JPS61132536A - Glass composition - Google Patents
Glass compositionInfo
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- JPS61132536A JPS61132536A JP25481984A JP25481984A JPS61132536A JP S61132536 A JPS61132536 A JP S61132536A JP 25481984 A JP25481984 A JP 25481984A JP 25481984 A JP25481984 A JP 25481984A JP S61132536 A JPS61132536 A JP S61132536A
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Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、歪点が６５０″Ｃ以上、好ましくは６７０℃
以上で、アルカリ金属酸化物及び酸化鉛を含有しないガ
ラス組成物に関し、溶融性・耐酸性に優れ、大量生産が
可能で安価な各種基板用ガラスとして特に有用なガラス
組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to strain points of 650"C or higher, preferably 670"C or higher.
The above describes a glass composition that does not contain alkali metal oxides and lead oxide, and is particularly useful as a glass for various substrates that has excellent meltability and acid resistance, can be mass-produced, and is inexpensive.
従来技術
近年、電子工業の発展に伴ない、同分野において透明基
板としてソーダ石灰ガラスや石英ガラス等種々の材質の
ガラスが使用されているが、これらの基板ガラスは、例
えば透明導電膜、フォトレジスト膜、クロム膜、更には
各種半導体物質等の成膜、熱処理、エツチング等の処理
が施されるため、かなり苛酷な条件下に置かれる。とり
わけ熱処理の温度は、成膜される物質の特性を左右する
因子である場合が多く、温度条件は特に限定される。Background Art In recent years, with the development of the electronic industry, glasses made of various materials such as soda lime glass and quartz glass have been used as transparent substrates in the same field. Because films, chromium films, and various semiconductor materials are formed, heat treatment, etching, and other treatments are performed, they are placed under fairly harsh conditions. In particular, the temperature of heat treatment is often a factor that influences the characteristics of the substance to be formed, and the temperature conditions are particularly limited.
ソーダ石灰ガラスあるいは硬質硼珪酸ガラス等といった
ガラスは、歪点が４５０〜５５０℃であり・これらのガ
ラスを歪点より高い温度で熱処理すると軟化変形してし
まい基板用ガラスとしての役目を果たさなくなるため、
熱処理温度が歪点以下の場合にしか使用できない。Glasses such as soda lime glass and hard borosilicate glass have a strain point of 450 to 550°C. If these glasses are heat-treated at a temperature higher than the strain point, they will soften and deform, and will no longer function as glass for substrates. ,
It can only be used when the heat treatment temperature is below the strain point.
しかしながら薄膜トランジスタを利用したド。However, it uses thin film transistors.
トマトリクス型液晶等の平面ディスプレイは、その多く
が６００℃以上の温度で熱処理され、またこのような用
途の場合、ガラス中にアルカリ金属酸化物が含有されて
いると熱処理中にアルカリイオンが成膜された半導体物
質あるいは透明導電膜側に拡散し、特性上の劣化をまね
くため、歪点が６チ０℃以上、好ましくは６７０℃以上
と高く、アルカリ金属酸化物を含有しないガラスが求め
られてきた。Most flat displays such as tomatotrix liquid crystals are heat-treated at temperatures of 600°C or higher, and in the case of such uses, if the glass contains alkali metal oxides, alkali ions may be formed during heat treatment. Because it diffuses into the filmed semiconductor material or transparent conductive film side, leading to deterioration of characteristics, a glass with a high strain point of 6°C or higher, preferably 670°C or higher, and does not contain alkali metal oxides is required. It's here.
これらの要求を満足するガラスとして、一部利用されて
いるものとして石英ガラスがある。石英ガラスは歪点が
１０００℃以上と高く、アルカリ金属酸化物を含有しな
いため、前記の要求を満足するものであるが、コストが
高いという難点がある。Quartz glass is a glass that is partially used as a glass that satisfies these requirements. Quartz glass has a high strain point of 1000° C. or higher and does not contain alkali metal oxides, so it satisfies the above requirements, but it has the drawback of high cost.
石英ガラス以外にも歪点が高く、アルカリ金属酸化物の
含有量の少ないガラスとして、アルミノシリケート系の
ガラスがある。この系のガラ′スの歪点は６５０〜７０
０’Ｃで、主としてタングステン−ハロゲン電球用とし
て、あるいは一部基板用として用いられている。In addition to quartz glass, there is aluminosilicate glass, which has a high strain point and a low content of alkali metal oxides. The strain point of this type of glass is 650-70
0'C, and is mainly used for tungsten-halogen light bulbs or for some substrates.
