋭意検討を重ね
た結果、補助陰極を引掛は具に取り付け。As a result of extensive research into the method of plating the surface of articles according to this invention, an auxiliary cathode was attached to the hook.

脱着容易とし９通電させめっきすることにより上記目的
が達成できることをみ（・だし１本発明を完−成するに
到った。It has been found that the above object can be achieved by making it easy to attach and detach, and by applying electricity and plating. (1) The present invention has been completed.

即ち２本発明のめつき方法はめつきしようとする物品を
引掛は具に引掛けた後、引掛は具に設けた取付具に所要
形状の補助陰極を取シ付ける０次に物品を引掛は具に縦
吊りにした状態にてめつぎ槽内に浸漬させ、補助陰極に
通電しつつ所要の下地めっきを行う。下地めっきが完了
したのち引掛は具の取付具から補助陰極を取りはずし、
物品を引掛は具に縦吊υにして銀又は金めつきを行うの
である。In other words, in the plating method of the present invention, after the article to be plated is hooked on the hook, an auxiliary cathode of the desired shape is attached to the fixture provided on the hook. The specimen is suspended vertically and immersed in a plating tank, and the required base plating is performed while energizing the auxiliary cathode. After the base plating is completed, remove the auxiliary cathode from the hook fixture.
The item is hung vertically on the hook and plated with silver or gold.

以下において本発明を更に詳しく説明する。The invention will be explained in more detail below.

本発明のめつき方法はめっきすべき物品を引掛は具に引
掛けた後、所要形状の補助陰極を引掛は具に設けた取付
具ｔｉｃ物品を引掛けた外側に取り付ける。In the plating method of the present invention, after the article to be plated is hooked on a hook, an auxiliary cathode of a desired shape is attached to the outside of the hooked article.

かかる補助陰極はアルミニウム又はアルミニウム合金、
銅又は銅合金、チタニウム又はチタニウム合金、ステン
レス鋼、白金を用いることが可能であり、加工性および
経済性および使用する薬品のａｉ類によって選択するこ
とが好ましい。Such an auxiliary cathode is made of aluminum or an aluminum alloy;
Copper or copper alloys, titanium or titanium alloys, stainless steel, and platinum can be used, and are preferably selected depending on workability, economic efficiency, and the AI of the chemicals used.

本発明のめつき方法はついで補助陰極を取９付けた状態
で物品を引掛は具に縦吊りにして、常法のめつき前処理
を行った後、補助陰極に通電し所要の下地めっき２例え
ば銅めっき又はニッケルめっきを行うのである＠ 所要の下地めっきが完了すると、即ぐ補助陰極のみを引
掛は具から取り外した後、物品を引掛は具に縦吊りにし
て銀又は金めつきを行うのである。In the plating method of the present invention, the article is hung vertically on a hook with the auxiliary cathode 9 attached, and after performing a conventional plating pretreatment, the auxiliary cathode is energized to perform the required base plating 2. For example, copper plating or nickel plating is performed.@ When the required base plating is completed, immediately remove only the auxiliary cathode from the hook, then hang the item vertically on the hook and perform silver or gold plating. It is.

所要の下地めっきが完了してから、補助陰極のみを引掛
は具から取り外すのは高価な銀又は金が補助陰極に付着
し消耗するのを防止するために行うのである。After the required base plating is completed, only the auxiliary cathode is removed from the hook to prevent expensive silver or gold from adhering to the auxiliary cathode and causing it to wear out.

〔作用〕[Effect]

この発明においては補助陰極の滑脱を容易にして（・る
ため、連続的にめっき作業ができ、めっき皮膜の密着不
良がなくなりしかもめつき膜厚分布もよくなるので品質
的に安定しためつき処理ができる。In this invention, the auxiliary cathode is made easy to slide off (・), so plating can be performed continuously, there is no poor adhesion of the plating film, and the plating film thickness distribution is also improved, so the plating process is stable in terms of quality. can.

〔実施例〕〔Example〕

以下において実施例を掲げこの発明を更に詳しく説明す
る。The present invention will be explained in more detail below with reference to Examples.

第１図は本発明の一夾施例を示す平面図である。FIG. 1 is a plan view showing one embodiment of the present invention.

図面においてｙ　ｆ１）ａ引掛は具、（２）は補助陰極
。In the drawing, y f1) a hook is a tool, and (2) is an auxiliary cathode.

（３）は物品、（４１は取付具である。(3) is an article, and (41 is a fixture).

