JPS6112564U - soldering equipment - Google Patents

soldering equipment

Info

Publication number
JPS6112564U
JPS6112564U JP9721284U JP9721284U JPS6112564U JP S6112564 U JPS6112564 U JP S6112564U JP 9721284 U JP9721284 U JP 9721284U JP 9721284 U JP9721284 U JP 9721284U JP S6112564 U JPS6112564 U JP S6112564U
Authority
JP
Japan
Prior art keywords
soldering equipment
circuit board
printed circuit
soldering device
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9721284U
Other languages
Japanese (ja)
Inventor
雄二 山田
利弘 坂村
修三 川嶋
恒雄 城月
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP9721284U priority Critical patent/JPS6112564U/en
Publication of JPS6112564U publication Critical patent/JPS6112564U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案一実施例による半田付け装置を示す図、
第２図は本考案他の実施例による半田付け装置を示す図
。 図中、１，１１・・・・・・槽、２，１２・曲・溶融半
田供給部、３，１３・・・・・・半田溶解部、２’，３
’，１２’，１３’・・・・・・ヒーター、４，１４・
・・・・・タンク、４’，１４’・・・・・・液体、５
・・・・・・プリント基板、６，１６・・・・・・プリ
ント基板搬送手段、７・・・・・・入口部、８・・・・
・・出口部、９・・・・・・天井部、７／，３／，９／
，９・・・・・・冷却パイプ。FIG. 1 is a diagram showing a soldering device according to an embodiment of the present invention;
FIG. 2 is a diagram showing a soldering device according to another embodiment of the present invention. In the figure, 1, 11...tank, 2, 12, curved/molten solder supply section, 3, 13... solder melting section, 2', 3
', 12', 13'... Heater, 4, 14.
... Tank, 4', 14' ... Liquid, 5
...Printed circuit board, 6,16...Printed circuit board conveyance means, 7...Entrance section, 8...
...Exit part, 9...Ceiling part, 7/, 3/, 9/
, 9... Cooling pipe.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板に搭載される電子部品の半田付け装置にお
いて、デイツプ方式の溶融半田供給部と、ベーバ潜熱に
よる半田溶解部とを同一槽内に具備したことを特徴とす
る半田付け装置。A soldering device for electronic components mounted on a printed circuit board, characterized in that a dip-type molten solder supply section and a solder melting section using Beber latent heat are provided in the same tank.
JP9721284U 1984-06-28 1984-06-28 soldering equipment Pending JPS6112564U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9721284U JPS6112564U (en) 1984-06-28 1984-06-28 soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9721284U JPS6112564U (en) 1984-06-28 1984-06-28 soldering equipment

Publications (1)

Publication Number Publication Date
JPS6112564U true JPS6112564U (en) 1986-01-24

Family

ID=30656746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9721284U Pending JPS6112564U (en) 1984-06-28 1984-06-28 soldering equipment

Country Status (1)

Country Link
JP (1) JPS6112564U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112243A (en) * 1974-06-05 1978-09-30 Western Electric Co Article welding apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112243A (en) * 1974-06-05 1978-09-30 Western Electric Co Article welding apparatus

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