しかしながら、タングステン−ハロゲン電球用として用
いる場合、歪点の要求が７００℃を超えるものが多く、
そのためガラスの高温粘度が硬く、溶融性に乏しいため
に溶融欠陥の少ないガラスを得ることは難しい。また歪
点が７００℃以下のものについても、管ガラスに成型す
るため液相温度と粘度との好ましい関係が必要であるこ
と、及びモリブーｒ″シ線を封入するためにそれに適合
した熱膨張係数が必要であること等の理由により組成上
の制約があり、そのため溶融性が悪くなりがちである。However, when used for tungsten-halogen bulbs, many have strain point requirements exceeding 700°C.
Therefore, it is difficult to obtain glass with few melting defects because the glass has a hard high-temperature viscosity and poor meltability. In addition, for materials with a strain point of 700°C or less, it is necessary to have a favorable relationship between liquidus temperature and viscosity in order to mold them into tube glass, and a thermal expansion coefficient that is suitable for encapsulating molybou r'' wire. There are compositional restrictions due to the necessity of
基板用として用いる場合は、歪点の要求が６５０℃前後
のものが多く、その点では満足するものであるが、この
用途における従来のほとんどのガラスはアルカリ金属酸
化物を含有していたり、溶融性を高めるためにガラス溶
融時及びガラス使用時に環境、公害面で悪影響を及ぼす
酸化鉛を含有していた。また、ガラス自体の耐酸性に組
成的に配慮が施されていないため、基板上の膜をエツチ
ング処理する際にガラス表面の劣化を起すものもあった
。When used for substrates, the strain point requirement is often around 650°C, which is satisfactory, but most conventional glasses for this purpose contain alkali metal oxides or In order to improve its properties, it contained lead oxide, which had a negative impact on the environment and pollution when glass was melted and used. Further, since no consideration was given to the acid resistance of the glass itself, the glass surface sometimes deteriorated when etching the film on the substrate.
更には、これらのガラスのほとんどが液相温度が高く、
その温度でのガラスの粘度が１０′。ｉイズ以下の失透
性に富んだガラスであるため、溶融及び成型上の制約が
大きく、大型のタンク炉において大量生産するのが難し
く、事実上高価なガラスとなっている。Furthermore, most of these glasses have high liquidus temperatures;
The viscosity of the glass at that temperature is 10'. Since it is a glass with high devitrification properties of less than i.
発明の目的
本発明は、以上の問題を解決するために、６００〜６５
０’Ｃ以上の基板用ガラスに対する熱処理に耐えつるよ
うに歪点が６５０’Ｃ以上、好ましくは６７０℃以上の
歪点を有し、成膜された半導体物質膜あるいは透明導電
膜を劣化するアルカリ金属酸化物を実質的に含有せず、
ガラス溶融時及び使用時に環境面で問題となる酸化鉛を
含有せず、各種エツチング処理にも耐えうる耐酸性を有
し、透明基板ガラスとして好ましくない溶融欠陥を発生
しにくいような溶融性に優れた高温粘度の軟かいガラス
であり、具体的にはガラスのｌｏ ２．５ボイズの粘度
を有する温度が１４００’Ｃ以下であり、液相温度にお
ける粘度が１０４．０ボイズ以上であって、耐失透性に
優れ、安価に大量生産できる基板用ガラスを供すること
を目的としている。Purpose of the Invention The present invention aims to solve the above problems.
Alkali having a strain point of 650°C or higher, preferably 670°C or higher so as to withstand heat treatment for substrate glass at 0'C or higher, and that deteriorates the formed semiconductor material film or transparent conductive film. Contains substantially no metal oxides,
It does not contain lead oxide, which is an environmental problem during glass melting and use, has acid resistance that can withstand various etching treatments, and has excellent melting properties that prevent undesirable melting defects as a transparent substrate glass. It is a soft glass with a high temperature viscosity, specifically, the temperature at which the glass has a lo 2.5 voids viscosity is 1400'C or less, the viscosity at the liquidus temperature is 104.0 voids or more, and it has a high temperature resistance. The objective is to provide a glass for substrates that has excellent devitrification properties and can be mass-produced at low cost.