引掛は具（１）に物品（３）全引掛けた後、物品の外側
に補助陰極（２）を配置し、引掛は具１））に取り付け
た取付具（４１に補助陰極【２）を取り付ける。After hooking the entire article (3) onto the hook (1), place the auxiliary cathode (2) on the outside of the article; Attach.

引掛は具＋１）に物品（３）を縦吊りＫした状態で常法
によりめっき前処理を行った後、所要の下地めっき２例
えは銅又はニッケルめっきを補助陰極（２）に通電しな
から行った。この結果、電流が集中する物品の端部の電
流が補助陰極の方へ流れ、物品には均一した電流が流れ
るのでめっき皮膜がざらついたり、こぶ状になることが
なく、よいめっき皮膜が得ら扛た。After carrying out plating pre-treatment using the usual method with the article (3) hanging vertically on the hooking tool +1), the required undercoat plating (for example, copper or nickel plating) is applied without energizing the auxiliary cathode (2). went. As a result, the current at the edge of the article, where the current is concentrated, flows toward the auxiliary cathode, and a uniform current flows through the article, preventing the plating film from becoming rough or lumpy, making it possible to obtain a good plating film. I was kidnapped.

欣喪の下地めっきを行った後、即ぐ補助陰極（２１のみ
を引掛は具（１）から取り外し銀又龜金めつきを行った
。After performing the base plating for mourning, immediately the auxiliary cathode (only 21) was removed from the hooking tool (1) and silver or gold plating was performed.

外観のよい下地めっき皮膜が得られた上に銀又は金めつ
きを行ったので、仕上がりのよいめっき皮膜が得られ、
しかも密着のよいめっき皮膜が得られた。Silver or gold plating is performed on top of a base plating film with a good appearance, so a plating film with a good finish can be obtained.
Moreover, a plating film with good adhesion was obtained.

〔発明の効果〕〔Effect of the invention〕

以上説明したようにこの発明によればめっき処理が品質
的に安定したものとなった他、めっき作業が連続的とな
り製造コストの低減に寄与するものである。As explained above, according to the present invention, not only the quality of the plating process is stabilized, but also the plating operation is continuous, which contributes to a reduction in manufacturing costs.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の実施例を示す平面図、第２図は従来の
めつき方法を示す平面図であり２図中。 ｔｌ）は引掛は具、（２１は補助陰極、（３）は物品、
（４）は取付具である。 なお２図中同一ある（・は相当部分には同一符号を付し
て示しである〇 第　　１　　図 第　　２　　図 １　：引接す表 ２：柿Ｍ冷檀 ３：′Ｊ４１品 午：狼月ｊＪｘFIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a plan view showing a conventional plating method. tl) is the hook, (21 is the auxiliary cathode, (3) is the article,
(4) is a fixture. In addition, the same parts in the two figures (・ indicate the same parts with the same symbols) Figure 1 Figure 2 Figure 1: Attaching table 2: Persimmon M reidan 3: 'J41 product: Rozuki jJx

Claims (2)

【特許請求の範囲】[Claims] （１）所要形状の物品表面のめつき工程において、上記
物品の外側に着脱できる補助陰極を設け、上記物品を縦
吊りにしてめつき槽内に浸漬せしめ、共通な下地めつき
を行なう間（例：銅めつき又はニッケルめつき）上記補
助陰極を取り付けた状態で処理し、貴金属である銀めつ
き又は金めつきを行なう際上記補助陰極を除去した状態
でめつき処理を行なうことを特徴とするめつき方法。(1) In the process of plating the surface of an article with a desired shape, a removable auxiliary cathode is provided on the outside of the article, and the article is hung vertically and immersed in a plating bath, and during common base plating ( (Example: copper plating or nickel plating) The process is performed with the auxiliary cathode attached, and when performing silver plating or gold plating, which is a precious metal, the plating process is performed with the auxiliary cathode removed. The method of plating. （２）物品がアルミニウム又はアルミニウム合金、銅又
は銅合金、マグネシウム又はマグネシウム合金、コパー
ル、インバー、モリブデン又はモリブデン合金、ニッケ
ル又はニッケル合金、チタニウム又はチタニウム合金、
炭素繊維強化プラスチック（ＣＦＲＰ）から成るもので
あることを特徴とする特許請求の範囲第（１）項記載の
めつき方法。(2) The article is aluminum or aluminum alloy, copper or copper alloy, magnesium or magnesium alloy, copal, invar, molybdenum or molybdenum alloy, nickel or nickel alloy, titanium or titanium alloy,
The plating method according to claim 1, wherein the plating method is made of carbon fiber reinforced plastic (CFRP).