発明の構成
本発明のガラス組成物は、歪点が６５０℃以上であり、
重量百分率で、ＳｉＯ２５４〜６０％、Ａｌ４０３１４
〜１８ ％ 、 Ｂ、０．２〜７ ％、 ＭｇＯａ
５〜１２ ％、 （ｌａ。Constitution of the Invention The glass composition of the present invention has a strain point of 650°C or higher,
In weight percentage, SiO254-60%, Al40314
~18%, B, 0.2-7%, MgOa
5-12%, (la.
５〜９％、ｚｎ００〜３％、Ｂ＆０２〜８％、ＰｔＱＯ
〜３％、Ｔｉｅ、 ０〜３％の組成を有することを特徴
とする。5-9%, zn00-3%, B&02-8%, PtQO
~3%, Tie, 0~3%.
本発明のガラス組成物は、好ましくは、歪点が６５０℃
以上であり、重量百分率で、Ｓｉｎ、 ５４〜５７％、
Ａｌ＊Ｏｓ １５〜１７％、］３．ｏ、 ４〜７％、Ｍ
ｇＯａ５〜９％、Ｏａｏ ７〜９％、ＺｎＯ０〜３％、
ＢａＯ３〜７％、Ｐ、Ｏ。The glass composition of the present invention preferably has a strain point of 650°C.
or more, and in weight percentage, Sin, 54-57%,
Al*Os 15-17%, ]3. o, 4-7%, M
gOa 5-9%, Oao 7-9%, ZnO 0-3%,
BaO 3-7%, P, O.
０〜３％、ＴｉＯ，０〜３％、の組成を有し、（ＭｇＯ
＋ａａｏ）／ＳｉＯ，＝α２６〜α３２、ＭｇＯ／Ｃ！
ａｏ ＝α７２〜１．１０であることを特徴とする。It has a composition of 0-3%, TiO, 0-3%, (MgO
+aao)/SiO, = α26~α32, MgO/C!
It is characterized in that ao = α72 to 1.10.
本発明のガラス組成物は、さらに好末しくは歪点が６７
０℃以上であり、重量百分率で、５ｉｎｓ５４５〜５ａ
５％、Ａｌ！０，１６〜１７％、Ｂｔｕｓ ４５〜ａ５
％、Ｍｇ０７〜＆５％、（ａｏ ７〜９％、ＺｎＯ１〜
３％、ＢａＯ３〜７％、Ｐｌｏｇ ０〜２％、Ｔｉｅ
、 ０〜２％の組成を有し、（ＭｇＯ−１−ＯａＱ
）７’ｓｉｏ、〜０．２６〜α３２、ＭｇＱ／（圓＝α
７２〜１．１０であることを特徴とする。The glass composition of the present invention further preferably has a strain point of 67
0°C or higher, weight percentage, 5ins545~5a
5%, Al! 0.16-17%, Btus 45-a5
%, Mg07~&5%, (ao 7~9%, ZnO1~
3%, BaO3-7%, Plog 0-2%, Tie
, has a composition of 0-2%, (MgO-1-OaQ
)7'sio, ~0.26~α32, MgQ/(en = α
72 to 1.10.
更に本発明のガラス組成物は、実質的にアルカリ金属酸
化物及び酸化鉛を含有しないことを特徴とする。Furthermore, the glass composition of the present invention is characterized in that it does not substantially contain alkali metal oxides and lead oxides.
以下に本発明のガラス組成物の限定理由について説明す
る。The reasons for limiting the glass composition of the present invention will be explained below.
本発明のガラス組成物のＳｉｎ、含量は、５４〜６０重
量％、好ましくは５４〜５７重量％、さらに好ましくは
５４５〜５ａ５重量％である。５４重量％より少ない場
合は、歪点が低くなりすぎ、６０重量％より多い場合は
、溶融性が悪くなると共に液相温度が著しく上昇する。The Sin content of the glass composition of the present invention is 54 to 60% by weight, preferably 54 to 57% by weight, and more preferably 545 to 5a5% by weight. If it is less than 54% by weight, the strain point will become too low, and if it is more than 60% by weight, the meltability will deteriorate and the liquidus temperature will rise significantly.
Ａｌ、ＯＪは、ｓｉｏ、 、ＯａＱ ＭｇＯと共に液晶
温度に影響を与える成分で、その含量は、１４〜１８重
量％、好ましくは１５〜１７重量％、さらに好ましくは
１６〜１７重量％である。１４重量％より少ない場合、
あるいは１８重量％より多い場合は、液相温度が著しく
上昇する。Al and OJ are components that affect the liquid crystal temperature together with sio, OaQ and MgO, and their content is 14 to 18% by weight, preferably 15 to 17% by weight, and more preferably 16 to 17% by weight. If it is less than 14% by weight,
Alternatively, if it exceeds 18% by weight, the liquidus temperature will rise significantly.
Ｂ、 Ｏ，は、高温粘度を下げ、溶融性を改善すると共
に、耐失透性を悪化させない成分として添加されるもの
で、そ・の含量は、２〜７重量％、好ましくは４〜７重
量％、さらに好ましくは４５〜６．５重量％である。２
重量％より少ない場合は、上記の効果を得られず、７重
量％より多い場合は、歪点が低くなる。B, O, are added as components that lower high temperature viscosity and improve meltability, and do not worsen devitrification resistance, and their content is 2 to 7% by weight, preferably 4 to 7% by weight. % by weight, more preferably 45 to 6.5% by weight. 2
If it is less than 7% by weight, the above effects cannot be obtained, and if it is more than 7% by weight, the strain point will be low.
ＭｇＯ及びＣａＯは、液相温度に大きく影響を与える成
分であり、ＭｇＯ含量は６．５〜１２重量％、好ましく
はａ５〜９重量％、さらに好ましくは７〜＆５重量％で
あり、ＣＩＬＯ含量は５〜９重量％、好ましくは７〜９
重量％である。ＭｇＯ含量がａ５重量％、ＣａＯ含量が
５重量％より少ない場合は、液相温度を上げると共に高
温粘度を硬くしてしまう。ＭｇＯ及びＣａＯ含量が９重
量％より多い場合は、液相温度を上げると共に歪点を下
げてしまう。MgO and CaO are components that greatly affect the liquidus temperature, and the MgO content is 6.5 to 12% by weight, preferably a5 to 9% by weight, more preferably 7 to &5% by weight, and the CILO content is 5-9% by weight, preferably 7-9%
Weight%. When the MgO content is less than 5% by weight and the CaO content is less than 5% by weight, the liquidus temperature increases and the high temperature viscosity becomes hard. If the MgO and CaO contents are more than 9% by weight, the liquidus temperature will increase and the strain point will decrease.
ＺｎＯは、Ｃ＆０１Ｂ！ＬＯ１ＭｇＯ）一部、！：置換
スル、：、 、！：によって耐酸性を著しく改善すると
共に液相温度に大きな影響を与えずに溶融性を良くする
効果を有し、その含量は、０〜３重量％、より好ましく
は１〜３重量％である。３重量％より多い場合は、耐酸
性の改善効果が小さくなり、歪点が低くなりすぎる。ZnO is C&01B! LO1MgO) Some,! : Substitution Sul, :, ,! : has the effect of significantly improving acid resistance and improving meltability without significantly affecting liquidus temperature, and its content is 0 to 3% by weight, more preferably 1 to 3% by weight. When it is more than 3% by weight, the effect of improving acid resistance becomes small and the strain point becomes too low.
ＢａＯは、液相温度を調節するのに重要な成分であり、
その含量は、２〜８重量％、好ましくは３〜７重量％で
ある。２重量％より少ない場合は、液相温度を著しく上
昇させ、８重量％より多い場合は、耐酸性を悪化させる
。BaO is an important component for regulating liquidus temperature,
Its content is 2-8% by weight, preferably 3-7% by weight. If it is less than 2% by weight, the liquidus temperature will be significantly increased, and if it is more than 8% by weight, acid resistance will be deteriorated.
Ｐ□０．は、ガラス融液の酸性度を上げて酸性耐火物の
侵食を緩和する効果を有する成分で、その含量は０〜３
重量％、より好ましくは０〜２重量％である。３重量％
より多い場合は、液相温度を著しく上昇させる。P□0. is a component that has the effect of increasing the acidity of the glass melt and mitigating the corrosion of acidic refractories, and its content is 0 to 3.
% by weight, more preferably 0-2% by weight. 3% by weight
If the amount is higher, the liquidus temperature will increase significantly.
Ｔ１０．は、ガラスの溶融性を改善する効果を有する成
分で、その含量は０〜３重量％、より好ましくは０〜２
重量％である。３重量％より多い場合′ は、ガラス
を著しく着色すると共に歪点を低下させる。T10. is a component having the effect of improving the meltability of glass, and its content is 0 to 3% by weight, more preferably 0 to 2% by weight.
Weight%. When the amount is more than 3% by weight, the glass is significantly colored and its strain point is lowered.
上記成分以外にも本発明の特徴となるガラス特性が損な
われない限り、５ｒＯ１ＺｒＯ１，５ｂｌＯ１。In addition to the above components, 5rO1ZrO1, 5blO1 as long as the glass properties that characterize the present invention are not impaired.
Ａｓ１Ｏ＠ −、Ｃｓ０ｇ、 Ｆ、、ａｌ、等の成分を
各々１重量％まで添加することができる。Components such as As1O@-, Cs0g, F, and al can be added up to 1% by weight each.
また本発明は、好ましくは（ＭｇＯ＋Ｏ釦）Ａｉｏ、を
α２６〜α３２、ＭｇＯ１０ａＯをα７２〜ＬＩＯ，よ
り好ましくは０８０〜１．００に限定することを特徴と
する。Further, the present invention is characterized in that (MgO+O button) Aio is preferably limited to α26 to α32, and MgO10aO is limited to α72 to LIO, more preferably 080 to 1.00.
（ＭｇＯ＋ Ｃ！ａｏ ）／５ｉｆｔがα２６より小さ
い場合は、耐酸性が悪くなると共に液相温度も上昇し、
０．３２より大きい場合は、液相温度が著しく高くなる
。If (MgO+C!ao)/5ift is smaller than α26, the acid resistance will deteriorate and the liquidus temperature will rise,
When it is larger than 0.32, the liquidus temperature becomes significantly high.
ＭｇＯ１０ａｏがα７２より小さい場合、Ｌｌｏより大
きい場合は、液相温度が著しく高くなる。When MgO10ao is smaller than α72 and larger than Llo, the liquidus temperature becomes significantly high.
更に本発明は、上記のようにガラス組成物の各成分を限
定する以外に、アルカリ金属酸化物及び酸化鉛を実質的
に含有しないことを特徴としている。Furthermore, the present invention is characterized in that, in addition to limiting each component of the glass composition as described above, the glass composition does not substantially contain alkali metal oxides and lead oxide.
実施例 次に、本発明のガラス組成物の実施例を示す。Example Next, examples of the glass composition of the present invention will be shown.
表のＡｌ〜１０のガラス試料は、次のように調製した。Glass samples of Al to 10 in the table were prepared as follows.
試料＆１〜１０の各ガラス組成になるように調合した原
料バッチを白金ルツボ内で１５５０℃にて１６時間溶融
した後、カーボン板上に流し出して板状に成形した。こ
のようにして得られた板状ガラスを使うて次の方法にて
各特性を測定した。歪点は、ＡＳＴＭ ０−３３６によ
って、また１０＆５ボイズのガラス粘度の特性は白金球
引き上げ法によって測定した。液相温度は２９５−４９
５ノのガラス粒子を白金ボートに入れ、温度勾配炉で１
６時間保持した後、結晶が析出した上限の温度を読みと
りだ。耐酸性は、鏡面研磨したガラスを８０℃１０容量
％塩酸水溶液に３時間浸漬し、ガラス表面の荒れ状態を
５段階評価で判定した。評価点の大きい方が耐酸性が良
い。Raw material batches prepared to have the respective glass compositions of Samples &1 to 10 were melted in a platinum crucible at 1550° C. for 16 hours, and then poured onto a carbon plate and formed into a plate shape. Using the plate glass thus obtained, various properties were measured in the following manner. Strain point was measured according to ASTM 0-336, and glass viscosity properties of 10 & 5 voids were measured by platinum ball pulling method. Liquidus temperature is 295-49
5 pieces of glass particles were placed in a platinum boat and 1 piece was placed in a temperature gradient furnace.
After holding for 6 hours, read the upper temperature limit at which crystals precipitated. Acid resistance was determined by immersing mirror-polished glass in a 10% by volume aqueous hydrochloric acid solution at 80° C. for 3 hours, and evaluating the roughness of the glass surface on a five-point scale. The higher the evaluation score, the better the acid resistance.
この結果、得られたガラスは、歪点が６６０℃以上と高
く、液相温度における粘度もｌＯ′。ボイズ以上であり
、耐酸性、溶融性にも優れていた。As a result, the resulting glass has a high strain point of 660°C or higher, and a viscosity of 1O' at the liquidus temperature. It was higher than the voids and had excellent acid resistance and meltability.
発明の効果
以上のように本発明のガラス組成物は、６００℃以上の
熱処理に耐え、成膜された半導体物質膜や透明導電膜を
劣化するアルカリ金属酸化物あるいは環境面で問題とな
る酸化鉛を含有せず、耐酸性、溶融性、耐失透性に侵れ
ている上、大量生産ができるもので、各種基板用ガラス
を始め、広範な用途に利用できる。Effects of the Invention As described above, the glass composition of the present invention can withstand heat treatment at temperatures of 600°C or higher, and is free from alkali metal oxides that degrade the formed semiconductor material film and transparent conductive film, and lead oxide, which is an environmental problem. It contains no substances, has good acid resistance, meltability, and devitrification resistance, and can be mass-produced, so it can be used for a wide range of applications, including glass for various substrates.
特許出願人 日本電気硝子株式会社 代表者 長 崎 準 −Patent applicant: Nippon Electric Glass Co., Ltd. Representative Jun Nagasaki -
Claims (5)
＿２５４〜６０％ Ａｌ＿２Ｏ＿３１４〜１８％Ｂ＿２
Ｏ＿３２〜７％ ＭｇＯ６．５〜１２％ＣａＯ５〜９％
ＺｎＯ０〜３％ ＢａＯ２〜８％ Ｐ＿２Ｏ＿５０〜
３％ ＴｉＯ＿２０〜３％の組成を有することを特徴と
するガラス組成物。(1) The strain point is 650°C or higher, and the weight percentage is SiO
_254~60% Al_2O_314~18%B_2
O_32-7% MgO6.5-12% CaO5-9%
ZnO0~3% BaO2~8% P_2O_50~
A glass composition characterized in that it has a composition of 3% TiO_20-3%.
＿２５４〜５７％ Ａｌ＿２Ｏ＿３１５〜１７％Ｂ＿２
Ｏ＿３４〜７％ ＭｇＯ６．５〜９％ＣａＯ７〜９％
ＺｎＯ０〜３％ ＢａＯ３〜７％ Ｐ＿２Ｏ＿５０〜３
％ ＴｉＯ＿２０〜３％の組成を有し、（ＭｇＯ＋Ｃａ
Ｏ）／ＳｉＯ＿２＝０．２６〜０．３２、ＭｇＯ／Ｃａ
Ｏ＝０．７２〜１．１０であることを特徴とする特許請
求の範囲（１）に記載のガラス組成物(2) The strain point is 650°C or higher, and the weight percentage is SiO
_254~57% Al_2O_315~17%B_2
O_34~7% MgO6.5~9% CaO7~9%
ZnO0~3% BaO3~7% P_2O_50~3
%TiO_20-3% composition, (MgO+Ca
O)/SiO_2=0.26-0.32, MgO/Ca
The glass composition according to claim (1), characterized in that O=0.72 to 1.10.
＿２５４．５〜５６．５％ Ａｌ＿２Ｏ＿３１６〜１７
％Ｂ＿２Ｏ＿３４．５〜６．５％ ＭｇＯ７〜８．５％
ＣａＯ７〜９％ ＺｎＯ１〜３％ ＢａＯ３〜７％ Ｐ
＿２Ｏ＿５０〜２％ ＴｉＯ＿２０〜２％の組成を有し
、（ＭｇＯ＋ＣａＯ）／ＳｉＯ＿２＝０．２６〜０．３
２、ＭｇＯ／ＣａＯ＝０．８０〜１．００であることを
特徴とする特許請求の範囲（１）に記載のガラス組成物
。(3) The strain point is 670°C or higher, and the weight percentage is SiO
_254.5~56.5% Al_2O_316~17
%B_2O_34.5~6.5% MgO7~8.5%
CaO7-9% ZnO1-3% BaO3-7% P
_2O_50~2% TiO_20~2% composition, (MgO+CaO)/SiO_2=0.26~0.3
2. The glass composition according to claim (1), wherein MgO/CaO=0.80 to 1.00.
ない特許請求の範囲（１）乃至（３）に記載のガラス組
成物。(4) The glass composition according to claims (1) to (3), which does not substantially contain an alkali metal oxide and lead oxide.
囲（１）乃至（３）に記載のガラス組成物。(5) The glass composition according to claims (1) to (3), which is used as a glass for various substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25481984A JPS61132536A (en) | 1984-12-01 | 1984-12-01 | Glass composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25481984A JPS61132536A (en) | 1984-12-01 | 1984-12-01 | Glass composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61132536A true JPS61132536A (en) | 1986-06-20 |
Family
ID=17270311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25481984A Pending JPS61132536A (en) | 1984-12-01 | 1984-12-01 | Glass composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61132536A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH039944U (en) * | 1989-06-16 | 1991-01-30 | ||
| EP0714862A1 (en) | 1994-11-30 | 1996-06-05 | Asahi Glass Company Ltd. | Alkali-free glass and flat panel display |
| US6060168A (en) * | 1996-12-17 | 2000-05-09 | Corning Incorporated | Glasses for display panels and photovoltaic devices |
| DE19916296C1 (en) * | 1999-04-12 | 2001-01-18 | Schott Glas | Alkali-free aluminoborosilicate glass and its use |
| DE10000839C1 (en) * | 2000-01-12 | 2001-05-10 | Schott Glas | Alkali-free aluminoborosilicate glass used as substrate glass in displays and in thin layer photovoltaics contains oxides of silicon, boron, aluminum, magnesium, calcium, strontium, barium and zinc |
| DE10000837C1 (en) * | 2000-01-12 | 2001-05-31 | Schott Glas | Alkali-free alumino-borosilicate glass used as substrate glass in thin film transistor displays and thin layer solar cells contains oxides of silicon, boron, aluminum, magnesium, strontium, and barium |
| JP2002220255A (en) * | 2001-01-22 | 2002-08-09 | Asahi Glass Co Ltd | Lead-free glass, electronic circuit board composition, and the electronic circuit board |
| JP2012121738A (en) * | 2010-12-06 | 2012-06-28 | Nippon Electric Glass Co Ltd | Non-alkali glass |
-
1984
- 1984-12-01 JP JP25481984A patent/JPS61132536A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH039944U (en) * | 1989-06-16 | 1991-01-30 | ||
| EP0714862A1 (en) | 1994-11-30 | 1996-06-05 | Asahi Glass Company Ltd. | Alkali-free glass and flat panel display |
| US6060168A (en) * | 1996-12-17 | 2000-05-09 | Corning Incorporated | Glasses for display panels and photovoltaic devices |
| USRE38959E1 (en) * | 1996-12-17 | 2006-01-31 | Corning Incorporated | Glasses for display panels and photovoltaic devices |
| USRE41127E1 (en) * | 1996-12-17 | 2010-02-16 | Corning Incorporated | Glasses for display panels and photovoltaic devices |
| DE19916296C1 (en) * | 1999-04-12 | 2001-01-18 | Schott Glas | Alkali-free aluminoborosilicate glass and its use |
| DE10000839C1 (en) * | 2000-01-12 | 2001-05-10 | Schott Glas | Alkali-free aluminoborosilicate glass used as substrate glass in displays and in thin layer photovoltaics contains oxides of silicon, boron, aluminum, magnesium, calcium, strontium, barium and zinc |
| DE10000837C1 (en) * | 2000-01-12 | 2001-05-31 | Schott Glas | Alkali-free alumino-borosilicate glass used as substrate glass in thin film transistor displays and thin layer solar cells contains oxides of silicon, boron, aluminum, magnesium, strontium, and barium |
| US6671026B2 (en) | 2000-01-12 | 2003-12-30 | Schott Glas | Flat panel liquid-crystal display such as for a laptop computer |
| US6867158B2 (en) | 2000-01-12 | 2005-03-15 | Schott Glas | Flat panel liquid-crystal display such as for a laptop computer |
| JP2002220255A (en) * | 2001-01-22 | 2002-08-09 | Asahi Glass Co Ltd | Lead-free glass, electronic circuit board composition, and the electronic circuit board |
| JP2012121738A (en) * | 2010-12-06 | 2012-06-28 | Nippon Electric Glass Co Ltd | Non-alkali glass |
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